Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates

Claim 2

A photosensitive resin composition for the preparation of a solder resist comprising: (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and and salts thereof, the derivatives of benzotriazole, benzimidazole, and benzothiazole being those obtained by substituting one or more hydrogen atoms in said compounds with one or more alkyl groups, aryl groups, nitro groups, amino groups, hydroxyl groups, carboxyl groups or halogens, (b) an unsaturated organic phosphate compound having photopolymerizable ethylenically unsaturated bonds selected from the group consisting of acid phosphoxyethyl methacrylate, 3-chloro-2-acid phosphoxypropyl methacrylate, bis(methacryloxyethyl)phosphate, acryloxyethyl phosphate, bis(acryloxyethyl)phosphate, bis(2-chloroethyl)vinyl phosphate and 1,2-bis(carboxyallyl)ethyldibutyl phosphate, (c) 20 to 40 parts by weight of a vinyl copolymer, (d) 20 to 80 parts by weight of a photopolymerizable unsaturated compound having at least one terminal ethylene group, and (e) 0.5 to 10 parts by weight of a sensitizer and/or a sensitizer system other than component (a) capable of initiating polymerization of components (b) and (d) upon irradiation of actinic light; the amount of component (a) being about 0.001% by weight or more and the amount of component (b) being about 0.001% by weight or more based on the weight of the photosensitive resin composition.

Claim 3

A composition according to claim 1, wherein the salts of benzotriazole, benzimidazole and benzothiazole are acid salts or amine salts of said compounds.

Claim 4

A composition according to claim 1, wherein the photopolymerizable unsaturated compound having at least one terminal ethylene group of component (d) is an urethane diacrylate or urethane dimethacrylate compound obtained by reacting: (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) an acrylic or methacrylic monoester of a dihydric alcohol, and (iii) a dihydric alcohol.

Claim 5

A composition according to claim 1, wherein the component (a) is hydroxybenzotriazole and the component (b) is acid phosphoxyethyl methacrylate.

Claim 6

A composition according to claim 1, wherein the component (a) is benzimidazole and the component (b) is bis(acryloxyethyl)phosphate.

Claim 7

A composition according to claim 1, wherein the component (a) is benzotriazole hydrochloride and the component (b) is 3-chloro-2-acid phosphoxypropyl methacrylate.

Claim 8

A photosensitive element for the preparation of a solder resist comprising a layer of a photosensitive resin composition comprising: (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, the derivatives of benzotriazole, benzimidazole, and benzothiazole being those obtained by substituting one or more hydrogen atoms in said compounds with one or more alkyl groups, aryl groups, nitro groups, amino groups, hydroxyl groups, carboxyl groups or halogens, (b) an unsaturated organic phosphate compound having photopolymerizable ethylenically unsaturated bonds selected from the group consisting of acid phosphoxyethyl methacrylate, 3-chloro-2-acid phosphoxypropyl methacrylate, bis(acryloxyethyl)phosphate, bis(2-chloroethyl)vinyl phosphate and 1,2-bis(carboxyallyl)ethyldibutyl phosphate, (c) 20 to 40 parts by weight of a vinyl copolymer, (d) 20 to 80 parts by weight of a photopolymerizable unsaturated compound having at least one terminal ethylene group, and (e) 0.5 to 10 parts by weight of a sensitizer and/or a sensitizer system other than component (a) capable of initiating polymerization of components (b) and (d) upon irradiation of actinic light; the amount of component (a) being about 0.001% by weight or more and the amount of component (b) being about 0.001% by weight or more based on the weight of the photosensitive resin composition, and a support film supporting said layer.

Claim 9

A photosensitive element for the preparation of a solder resist comprising a layer of a photosensitive resin composition comprising: (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, the derivatives of benzotriazole, benzimidazole, and benzothiazole being those obtained by substituting one or more hydrogen atoms in said compounds with one or more alkyl groups, aryl groups, nitro groups, amino groups, hydroxyl groups, carboxyl groups or halogens, (b) an unsaturated organic phosphate compound having photopolymerizable ethylenically unsaturated bonds selected from the group consisting of acid phosphoxyethyl methacrylate, 3-chloro-2-acid phosphoxypropyl methacrylate, bis(acryloxyethyl)phosphate, bis(2-chloroethyl)vinyl phosphate and 1,2-bis(carboxyallyl)ethyldibutyl phosphate, (c) 20 to 40 parts by weight of a vinyl copolymer, (d) 20 to 80 parts by weight of a photopolymerizable unsaturated compound having at least one terminal ethylene group, and (e) 0.5 to 10 parts by weight of a sensitizer and/or a sensitizer system other than component (a) capable of initiating polymerization of components (b) and (d) upon irradiation of actinic light; the amount of component (a) being about 0.001% by weight or more and the amount of component (b) being about 0.001% by weight or more based on the weight of the photosensitive resin composition, and a support film supporting said layer.

Claim 10

A photosensitive element according to claim 7, wherein the salts of benzotriazole, benzimidazole and benzothiazole of the component (a) are acid salts or amine salts of said compounds.

Claim 11

A photosensitive element according to claim 7, wherein the photopolymerizable unsaturated compound having at least one terminal ethylene group of component (d) is an urethane diacrylate or urethane dimethacrylate compound obtained by reacting: (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) an acrylic or methacrylic monoester of a dihydric alcohol, and (iii) a dihydric alcohol.

Claim 12

A photosensitive element according to claim 7, wherein the component (a) is hydroxybenzotriazole and the component (b) is acid phosphoxyethyl methacrylate.

Claim 13

A photosensitive element according to claim 7, wherein the component (a) is benzimidazole and the component (b) is bis(acryloxyethyl)phosphate.

Claim 14

A photosensitive element according to claim 7, wherein the component (a) is benzotriazole hydrochloride and the component (b) is 3-chloro-2-acid phospoxypropyl methacrylate.

Claim 15

A photosensitive element according to claim 7, wherein said sensitizer is at least one compound selected from the group consisting of 2-ethylanthraquinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, diacetyl, benzyl, benzoin, pivalone, α-phenyl-benzoin, α,α-diethoxyacetophenone, benzophenone, and 4,4'-bisdialkylaminobenzophenone, and the sensitizer system comprises combinations of a 2,4,5-triarylimidazole dimer and 2-mercaptobenzoquinazole, leucocrystal violet, and tris(4-diethylamino-2-methylphenyl)methane or triethanolamine in combination with benzophenone.

Claim 16

A photosensitive resin composition according to claim 1, wherein said sensitizer is at least one compound selected from the group consisting of 2-ethylanthraquinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, diacetyl, benzyl, benzoin, pivalone, α-phenyl-benzoin, α,α-diethoxyacetophenone, benzophenone, and 4,4'-bisdialkylaminobenzophenone, and the sensitizer system comprises combinations of a 2,4,5-triarylimidazole dimer and 2-mercaptobenzoquinazole, leucocrystal violet, and tris(4-diethylamino-2-methylphenyl)methane or triethanolamine in combination with benzophenone.