US4450024A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Identification card with an IC-module and method for producing it
Assignee: GAO Gesellschaft fuer Automation und Organisation mbH
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Filing: 1981-07-30
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Granted: 1984-05-22
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Expires: 2001-07-30
Abstract
Abstract An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier element is subjected to the full laminating pressure only when one or more layers in the card construction have softened. This is achieved, for example, by providing buffer zones in the card laminate at least in the area of the arrangement in the form of cavities or layers that are easy to deform elastically. The buffer zones protect the arrangement from local pressure peaks in the initial phase of the laminating process. It is also possible to control the laminating pressure as a function of the temperature or the degree of softening of the card layers.
Inventors
- 👤 Yahya Haghiri-Tehrani
- 👤 Joachim Hoppe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 17:08
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; B; B32; B32B; B32B27/00; B32B27/06; B32B27/08; B32B27/10; B32B27/30; B32B27/304; B32B27/32; G06K19/07745; B32B2425/00; Y; Y10; Y10S; Y10S283/00; Y10S283/904; Y10S428/00; Y10S428/901; Y10S428/916; Y10T; Y10T428/00; Y10T428/22; Y10T428/23; Y10T428/239; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24802; Y10T428/24851; Y10T428/24868
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
178 words
A method for producing a multi-layer identification card having an IC-module for processing electrical signals, the IC-module with its connection leads being arranged on a separate carrier element that is small relative to the identification card, said method avoiding localized pressures on the carrier element during production of the card and comprising the steps of: providing an identification card assembly including an internal layer having a recess for the carrier element and at least one covering layer heat sealable to the internal layer, at least one of said layers being thermally softenable; inserting the carrier element in the recess; before or after inserting the carrier element in the recess, establishing a buffer proximate to the carrier element for limiting the application of force to the carrier element prior to thermal softening of the card layer; and applying heat and pressure to the identification card assembly to heat seal the layers together, said buffer limiting the application of force to the carrier element prior to softening of the thermally softenable layer to avoid localized pressure on the carrier element.
Claim 2
Independent Claim
178 words
A method for producing a multi-layer identification card having an IC-module for processing electrical signals, the IC-module with its connection leads being arranged on a separate carrier element that is small relative to the identification card, said method avoiding localized pressures on the carrier element during production of the card and comprising the steps of: providing an identification card assembly including an internal layer having a recess for the carrier element and at least one covering layer heat sealable to the internal layer, at least one of said layers being thermally softenable; inserting the carrier element in the recess; before or after inserting the carrier element in the recess, establishing a buffer proximate to the carrier element for limiting the application of force to the carrier element prior to thermal softening of the card layer; and applying heat and pressure to the identification card assembly to heat seal the layers together, said buffer limiting the application of force to the carrier element prior to softening of the thermally softenable layer to avoid localized pressure on the carrier element.
Claim 3
Dependent Claim
52 words
The method as in claim 1 wherein the step of establishing the buffer is further defined as forming the recess in the internal layer of the identification card assembly to provide spacing between at least one of the layers and the carrier element prior to the softening of the thermally softenable layer.
Claim 4
Dependent Claim
44 words
A method as in claim 2 wherein the step of establishing the buffer is further defined as providing an additional card layer intermediate the internal layer and covering layer having a lower thermal softening point than that of the covering layer or internal layer.
Claim 5
Dependent Claim
39 words
A method as in claim 2 wherein the step of establishing the buffer is further defined as at least partially encasing the carrier element in a material having a thermal softening point lower than that of the covering layer.
Claim 6
Dependent Claim
37 words
A method as in claim 1 wherein the step of establishing the buffer is further defined as providing an elastic means intermediate the carrier element and at least one of the layers to which pressure is applied.
Claim 7
Dependent Claim
28 words
A method as in claim 5 wherein the step of establishing the buffer is further defined as at least partially encasing the carrier element in an elastic material.
Claim 8
Dependent Claim
30 words
A method as in claim 5 wherein the step of establishing the buffer is further defined as forming the buffer by incorporating an elastic layer in the identification card assembly.
Claim 9
Dependent Claim
37 words
A method as in claim 5 further defined as providing an elastic means intermediate the carrier element and layer that has a higher degree of elasticity in the unheated state than the layers of the card assembly.
Claim 10
Dependent Claim
25 words
A method as in claim 1 further defined as controlling the pressure applied to the assembly as a function of the temperature of the assembly.
Claim 11
Dependent Claim
29 words
A method as in claim 1 further defined as controlling the pressure applied to the assembly as a function of the amount of softening of the thermally softenable layer.
Claim 12
Dependent Claim
24 words
A method as in claim 2 further defined as applying the heat to the identification card assembly and thereafter applying pressure to the assembly.
Claim 13
Dependent Claim
32 words
A method as in claim 7 wherein the step of establishing the buffer is further defined as forming the buffer as an elastic coating on one of the layers of the card.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-22 | 1987-11-21 | 1988-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-22 | 1991-11-21 | 1992-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-22 | 1995-11-21 | 1996-05-22 | $7700.00 | Window Closed / Lapsed |