Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
196 words
In a semiconductor laser device including: a mesa-shaped optical confinement region providing an optical cavity for laser light disposed on a predetermined semiconductor substrate and having an active layer and a clad layer and a crystal surface; a burying layer having a crystal surface burying both sides, in the direction crossing the travelling direction of the laser light, of said mesa-shaped optical confinement region; first and second semiconductor layers for protecting said crystal surfaces, disposed on said mesa-shaped optical confinement region and on said burying layer, respectively; said first and second semiconductor layers made of a material having a forbidden band gap smaller than those of semiconductor layers to be disposed therebelow; a first electrode disposed on the upper part of said mesa-shaped optical confinement region contacting at least said first semiconductor layer; and a second electrode disposed on the lower side of said semiconductor substrate, the improvement comprising said first and second semiconductor layers located at different levels so that the upper surface of one of said semiconductor layers is below the lower surface of the other semiconductor layer whereby said first and second semiconductor layers will therefore not come into contact with each other.
Claim 2
Dependent Claim
196 words
In a semiconductor laser device including: a mesa-shaped optical confinement region providing an optical cavity for laser light disposed on a predetermined semiconductor substrate and having an active layer and a clad layer and a crystal surface; a burying layer having a crystal surface burying both sides, in the direction crossing the travelling direction of the laser light, of said mesa-shaped optical confinement region; first and second semiconductor layers for protecting said crystal surfaces, disposed on said mesa-shaped optical confinement region and on said burying layer, respectively; said first and second semiconductor layers made of a material having a forbidden band gap smaller than those of semiconductor layers to be disposed therebelow; a first electrode disposed on the upper part of said mesa-shaped optical confinement region contacting at least said first semiconductor layer; and a second electrode disposed on the lower side of said semiconductor substrate, the improvement comprising said first and second semiconductor layers located at different levels so that the upper surface of one of said semiconductor layers is below the lower surface of the other semiconductor layer whereby said first and second semiconductor layers will therefore not come into contact with each other.
Claim 3
Dependent Claim
54 words
The semiconductor laser device as defined in claim 1 wherein said semiconductor substrate, said active layer, said clad layer, said burying layer and said first and second semiconductor layers for protecting the crystal surface are made of an InP crystal, an InGaAsP crystal, an InP crystal, an InP crystal and an InGaAsP crystal, respectively.
Claim 4
Dependent Claim
43 words
The semiconductor laser device as defined in claim 1, wherein at least one p-n junction is formed inside said burying layer in parallel to said active layer such as to be brought under a reversely biased state during operation of said laser device.
Claim 5
Dependent Claim
25 words
A semiconductor laser device according to claim 1 or 3 and further including a further clad layer disposed between said substrate and said active layer.
Claim 6
Dependent Claim
19 words
A semiconductor laser device according to claim 4, wherein said further clad layer is made of an InP crystal.
Claim 7
Dependent Claim
89 words
The semiconductor laser device as defined in claim 1 wherein said semiconductor substrate, said active layer, said clad layer, said burying layer and said first and second semiconductor layers for protecting the crystal surface are made of an InP crystal, an InGaAsP crystal, an InP crystal, an InP crystal and an InGaAsP crystal, respectively, and wherein at least one p-n junction is formed inside said burying layer in parallel to said active layer such as to be brought under a reversely biased state during operation of said laser device.