Abstract A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles. The mark is typically altered by a current of sufficient magnitude to burn portions of the element (36), or by selective application of radiant energy such as a laser beam (83). Identifying the altered mark permits articles (12) having defective circuits thereon to be selectively eliminated from further processing steps.
A method of making electronic articles, said articles including substrates and circuit elements supported by such substrates, wherein said circuit elements are tested and said articles are selectively grouped and marked based on the outcome of such tests, which comprises: forming at least one distinct resistive element of a first relatively low resistive value on each such substrate, said at least one distinct resistive element being functionally separate from any such circuit elements, said first resistive value of said at least one resistive element identifying such article as one of a first group of at least two groups of said articles as may be determined by said tests; testing said articles; applying energy to at least one such distinct resistive element on the substrate of any of said tested articles with respect to which such testing has determined that such articles are not of such first group, such energy altering said first resistive value to a second relatively high resistive value with respect to such first resistive value; and prior to further steps involving a selective treatment of the articles of such first group, measuring the resistive value of such at least one distinct resistive element of such tested articles to determine whether such articles are of such first group of articles.
Claim 2
Independent Claim
212 words
A method of making electronic articles, said articles including substrates and circuit elements supported by such substrates, wherein said circuit elements are tested and said articles are selectively grouped and marked based on the outcome of such tests, which comprises: forming at least one distinct resistive element of a first relatively low resistive value on each such substrate, said at least one distinct resistive element being functionally separate from any such circuit elements, said first resistive value of said at least one resistive element identifying such article as one of a first group of at least two groups of said articles as may be determined by said tests; testing said articles; applying energy to at least one such distinct resistive element on the substrate of any of said tested articles with respect to which such testing has determined that such articles are not of such first group, such energy altering said first resistive value to a second relatively high resistive value with respect to such first resistive value; and prior to further steps involving a selective treatment of the articles of such first group, measuring the resistive value of such at least one distinct resistive element of such tested articles to determine whether such articles are of such first group of articles.
Claim 3
Dependent Claim
38 words
A method according to claim 1, wherein applying energy comprises: coupling a current source across terminals of at least one such resistive element, whereby a resulting current flow alters said relatively low resistance to such comparatively higher resistance.
Claim 4
Dependent Claim
63 words
A method according to claim 1, wherein said distinct resistive elements are formed of a film material and applying energy comprises: impinging a selectively applied energy beam against at least one such resistive element, such beam selectively destroying at least portions of such film material, whereby said relatively low resistance of said at least one resistive element changes to such comparatively higher resistance.