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US4410902A Expired / Lapsed US ⏱️ 0.0 years remaining

Planar doped barrier semiconductor device

Assignee: United States Department of the Army
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Filing: 1981-03-23
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Granted: 1983-10-18
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Expires: 2001-03-23
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Abstract

Abstract Disclosed is a majority carrier rectifying barrier semiconductor device housing a planar doped barrier. The device is fabricated in GaAs by an epitaxial growth process which results in an n + -i-p + -i-n + semiconductor structure wherein an extremely narrow p + planar doped region is positioned in adjoining regions of nominally undoped (intrinsic) semiconductive material. The narrow widths of the undoped regions and the high densities of the ionized impurities within the space charge region results in rectangular and triangular electric fields and potential barriers, respectively. Independent and continuous control of the barrier height and the asymmetry of the current vs. voltage characteristic is provided through variation of the acceptor charge density and the undoped region widths. Additionally, the capacitance of the device is substantially constant with respect to bias voltage.

Inventors

  • 👤 Roger J. Malik

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 13:13
CPC Classifications
H; H10; H10D; H10D8/00; H10D8/825; H10D62/00; H10D62/60; H10D62/605

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 186 words
A semiconductor rectifying device having a planar doped barrier comprising, in combination: a relatively thin planar region of semiconductor material doped with a first type dopant material to provide an acceptor region; first and second relatively thick planar regions of substantially undoped semiconductor material respectively formed on opposite sides of said thin planar region; a pair of outer planar regions of semiconductor material doped with a second type dopant material respectively formed on said first and second planar regions to provide a pair of donor regions; a semiconductor substrate in contact with one of said outer pair of planar regions; and an ohmic contact region formed on the other of said pair of outer planar regions; said relatively thin planar acceptor region becoming, in absence of a bias potential being applied thereto, substantially depleted in order to establish an equilibrium Fermi level whereupon charge regions are induced in said pair of outer planar donor regions, said device further being adapted to exhibit thermionic transport with the application of positive and negative bias potentials thereto to provide a desired barrier height and a variable current voltage characteristic.
Claim 2
Dependent Claim 186 words
A semiconductor rectifying device having a planar doped barrier comprising, in combination: a relatively thin planar region of semiconductor material doped with a first type dopant material to provide an acceptor region; first and second relatively thick planar regions of substantially undoped semiconductor material respectively formed on opposite sides of said thin planar region; a pair of outer planar regions of semiconductor material doped with a second type dopant material respectively formed on said first and second planar regions to provide a pair of donor regions; a semiconductor substrate in contact with one of said outer pair of planar regions; and an ohmic contact region formed on the other of said pair of outer planar regions; said relatively thin planar acceptor region becoming, in absence of a bias potential being applied thereto, substantially depleted in order to establish an equilibrium Fermi level whereupon charge regions are induced in said pair of outer planar donor regions, said device further being adapted to exhibit thermionic transport with the application of positive and negative bias potentials thereto to provide a desired barrier height and a variable current voltage characteristic.
Claim 3
Dependent Claim 22 words
The device as defined by claim 1 wherein said device is formed from a group III-V compound by an epitaxial growth process.
Claim 4
Dependent Claim 23 words
The device as defined in claim 2 wherein said epitaxial growth process includes the process of molecular beam epitaxy and chemical vapor deposition.
Claim 5
Dependent Claim 22 words
The device as defined by claim 1 wherein said device is formed from a group of semiconductor compounds which includes gallium arsenide.
Claim 6
Dependent Claim 31 words
The device as defined by claim 1 wherein said first type of dopant material comprises p type dopant material and wherein said second type dopant material comprises n type dopant material.
Claim 7
Dependent Claim 24 words
The device as defined by claim 5 wherein said p and n type dopants consist of p + and n + type dopant material.
Claim 8
Dependent Claim 16 words
The device as defined by claim 6 wherein said p + type dopant material comprises beryllium.
Claim 9
Dependent Claim 16 words
The device as defined by claim 6 wherein said n + type dopant material comprises germanium.
Claim 10
Dependent Claim 53 words
The device as defined by claim 1 wherein said relatively thin planar acceptor region has a thickness ranging from a single atomic plane to substantially one hundred angstroms and wherein said first and second relatively thick undoped planar regions have respective thicknesses ranging between at least one hundred angstroms and several thousand angstroms.
Claim 11
Dependent Claim 26 words
The device as defined by claim 1 wherein said first and second undoped planar regions have respective thicknesses ranging between substantially 200 A and 2000 A.
Claim 12
Dependent Claim 27 words
The device as defined by claim 1 wherein said first and second undoped planar regions have mutually unequal thicknesses to provide an asymmetrical current vs. voltage characteristic.
Claim 13
Dependent Claim 59 words
The device as defined by claim 1 wherein said first undoped planar region is relatively thinner than the said second undoped planar region and wherein said first planar region is located on the ohmic contact side of said relatively thin planar region and said second relatively thicker planar region lies on the substrate side of said thin planar region.
Claim 14
Dependent Claim 30 words
The device as defined by claim 1 wherein said first and second undoped planar regions are of substantially the same thickness for providing a substantially symmetrical current vs. voltage characteristic.
Claim 15
Dependent Claim 197 words
A semiconductor rectifying device having a planar doped barrier comprising, in combination: a relatively thin planar region of semiconductor material doped with a first type dopant material to provide a charged region of a first polarity; first and second relatively thick planar regions of substantially undoped semiconductor material respectively formed on opposite sides of said thin planar region; a pair of outer planar regions of semiconductor material doped with a second type dopant material respectively formed on said first and second planar regions to provide a pair of charged regions having a common polarity opposite of said first polarity; a semiconductor substrate in contact with one of said outer pair of planar regions; and an ohmic contract region formed on the other of said pair of outer planar regions; said relatively thin planar region becoming, in absence of a bias potential being applied thereto, substantially depleted in order to establish an equilibrium Fermi level whereupon charge regions are induced in said pair of outer planar regions, said device further being adapted to exhibit thermionic transport with the application of positive and negative bias potentials thereto to provide a desired barrier height and a variable current voltage characteristic.
Claim 16
Dependent Claim 197 words
A semiconductor rectifying device having a planar doped barrier comprising, in combination: a relatively thin planar region of semiconductor material doped with a first type dopant material to provide a charged region of a first polarity; first and second relatively thick planar regions of substantially undoped semiconductor material respectively formed on opposite sides of said thin planar region; a pair of outer planar regions of semiconductor material doped with a second type dopant material respectively formed on said first and second planar regions to provide a pair of charged regions having a common polarity opposite of said first polarity; a semiconductor substrate in contact with one of said outer pair of planar regions; and an ohmic contract region formed on the other of said pair of outer planar regions; said relatively thin planar region becoming, in absence of a bias potential being applied thereto, substantially depleted in order to establish an equilibrium Fermi level whereupon charge regions are induced in said pair of outer planar regions, said device further being adapted to exhibit thermionic transport with the application of positive and negative bias potentials thereto to provide a desired barrier height and a variable current voltage characteristic.

References Cited (Backward Citations)

US3984858A Cited
US3940783A Cited
US3904449A Cited
US4149179A Cited
US4278986A Cited
US4353081A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-10-17 1987-04-18 1987-10-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-10-17 1991-04-18 1991-10-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-10-17 1995-04-18 1995-10-18 $7700.00 Window Closed / Lapsed

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