US4447720A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid-state image pickup element and process for fabricating the same
Assignee: Panasonic Holdings Corp
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Filing: 1982-07-15
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Granted: 1984-05-08
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Expires: 2002-07-15
Abstract
Abstract A highly sensitive and high-density picture element solid-state image pickup element. The image pickup element includes a picture element portion formed on a semiconductor wafer, a driving circuit for driving the picture element portion, a photoconductive layer formed on the picture element portion and a transparent electrode formed on the photoconductive layer. On top of the transparent electrode is a layer of photosetting resin and a color filter bonded to the photosetting resin with an adhesive agent having substantially similar or the same composition and optical properties as the photosetting resin.
Inventors
- 👤 Kazufumi Ogawa
- 👤 Takao Chikamura
- 👤 Takuo Shibata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 21:21
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; H; H10; H10F; H10F39/00; H10F39/80; H10F39/802
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
118 words
A solid-state image pickup element comprising: a semiconductor wafer; a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed over said photoconductive layer; a layer of a photosetting resin transparent to visible light formed on said transparent electrode; and a color filter bonded to said photosetting resin with an adhesive agent having optical properties substantially similar to or the same as the optical properties of the photosetting resin.
Claim 2
Dependent Claim
118 words
A solid-state image pickup element comprising: a semiconductor wafer; a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed over said photoconductive layer; a layer of a photosetting resin transparent to visible light formed on said transparent electrode; and a color filter bonded to said photosetting resin with an adhesive agent having optical properties substantially similar to or the same as the optical properties of the photosetting resin.
Claim 3
Dependent Claim
115 words
A solid-state image pickup element comprising a semiconductor wafer, a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed on said photoconductive layer; a layer of a photosetting resin formed over said electrode transparent to visible light; and a color filter bonded to said photosetting resin with an adhesive agent having a substantially similar or the same composition and optical properties as said photosetting resin.
Claim 4
Dependent Claim
115 words
A solid-state image pickup element comprising a semiconductor wafer, a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed on said photoconductive layer; a layer of a photosetting resin formed over said electrode transparent to visible light; and a color filter bonded to said photosetting resin with an adhesive agent having a substantially similar or the same composition and optical properties as said photosetting resin.
Claim 5
Dependent Claim
115 words
A solid-state image pickup element comprising a semiconductor wafer; a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed on said photoconductive layer; a layer of an ultraviolet-ray-setting resin formed over said electrode transparent to visible light; and a color filter bonded to said ultraviolet-ray-setting resin with an adhesive agent having a substantially similar or the same composition and optical properties as said ultraviolet-ray-setting resin.
Claim 6
Dependent Claim
115 words
A solid-state image pickup element comprising a semiconductor wafer; a picture element portion formed over a main surface of said semiconductor wafer for sensing a light image and transferring the electric signals representative of the intensities of the light image at the picture elements; a driving circuit for driving said picture element portion; a photoconductive layer formed over said picture element portion; an electrode transparent to visible light formed on said photoconductive layer; a layer of an ultraviolet-ray-setting resin formed over said electrode transparent to visible light; and a color filter bonded to said ultraviolet-ray-setting resin with an adhesive agent having a substantially similar or the same composition and optical properties as said ultraviolet-ray-setting resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-08 | 1987-11-07 | 1988-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-08 | 1991-11-07 | 1992-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-08 | 1995-11-07 | 1996-05-08 | $7700.00 | Window Closed / Lapsed |