US4437943A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for bonding metal wire to a base metal substrate
Assignee: Olin Corp
•
Filing: 1980-07-09
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Granted: 1984-03-20
•
Expires: 2000-07-09
Abstract
Abstract A process and apparatus for bonding lead wires to a metal substrate. A lead wire is positioned on the substrate and a spot of metal is deposited over a portion of the lead wire and metal substrate to firmly bond the wire to the substrate.
Inventors
- 👤 Alexander F. Beck
- 👤 Joseph Winter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:46
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; C; C25; C25D; C25D5/00; C25D5/003; C25D5/08; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/041; H10W72/00; H10W72/071; H10W72/0711; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
61 words
An apparatus for bonding a substrate to a lead wire comprising: means for supporting said substrate and said lead wire in an overlappiing relationship and in physical contact with each other; and means for electrodepositing a spot of material over at least a portion of said substrate and said lead wire to firmly bond said physically contacting substrate and lead wire.
Claim 2
Independent Claim
61 words
An apparatus for bonding a substrate to a lead wire comprising: means for supporting said substrate and said lead wire in an overlappiing relationship and in physical contact with each other; and means for electrodepositing a spot of material over at least a portion of said substrate and said lead wire to firmly bond said physically contacting substrate and lead wire.
Claim 3
Dependent Claim
73 words
An apparatus as in claim 1 wherein said electrodepositing means comprises: an anode; means for electrically connecting said substrate as a cathode; means for flowing an electrolyte stream in the form of a column from said anode to said overlapped substrate and lead wire; and means for passing a current between said anode and said substrate whereby said spot of material is formed over said portion of said overlapped substrate and lead wire.
Claim 4
Dependent Claim
17 words
An apparatus as in claim 1 further including means for positioning said lead wire over said substrate.
Claim 5
Dependent Claim
25 words
An apparatus as in claim 2 wherein said means for flowing said electrolyte stream in the form of a column comprises a jet forming nozzle.
Claim 6
Dependent Claim
37 words
An apparatus as in claim 4 further including means for supplying said electrolyte to said jet forming nozzle and means for maintaining at said nozzle a desired pressure of said electrolyte in order to form said column.
Claim 7
Dependent Claim
35 words
An apparatus as in claim 5 wherein said means for maintaining said desired pressure of said electrolyte at said nozzle comprises means for supporting a supply of electrolyte above said nozzle at a desired level.
Claim 8
Dependent Claim
29 words
An apparatus as in claim 6 wherein said means for supporting said supply of electrolyte further includes means for maintaining said desired level of said electrolyte above said nozzle.
Claim 9
Dependent Claim
16 words
An apparatus as in claim 4 wherein said anode is arranged within said jet forming nozzle.
Claim 10
Dependent Claim
24 words
An apparatus as in claim 4 wherein said jet forming nozzle is formed of a conductive material and is electrically connected as said anode.
Claim 11
Dependent Claim
26 words
An apparatus as in claim 4 wherein said jet forming nozzle defines an opening whose major dimension is from about 0.25 mm to about 5 mm.
Claim 12
Dependent Claim
46 words
An apparatus as in claim 1 wherein said means for electrodepositing said spot of material is adapted to electrodeposit a plurality of spots of material over at least a portion of a corresponding plurality of lead wires arranged in overlapping relationship with at least one substrate.
Claim 13
Dependent Claim
22 words
An apparatus as in claim 1 wherein said material comprises a metal selected from the group consisting of gold, silver, and copper.
Claim 14
Dependent Claim
57 words
A process for bonding a substrate to a lead wire comprising: supporting said substrate and said lead wire in an overlapping relationship and in physical contact with each other; and electrodepositing a spot of material over at least a portion of said substrate and said lead wire to firmly bond said physically contacting substrate and lead wire.
Claim 15
Dependent Claim
57 words
A process for bonding a substrate to a lead wire comprising: supporting said substrate and said lead wire in an overlapping relationship and in physical contact with each other; and electrodepositing a spot of material over at least a portion of said substrate and said lead wire to firmly bond said physically contacting substrate and lead wire.
Claim 16
Dependent Claim
68 words
A process as in claim 13 wherein said electrodepositing step comprises: providing an anode; electrically connecting said substrate as a cathode; flowing an electrolyte stream in the form of a column from said anode to said overlapped substrate and lead wide; and passing a current between said anode and said substrate whereby said spot of material is formed over said portion of said overlapped substrate and lead wire.
Claim 17
Dependent Claim
18 words
A process as in claim 13 further including the step of positioning said lead wire over said substrate.
Claim 18
Dependent Claim
35 words
A process as in claim 14 wherein said step of flowing said electrolyte stream in the form of a column comprises providing a jet forming nozzle and supplying said electrolyte to said jet forming nozzle.
Claim 19
Dependent Claim
27 words
A process as in claim 16 further including the step of maintaining at said nozzle a desired pressure of said electrolyte in order to form said column.
Claim 20
Dependent Claim
33 words
A process as in claim 17 wherein said step of maintaining said desired pressure of said electrolyte at said nozzle comprises supporting a supply of electrolyte above said nozzle at a desired level.
Claim 21
Dependent Claim
26 words
A process as in claim 18 wherein said step of supporting said supply of electrolyte includes maintaining said desired level of said electrolyte above said nozzle.
Claim 22
Dependent Claim
50 words
A process as in claim 13 wherein said step of electrodepositing said spot of material comprises the step of electrodepositing a plurality of spots of material of desired spacing and arrangement over respective portions of a plurality of said lead wires arranged in overlapping relationship with at least one substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-03-20 | 1987-09-19 | 1988-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-03-20 | 1991-09-19 | 1992-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-03-20 | 1995-09-19 | 1996-03-20 | $7700.00 | Window Closed / Lapsed |