US4445109A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Temperature sensing device
Assignee: Denso Corp
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Filing: 1982-02-04
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Granted: 1984-04-24
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Expires: 2002-02-04
Abstract
Abstract Temperature sensing device which has a temperature sensing part including a microchip thermistor in the form not greater than a very small thin piece having a volume of 2 mm 3 as a temperature sensing element. The temperature sensing part is connected to an external circuit to which a temperature sense signal is to be transmitted, by lead wires, and the microchip thermistor is connected to the lead wires through fine lead wires having a wire diameter not greater than 0.5 mm.
Inventors
- 👤 Masanori Naganoma
- 👤 Norio Maehara
- 👤 Masao Sakurai
- 👤 Minoru Hashimoto
- 👤 Kiyoshi Usami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:48
CPC Classifications
G; G01; G01K; G01K7/00; G01K7/16; G01K7/22; B; B60; B60H; B60H1/00; B60H1/00642; B60H1/00735; B60H1/00792
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
116 words
A temperature sensing device, comprising: a temperature sensing part including a microchip thermistor in the form of a very small thin piece having a volume not greater than 2 mm 3 ; first lead wires formed by fine wires of a diameter not greater than 0.5 mm and having one end of each thereof connected to said microchip thermistor in said temperature sensing part; second lead wires having ends thereof connected respectively to the other ends of said first lead wires, thereby connecting said temperature sensing part to an external electric circuit; and an integral coating of resin applied in part to said microchip thermistor, said fine lead wires and said external circuit connection lead wires.
Claim 2
Dependent Claim
116 words
A temperature sensing device, comprising: a temperature sensing part including a microchip thermistor in the form of a very small thin piece having a volume not greater than 2 mm 3 ; first lead wires formed by fine wires of a diameter not greater than 0.5 mm and having one end of each thereof connected to said microchip thermistor in said temperature sensing part; second lead wires having ends thereof connected respectively to the other ends of said first lead wires, thereby connecting said temperature sensing part to an external electric circuit; and an integral coating of resin applied in part to said microchip thermistor, said fine lead wires and said external circuit connection lead wires.
Claim 3
Dependent Claim
21 words
A device according to claim 1, wherein, each of said fine lead wire has a length not shorter than 5 mm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-04-24 | 1987-10-24 | 1988-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-04-24 | 1991-10-24 | 1992-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-04-24 | 1995-10-24 | 1996-04-24 | $7700.00 | Window Closed / Lapsed |