US4439727A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low capacitance pad for semiconductor chip testing
Assignee: International Business Machines Corp
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Filing: 1981-12-21
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Granted: 1984-03-27
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Expires: 2001-12-21
Abstract
Abstract A low capacitance pad structure is disclosed for testing a semiconductor chip, so as to enable the accurate measurement of rise times and delays in internal logic circuitry. The structure provides a capacitive coupling between the internal logic circuit under test and the capacitance of the probe connected to the input/output pad of the chip. This is achieved by inserting a coupling capacitance between the internal logic circuit and the input/output pad. The coupling capacitance is formed by providing a thin dielectric layer on top of an enlarged plate portion of the conductor line connected to the output of the internal logic circuit under test, so as to capacitively couple voltage swings on the line to a second level plate which forms the electrode to be contacted by the test probe. The capacitively coupled output pad enables the accurate characterization of the rise times and delay times of internal logic circuitry on an integrated circuit semiconductor chip, which would not be otherwise conveniently measurable.
Inventors
- 👤 David H. Boyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:35
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06766
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
141 words
A capacitively coupled contact pad on a large scale integrated circuit chip, comprising: a semiconductor substrate including a circuit network having an input/output node, said substrate having a first insulating layer deposited thereon as part of said chip; a lower conductive plate formed on the surface of said first insulating layer as part of said chip and in conductive contact with said node; a second insulating layer deposited on said lower plate as part of said chip; an upper conductive plate formed on the surface of said second insulating layer as part of said chip and juxtaposed with said lower plate, said second insulating layer forming a dielectric medium through which said upper plate is capacitively coupled with said lower plate; whereby input/output signals can be transferred between said upper and lower plates by capacitively coupling through said second insulating layer.
Claim 2
Dependent Claim
141 words
A capacitively coupled contact pad on a large scale integrated circuit chip, comprising: a semiconductor substrate including a circuit network having an input/output node, said substrate having a first insulating layer deposited thereon as part of said chip; a lower conductive plate formed on the surface of said first insulating layer as part of said chip and in conductive contact with said node; a second insulating layer deposited on said lower plate as part of said chip; an upper conductive plate formed on the surface of said second insulating layer as part of said chip and juxtaposed with said lower plate, said second insulating layer forming a dielectric medium through which said upper plate is capacitively coupled with said lower plate; whereby input/output signals can be transferred between said upper and lower plates by capacitively coupling through said second insulating layer.
Claim 3
Dependent Claim
158 words
A capacitively coupled testing pad on a large scale integrated circuit chip, comprising; a semiconductor substrate including a circuit network having a node to be tested, said substrate having a first insulating layer deposited thereon as part of said chip; a lower conductive plate formed on the surfact of said first insulating layer as part of said chip and in conductive contact with said node; a second insulating layer deposited on said lower plate as part of said chip; an upper conductive plate formed on the surface of said second insulating layer as part of said chip, juxtaposed with said lower plate and adapted to contact a test probe connected to a test instrument, said second insulating layer forming a dielectric medium through which said upper plate is capacitively coupled with said lower plate; whereby test signals can be transferred between said test probe and said circuit to be tested by capacitively coupling through said second insulating layer.
Claim 4
Dependent Claim
158 words
A capacitively coupled testing pad on a large scale integrated circuit chip, comprising; a semiconductor substrate including a circuit network having a node to be tested, said substrate having a first insulating layer deposited thereon as part of said chip; a lower conductive plate formed on the surfact of said first insulating layer as part of said chip and in conductive contact with said node; a second insulating layer deposited on said lower plate as part of said chip; an upper conductive plate formed on the surface of said second insulating layer as part of said chip, juxtaposed with said lower plate and adapted to contact a test probe connected to a test instrument, said second insulating layer forming a dielectric medium through which said upper plate is capacitively coupled with said lower plate; whereby test signals can be transferred between said test probe and said circuit to be tested by capacitively coupling through said second insulating layer.
Claim 5
Dependent Claim
52 words
The capacitively coupled testing pad of claim 2, which further comprises: said testing pad being located in the kerf region of a semiconductor wafer, with a conducting line connecting said lower conductive plate to a circuit within a semiconductor chip area adjacent to said kerf region, whose characteristics are to be tested.
Claim 6
Dependent Claim
24 words
The capacitively coupled testing pad of claim 3, which further comprises: said circuit whose characteristics are to be tested being a clock driver circuit.
Claim 7
Dependent Claim
31 words
The capacitively coupled testing pad of claim 4, which further comprises: said clock driver circuit to be tested including actively trimmable elements for adjusting the characteristics of the clock driver circuit.
Claim 8
Dependent Claim
31 words
The capacitively coupled testing pad of claim 5, which further comprises: said actively trimmable elements being thin film resistors which can be trimmed by laser trimming techniques to adjust their resistance.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-03-27 | 1987-09-26 | 1988-03-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-03-27 | 1991-09-26 | 1992-03-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-03-27 | 1995-09-26 | 1996-03-27 | $7700.00 | Window Closed / Lapsed |