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US4407005A Expired / Lapsed US ⏱️ 0.0 years remaining

N-Channel JFET device having a buried channel region, and method for making same

Assignee: Texas Instruments Inc
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Filing: 1981-10-05
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Granted: 1983-09-27
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Expires: 2001-10-05
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Abstract

Abstract A buried n-channel junction field-effect transistor (JFET) fabricated in standard bipolar integrated circuit starting material. The transistor has a deep p-well as the bottom gate formed in an n-type body. The source is surrounded by the p-well while the drain is the epitaxial layer near the surface of the body outside the p-well. A buried channel connects the source and drain. A p-layer above the buried channel forms the top gate. Gate leakage current and noise are very low.

Inventors

  • 👤 Kenneth M. Bell
  • 👤 Joe R. Trogolo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 02:39
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/40; H10D84/401; H10D30/00; H10D30/80; H10D30/83; H10D62/00; H10D62/10; H10D62/17; H10D62/343

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 136 words
An N-channel junction field effect transistor comprising: (a) a P-type semiconductor substrate; (b) an N-type epitaxial layer on one surface of said substrate; (c) a first P-type gate region formed as a well in said N-type epitaxial region, said first P-type region comprising the bottom gate for said transistor; (d) a second P-type gate region formed at the surface of said substrate; (e) an N-type channel region buried beneath said second P-type gate region and above said first P-type region, said N-type channel region extending partially outside said first P-type region; and (f) an N-type source region at the surface of said epitaxial layer and surrounded by said P-type regions, said N-type channel region providing electrical communication between said N-type source region and said N-type epitaxial layer, said N-type epitaxial layer operative as a drain region.
Claim 2
Dependent Claim 136 words
An N-channel junction field effect transistor comprising: (a) a P-type semiconductor substrate; (b) an N-type epitaxial layer on one surface of said substrate; (c) a first P-type gate region formed as a well in said N-type epitaxial region, said first P-type region comprising the bottom gate for said transistor; (d) a second P-type gate region formed at the surface of said substrate; (e) an N-type channel region buried beneath said second P-type gate region and above said first P-type region, said N-type channel region extending partially outside said first P-type region; and (f) an N-type source region at the surface of said epitaxial layer and surrounded by said P-type regions, said N-type channel region providing electrical communication between said N-type source region and said N-type epitaxial layer, said N-type epitaxial layer operative as a drain region.
Claim 3
Dependent Claim 19 words
A transistor as in claim 1, wherein said transistor is integrated on a monolithic semiconductor substrate with bipolar circuitry.

References Cited (Backward Citations)

US4314267A Cited
US4322738A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-09-26 1987-03-28 1987-09-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-09-26 1991-03-28 1991-09-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-09-26 1995-03-28 1995-09-27 $7700.00 Window Closed / Lapsed

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