US4449011A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for encapsulation of chemically sensitive field effect device
Assignee: Ethicon Inc
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Filing: 1982-01-08
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Granted: 1984-05-15
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Expires: 2002-01-08
Abstract
Abstract Semiconductor chips carrying chemically sensitive field effect devices are encapsulated by tape automated bonding techniques, wherein one tape layer has a beam lead pattern disposed thereon which terminates in the chip bonding pad pattern over an opening in the tape. A tape layer for sealably covering the beam lead pattern and the chip has openings which are respectively coincident with the chemically selective membrane systems of the field effect devices.
Inventors
- 👤 Jiri Kratochvil
- 👤 Nelson Ho
- 👤 Jiri Janata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 13:49
CPC Classifications
G; G01; G01N; G01N27/00; G01N27/26; G01N27/403; G01N27/414
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
169 words
For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising: tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems; wherein said tape means comprises respective first and second tapes, said first tape carrying said beam leads and said second tape defining a second opening coincident with the first ends of said beam leads, said first tape further defining said first openings; said tape means sealably overlaying at least said beam leads; whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.
Claim 2
Dependent Claim
169 words
For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising: tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems; wherein said tape means comprises respective first and second tapes, said first tape carrying said beam leads and said second tape defining a second opening coincident with the first ends of said beam leads, said first tape further defining said first openings; said tape means sealably overlaying at least said beam leads; whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.
Claim 3
Dependent Claim
18 words
An encapsulation system as described in claim 1 wherein said means to sealably overlay comprises a third tape.
Claim 4
Dependent Claim
27 words
An encapsulation system as described in claim 1 wherein said first and second tapes are respectively oppositely facing members and are substantially nonreactive to said ambient substances.
Claim 5
Dependent Claim
201 words
For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising: tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems; wherein said tape means defines second openings coincident with the first ends of said beam leads for affixation of said beam leads and carries said beam leads on a lower side for facing said chip, said tape means defining an outer hermetic seal for said device except for said openings; and wherein said system further comprises sealing means for oppositely facing said lower side, said beam leads and a back side of said device; said tape means sealably overlaying at least said beam leads; whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.
Claim 6
Dependent Claim
201 words
For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising: tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems; wherein said tape means defines second openings coincident with the first ends of said beam leads for affixation of said beam leads and carries said beam leads on a lower side for facing said chip, said tape means defining an outer hermetic seal for said device except for said openings; and wherein said system further comprises sealing means for oppositely facing said lower side, said beam leads and a back side of said device; said tape means sealably overlaying at least said beam leads; whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-15 | 1987-11-14 | 1988-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-15 | 1991-11-14 | 1992-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-15 | 1995-11-14 | 1996-05-15 | $7700.00 | Window Closed / Lapsed |