← Back to Patent Explorer
US4439261A Expired / Lapsed US ⏱️ 0.0 years remaining

Composite pallet

Assignee: International Business Machines Corp
•
Filing: 1983-08-26
•
Granted: 1984-03-27
•
Expires: 2003-08-26
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Disclosed is a composite pallet for a reactive ion etching system consisting of an upper surface made of an insulative material, such as, silicon having therein a plurality of recessed pockets for holding the wafers to be etched and a bottom surface made of conductive material, such as, aluminum for electrically and thermally communicating the wafers with the cathode. The pallet diameter is larger than that of the cathode, but due to the conductive bottom surface the cathode is effectively extended over the entire pallet diameter. Such an arrangement provides excellent etch uniformity over all portions of the pallet.

Inventors

  • 👤 Peter J. Pavone
  • 👤 Richard D. Van Demark

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 20:35
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432; H10P72/0402; H10P72/0418; H10P72/0421; H10P72/70; H10P72/76; H10P72/7604; H10P72/7618; H10P72/7621

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 100 words
A reactive ion etching system comprising: a vessel; a disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; and a disc-shaped pallet including a top insulating layer for holding a plurality of semiconductor wafers thereon, and a bottom conducting layer, the diameter of said pallet being greater than the diameter of the cathode and said pallet bottom conducting layer being adjacent said cathode and electrically connected thereto, whereby said bottom conducting layer is an extension of said cathode over the entire pallet diameter to achieve uniform reactive ion etching on all portions of the pallet.
Claim 2
Dependent Claim 100 words
A reactive ion etching system comprising: a vessel; a disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; and a disc-shaped pallet including a top insulating layer for holding a plurality of semiconductor wafers thereon, and a bottom conducting layer, the diameter of said pallet being greater than the diameter of the cathode and said pallet bottom conducting layer being adjacent said cathode and electrically connected thereto, whereby said bottom conducting layer is an extension of said cathode over the entire pallet diameter to achieve uniform reactive ion etching on all portions of the pallet.
Claim 3
Dependent Claim 113 words
A reactive ion etching system comprising: a vessel; a disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; a disc-shaped pallet including a top insulating layer for holding a plurality of semiconductor wafers thereon, and a bottom conducting layer, the diameter of said pallet being greater than the diameter of said cathode; and means for conveying said pallet into said vessel and loading said pallet onto said cathode with said bottom conducting layer adjacent said cathode and electrically connected thereto, whereby said bottom conducting layer is an extension of said cathode over the entire pallet's diameter to achieve uniform reactive ion etching on all portions of the pallet.
Claim 4
Dependent Claim 113 words
A reactive ion etching system comprising: a vessel; a disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; a disc-shaped pallet including a top insulating layer for holding a plurality of semiconductor wafers thereon, and a bottom conducting layer, the diameter of said pallet being greater than the diameter of said cathode; and means for conveying said pallet into said vessel and loading said pallet onto said cathode with said bottom conducting layer adjacent said cathode and electrically connected thereto, whereby said bottom conducting layer is an extension of said cathode over the entire pallet's diameter to achieve uniform reactive ion etching on all portions of the pallet.
Claim 5
Dependent Claim 19 words
The reactive ion etching system as recited in claims 1 or 2 wherein said top insulating layer is silicon.
Claim 6
Dependent Claim 19 words
The reactive ion etching system as recited in claims 1 or 2 wherein said bottom conducting layer is aluminum.
Claim 7
Dependent Claim 26 words
The reactive ion etching system as recited in claims 1 or 2 wherein the ratio of said pallets' diameter to said cathode diameter is approximately 1.1.
Claim 8
Dependent Claim 37 words
The reactive ion etching system as recited in claim 5 wherein the ratio of the thickness of the bottom conducting layer to the thickness of the top insulating layer is approximately less than or equal to 1.
Claim 9
Dependent Claim 120 words
A reactive ion etching apparatus comprising: a vessel; a flat disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; a flat disc-shaped metal-silicon composite pallet including a top silicon layer having thereon a plurality of recessed pockets for holding semiconductor wafers, and a bottom conductive metal layer, the diameter of said pallet being greater than the diameter of said cathode; and means for conveying said pallet into said vessel and loading said pallets onto said cathode with said bottom conductive layer adjacent said cathode and electrically connected thereto, whereby said bottom conductive layer is an extension of said cathode over the entire pallets to achieve uniform reactive ion etching on all portion of the pallet.
Claim 10
Dependent Claim 120 words
A reactive ion etching apparatus comprising: a vessel; a flat disc-shaped cathode within said vessel, said cathode being connected to a radio frequency source; a flat disc-shaped metal-silicon composite pallet including a top silicon layer having thereon a plurality of recessed pockets for holding semiconductor wafers, and a bottom conductive metal layer, the diameter of said pallet being greater than the diameter of said cathode; and means for conveying said pallet into said vessel and loading said pallets onto said cathode with said bottom conductive layer adjacent said cathode and electrically connected thereto, whereby said bottom conductive layer is an extension of said cathode over the entire pallets to achieve uniform reactive ion etching on all portion of the pallet.
Claim 11
Dependent Claim 36 words
The reactive ion etching apparatus as recited in claim 7 further comprising a cap-shaped anode enveloping said pallet for establishing a uniform RF electric field and bounding a reaction volume between said pallet and said anode.
Claim 12
Dependent Claim 103 words
A pallet for transporting workpieces into or out of an automated reactive ion etching apparatus and for making electrical contact of said workpieces with the reactive ion etching apparatus cathode during reactive ion etching of said workpieces, said pallet comprising: a flat, disc-shaped electrically insulative face plate of a diameter larger than the diameter of said cathode, said face plate having a plurality of recessed pockets for receiving said workpieces; and an electrically conductive bottom plate of the same diameter as the face plate and securely bonded to said face plate for electrically communicating said workpieces with said cathode during reactive ion etching.
Claim 13
Dependent Claim 103 words
A pallet for transporting workpieces into or out of an automated reactive ion etching apparatus and for making electrical contact of said workpieces with the reactive ion etching apparatus cathode during reactive ion etching of said workpieces, said pallet comprising: a flat, disc-shaped electrically insulative face plate of a diameter larger than the diameter of said cathode, said face plate having a plurality of recessed pockets for receiving said workpieces; and an electrically conductive bottom plate of the same diameter as the face plate and securely bonded to said face plate for electrically communicating said workpieces with said cathode during reactive ion etching.
Claim 14
Dependent Claim 23 words
The pallet is recited in claim 9 wherein said insulative plate is fabricated from silicon and said bottom plate is fabricated from aluminum.
Claim 15
Dependent Claim 26 words
The pallet as recited in claim 10 wherein the thickness ratio of the bottom plate to the face plate is less than or equal to 1.

References Cited (Backward Citations)

US3423303A Cited
US3971684A Cited
US4283249A Cited
US4209357A Cited
US4238312A Cited
US4268374A Cited
US4399016A Cited
US4367114A Cited
US4350578A Cited
US4397724A Cited
US4400235A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-03-27 1987-09-26 1988-03-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-03-27 1991-09-26 1992-03-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-03-27 1995-09-26 1996-03-27 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag