US4450190A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for sensitizing articles for metallization and resulting articles
Assignee: MECHATRONICS LLC
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Filing: 1979-10-01
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Granted: 1984-05-22
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Expires: 1999-10-01
Abstract
Abstract Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.
Inventors
- 👤 Francis J. Nuzzi
- 👤 Edward J. Leech
- 👤 Richard W. Charm
- 👤 Joseph Polichette
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:39
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1889
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
138 words
A process for the electroless deposition of metal on a non-metallic surface, said process comprising the steps of: (a) pre-sensitizing the non-metallic surface to the electroless deposition of metal by contacting said non-metallic surface with a liquid medium comprising an admixture of a polar liquid, a halide, cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions of at least 0.4:1; (b) Rinsing said contacted surface with an aqueous solution and forming an adherent water-insoluble derivative of said liquid medium adsorbed on said non-metallic surface; (c) treating said rinsed surface with an electroless metal deposition bath containing a reducing agent to render said insoluble derivative catalytic to the electroless deposition of metal; and (d) contacting said catalytically sensitive surface with an electroless metal deposition bath to form an electroless deposit of metal thereon.
Claim 2
Dependent Claim
138 words
A process for the electroless deposition of metal on a non-metallic surface, said process comprising the steps of: (a) pre-sensitizing the non-metallic surface to the electroless deposition of metal by contacting said non-metallic surface with a liquid medium comprising an admixture of a polar liquid, a halide, cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions of at least 0.4:1; (b) Rinsing said contacted surface with an aqueous solution and forming an adherent water-insoluble derivative of said liquid medium adsorbed on said non-metallic surface; (c) treating said rinsed surface with an electroless metal deposition bath containing a reducing agent to render said insoluble derivative catalytic to the electroless deposition of metal; and (d) contacting said catalytically sensitive surface with an electroless metal deposition bath to form an electroless deposit of metal thereon.
Claim 3
Dependent Claim
27 words
A process according to claim 1, wherein said reducing agent includes at least one member selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate.
Claim 4
Dependent Claim
14 words
A process according to claim 1, wherein said liquid medium also contains a stabilizer.
Claim 5
Dependent Claim
15 words
A process according to claim 1, wherein said liquid medium also contains a wetting agent.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-22 | 1987-11-21 | 1988-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-22 | 1991-11-21 | 1992-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-22 | 1995-11-21 | 1996-05-22 | $7700.00 | Window Closed / Lapsed |