US4450267A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Latent curing agents for epoxy resins
Assignee: Ajinomoto Co Inc
•
Filing: 1983-01-19
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Granted: 1984-05-22
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Expires: 2003-01-19
Abstract
Abstract Hydrazides of the formula ##STR1## are good curing agents for epoxy resin, wherein in the formula, X is an aromatic hydrocarbon residue of dihydric phenol, ##STR2## The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.
Inventors
- 👤 Nobuo Ito
- 👤 Koji Takeuchi
- 👤 Masahiro Abe
- 👤 Tsuneo Ishiguro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:26
CPC Classifications
C; C07; C07C; C07C243/00; C07C255/00; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4035
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
18 words
A compound having the formula ##STR20## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR21##
Claim 2
Dependent Claim
18 words
A compound having the formula ##STR20## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR21##
Claim 3
Dependent Claim
26 words
The compound claimed in claim 1, wherein X is a residue derived from a dihydric phenol selected from the group consisting of catechol, resorcinol and hydroquinone.
Claim 4
Dependent Claim
10 words
The compound claimed in claim 1, wherein X is ##STR22##
Claim 5
Dependent Claim
10 words
The compound claimed in claim 1, wherein X is ##STR23##
Claim 6
Dependent Claim
44 words
A curable epoxy resin composition comprising (a) an epoxy resin having an average of more than one epoxy group per molecule and (b), as curing agent, a compound having the formula ##STR24## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR25##
Claim 7
Dependent Claim
44 words
A curable epoxy resin composition comprising (a) an epoxy resin having an average of more than one epoxy group per molecule and (b), as curing agent, a compound having the formula ##STR24## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR25##
Claim 8
Dependent Claim
30 words
The curable epoxy resin composition claimed in claim 5 wherein the amount of said compound is enough to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
Claim 9
Dependent Claim
13 words
The curable epoxy resin composition claimed in claim 5, wherein X is ##STR26##
Claim 10
Dependent Claim
21 words
The curable epoxy resin composition claimed in claim 5, wherein said epoxy resin is a polyglycidyl ether of a polyhydric phenol.
Claim 11
Dependent Claim
62 words
A cured resin obtained by contacting an epoxy resin having an average of more than 1 epoxy group per molecule with as curing agent a compound having the formula ##STR27## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR28## the amount of said compound being enough to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
Claim 12
Dependent Claim
62 words
A cured resin obtained by contacting an epoxy resin having an average of more than 1 epoxy group per molecule with as curing agent a compound having the formula ##STR27## wherein X is an aromatic hydrocarbon residue of a dihydric phenol, ##STR28## the amount of said compound being enough to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
Claim 13
Independent Claim
56 words
A method of curing an epoxy resin composition, which comprises: mixing a compound having the formula: ##STR29## wherein X is an aromatic residue of a dihydric phenol, ##STR30## with said epoxy resin composition to give a curable epoxy resin composition, and heating said curable epoxy resin composition to a temperature of no more than 150° C.
Claim 14
Independent Claim
56 words
A method of curing an epoxy resin composition, which comprises: mixing a compound having the formula: ##STR29## wherein X is an aromatic residue of a dihydric phenol, ##STR30## with said epoxy resin composition to give a curable epoxy resin composition, and heating said curable epoxy resin composition to a temperature of no more than 150° C.
Claim 15
Dependent Claim
12 words
The method of claim 10, wherein said heating is to 120°-140° C.
Claim 16
Dependent Claim
9 words
The method of claim 10, wherein X is ##STR31##
Claim 17
Dependent Claim
9 words
The method of claim 11, wherein X is ##STR32##
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-22 | 1987-11-21 | 1988-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-22 | 1991-11-21 | 1992-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-22 | 1995-11-21 | 1996-05-22 | $7700.00 | Window Closed / Lapsed |