Solid photoresist and method of making photoresist

Claim 2

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes; after laminating the material and substrate, sensitizing the material by wetting with a liquid sensitizer; and drying the sensitized photoresist material.

Claim 3

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate as the sole photoresist material on the foil; after laminating the solid nonsensitized material and substrate, sensitizing the material by wetting with a liquid sensitizer; and drying the sensitized photoresist material.

Claim 4

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate as the sole photoresist material on the foil; after laminating the solid nonsensitized material and substrate, sensitizing the material by wetting with a liquid sensitizer; and drying the sensitized photoresist material.

Claim 5

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being polyvinyl alcohol film.

Claim 6

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being polyvinyl alcohol film.

Claim 7

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a gelatin film.

Claim 8

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a gelatin film.

Claim 9

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, and sensitizing the solid nonsensitized material by wetting with a potassium dichromate water solution.

Claim 10

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, and sensitizing the solid nonsensitized material by wetting with a potassium dichromate water solution.

Claim 11

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate.

Claim 12

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate.

Claim 13

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board, of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a polyvinyl butyral film.

Claim 14

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board, of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a polyvinyl butyral film.

Claim 15

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, and sensitizing the material by wetting with a solution of C 2 H 5 OC 2 H 2 OH and an ammonium dichromate water solution.

Claim 16

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, and sensitizing the material by wetting with a solution of C 2 H 5 OC 2 H 2 OH and an ammonium dichromate water solution.

Claim 17

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate/ethylene copolymer.

Claim 18

A photoresist process in the production of a printed circuit board including the steps of: attaching a metal foil onto an insulator board to form a substrate; producing holes through the foil and board of the substrate; and laminating a continuous homogenous and self-supporting single layer thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, onto the foil side of the substrate covering the holes without introducing the material into the holes, said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate/ethylene copolymer.

Claim 19

A process as defined in claim 1 including the steps of: exposing the sensitized photoresist material to a pattern of radiation; and then developing the sensitized photoresist material to leave a pattern of photoresist material on the substrate.

Claim 20

A process as defined in claim 10 including the steps of: treating the substrate not covered by the photoresist material; and then removing the remaining photoresist material.

Claim 21

A process as defined in claim 9 including the steps of: after applying the solid nonsensitized material, sensitizing the material by wetting with a liquid sensitizer; and drying the sensitized material.

Claim 22

A process as defined in claim 9 including laminating the solid nonsensitized material and substrate by wetting at least one of the material and substrate and then passing the layer of material and substrate between pressure rollers.

Claim 23

A process as defined in claim 9 including laminating another layer of solid nonsensitized material onto the other side of the substrate.

Claim 24

A process as defined in claim 3 including sensitizing the solid nonsensitized material by wetting with an ammonium dichromate water solution.

Claim 25

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said nonsensitized material being a polyvinyl alcohol film.

Claim 26

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said nonsensitized material being a polyvinyl alcohol film.

Claim 27

The product of claim 16 including a second layer of said solid nonsensitized material laminated on the other side of said substrate.

Claim 28

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a gelatin film.

Claim 29

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a gelatin film.

Claim 30

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate/ethylene copolymer.

Claim 31

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate/ethylene copolymer.

Claim 32

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate.

Claim 33

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a mixture of polyvinyl alcohol and polyvinyl acetate.

Claim 34

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a polyvinyl butyral film.

Claim 35

A photoresist product for a printed circuit board, including in combination: an insulator board with a flat surface; a metal foil on said flat surface of said board forming a printed circuit board substrate; said board and foil of said substrate having a plurality of holes therethrough; and a single self supporting continuous homogenous layer in a thin film of a solid nonsensitized material which is capable of being sensitized to a photoresist, laminated on the foil side of said substrate for use in forming a protective pattern on the substrate as the sole photoresist material on said foil, with no additional layer or layers of photoresist material on said continuous film; said continuous film covering said holes without introducing material into said holes, and said solid nonsensitized material being a polyvinyl butyral film.