Method and apparatus for producing a premolded packaging

Claim 1

A package for supporting and interconnecting integrated circuit chips of the leadless type, said package being formed by the steps of: forming first and second webs of conductive material; stamping said webs to form ladders of terminals in a high density array of parallel spaced apart terminals; molding first package portions on opposite ends of said terminals of said first web; cutting said terminals substantially centrally of the ends and forming them with respect to said first package portions; overlying said second web of terminals transversely to said first web and between said first package portions; molding second package portions on opposite ends of said terminals of said second web with said second package portions integrally joining said first portions; cutting said second terminals substantially centrally of their ends and forming them with respect to said second package portions; and separating said package from said webs.

Claim 4

A method for forming a package for leadless integrated circuit chips comprising the steps of: forming first and second webs of terminals from conductive materials with the terminals being in the form of a plurality of parallel spaced terminals extending transversely across the web in a ladder like configuration joined at their ends by carrier strips; forming a partial package in a first molding operation by molding first housing members at opposite ends of the terminals of said first web; cutting the terminals of the first web substantially centrally of their ends and forming them with respect to said first housing members; overlying said second web of terminals transversely with respect to said first web and between said first housing members; molding second housing members on opposite ends of said second terminals and integrally joining said first housing portions; cutting said terminals of said second web substantially centrally of their ends and forming them with respect to said second housing members; and cutting said formed package from said carrier strips.

Claim 5

A method for forming a package for leadless integrated circuit chips comprising the steps of: forming first and second webs of terminals from conductive materials with the terminals being in the form of a plurality of parallel spaced terminals extending transversely across the web in a ladder like configuration joined at their ends by carrier strips; forming a partial package in a first molding operation by molding first housing members at opposite ends of the terminals of said first web; cutting the terminals of the first web substantially centrally of their ends and forming them with respect to said first housing members; overlying said second web of terminals transversely with respect to said first web and between said first housing members; molding second housing members on opposite ends of said second terminals and integrally joining said first housing portions; cutting said terminals of said second web substantially centrally of their ends and forming them with respect to said second housing members; and cutting said formed package from said carrier strips.