US4404252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface stabilized waferboard
Assignee: MacMillan Bloedel Ltd
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Filing: 1981-09-16
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Granted: 1983-09-13
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Expires: 2001-09-16
Abstract
Abstract A waferboard having at least one surface rendered water resistant and stabilized against wafer loss is disclosed. In the past heavy paper overlays have been used on panel surfaces. However, these paper overlays are specially treated non-porous paper and generally have to be specially applied by the addition of a glue. The waferboard of the present invention is formed of wood wafers bonded together in a hot press with adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard. In one embodiment, the contours of the wood wafers on the surface of the waferboard are transmitted through the layer of porous paper.
Inventors
- 👤 Bernard H. Hetzler
- 👤 Hugh V. Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 12:47
CPC Classifications
B; B32; B32B; B32B21/00; B32B21/04; B32B21/06; B32B27/00; B32B27/42; B32B7/00; B32B7/04; B32B7/12; B32B2457/00; B32B2457/14; Y; Y10; Y10T; Y10T428/00; Y10T428/25; Y10T428/253; Y10T428/31504; Y10T428/31801; Y10T428/31804; Y10T428/31808; Y10T428/31855; Y10T428/31859; Y10T428/31877; Y10T428/3188; Y10T428/31895; Y10T428/31906; Y10T428/31942; Y10T428/31949; Y10T428/31964; Y10T428/31967; Y10T428/31971; Y10T428/31989
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
62 words
Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard, said paper retaining its porosity after said bonding in the hot press.
Claim 2
Dependent Claim
62 words
Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and wax, and having a layer of porous paper bonded in the hot press to at least one surface of the waferboard, said paper retaining its porosity after said bonding in the hot press.
Claim 3
Dependent Claim
26 words
The waferboard according to claim 1 wherein contours of the wood wafers on the surface of the waferboard are transmitted through the layer of porous paper.
Claim 4
Dependent Claim
24 words
The waferboard according to claim 1 or claim 2 wherein the layer of porous paper bonded to the surface of the waferboard is translucent.
Claim 5
Dependent Claim
14 words
The waferboard according to claim 1 wherein the wax comprises an aliphatic petroleum product.
Claim 6
Dependent Claim
12 words
The waferboard according to claim 4 wherein the wax is slack wax.
Claim 7
Dependent Claim
30 words
The waferboard according to any of claims 1, 2 or 4 wherein the wax content of the waferboard comprises at least about 1% of the oven dry weight of wafers.
Claim 8
Dependent Claim
30 words
The waferboard according to any of claims 1, 2 or 4 wherein the wax content of the waferboard comprises at least about 2% of the oven dry weight of wafers.
Claim 9
Dependent Claim
18 words
The waferboard according to any of claims 1, 2 or 4 wherein the adhesive resin is phenol formaldehyde.
Claim 10
Dependent Claim
28 words
The waferboard according to claim 1 or claim 4 wherein the weight of the layer of porous paper is not greater than about 100 grams per square meter.
Claim 11
Dependent Claim
28 words
The waferboard according to claim 1 or claim 4 wherein the weight of the layer of porous paper is not greater than about 75 grams per square meter.
Claim 12
Dependent Claim
26 words
The waferboard according to claim 2 wherein the weight of the layer of porous paper is in the range of about 36-50 grams per square meter.
Claim 13
Dependent Claim
20 words
The waferboard according to claim 1 or claim 11 wherein the porous paper contains at least about 70% mechanical pulp.
Claim 14
Dependent Claim
15 words
The waferboard according to claim 1 or claim 11 wherin the porous paper is newsprint.
Claim 15
Dependent Claim
20 words
The waferboard according to claim 1 wherein both surfaces of the waferboard have a layer of porous paper bonded thereto.
Claim 16
Dependent Claim
74 words
Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and at least about 1% of the oven dry weight of wafers of slack wax, and having a layer of newsprint bonded in the hot press to at least one surface of the waferboard, said newsprint retaining the porosity after said bonding in the hot press.
Claim 17
Dependent Claim
74 words
Waferboard having at least one surface rendered water resistant and stabilized against wafer loss, formed of wood wafers bonded together in a hot press with an adhesive resin and at least about 1% of the oven dry weight of wafers of slack wax, and having a layer of newsprint bonded in the hot press to at least one surface of the waferboard, said newsprint retaining the porosity after said bonding in the hot press.
Claim 18
Dependent Claim
13 words
The waferboard according to claim 15 wherein the adhesive resin is phenol formaldehyde.
Claim 19
Dependent Claim
25 words
The waferboard according to claim 15 wherein contours of the wood wafers on the surface of the waferboard are transmitted through the layer of newsprint.
Claim 20
Dependent Claim
31 words
The waferboard according to any of claims 15, 16 or 17 wherein the slack wax content of the waferboard comprises at least about 2% of the oven dry weight of wafers.
Claim 21
Dependent Claim
24 words
The waferboard according to any of claims 15, 16 or 17 wherein both surfaces of the waferboard have a layer of newsprint bonded thereto.
Claim 22
Dependent Claim
74 words
In a process for manufacturing waferboard wherein wood wafers are bonded together in a hot press with an adhesive resin and wax, the improvement of imparting water resistance and stabilizing at least one surface of the waferboard against wafer loss, comprising bonding a layer of porous paper to at least one surface of the waferboard while to wood wafers are being bonded together with the hot press, said paper remaining porous after said bonding.
Claim 23
Dependent Claim
74 words
In a process for manufacturing waferboard wherein wood wafers are bonded together in a hot press with an adhesive resin and wax, the improvement of imparting water resistance and stabilizing at least one surface of the waferboard against wafer loss, comprising bonding a layer of porous paper to at least one surface of the waferboard while to wood wafers are being bonded together with the hot press, said paper remaining porous after said bonding.
Claim 24
Dependent Claim
14 words
The process according to claim 20 wherein the wax comprises an aliphatic petroleum product.
Claim 25
Dependent Claim
12 words
The process according to claim 21 wherein the wax is slack wax.
Claim 26
Dependent Claim
31 words
The process according to any of claims 20, 21 or 22 wherein the wax bonded with the wood wafers comprises at least about 1% of the oven dry weight of wafers.
Claim 27
Dependent Claim
31 words
The process according to any of claims 20, 21 or 22 wherein the wax bonded with the wood wafers comprises at least about 2% of the oven dry weight of wafers.
Claim 28
Dependent Claim
18 words
The process according to any of claims 20, 21 or 22 wherein the adhesive resin is phenol formaldehyde.
Claim 29
Dependent Claim
32 words
The process according to claim 20 or claim 21 wherein the weight of the layer of porous paper bonded to the waferboard is not greater than about 100 grams per square meter.
Claim 30
Dependent Claim
32 words
The process according to claim 20 or claim 21 wherein the weight of the layer of porous paper bonded to the waferboard is not greater than about 75 grams per square meter.
Claim 31
Dependent Claim
51 words
The process according to claim 20 wherein the weight of the layer of porous paper bonded to the waferboard is in the range of about 36-50 grams per square meter, and exterior contours of the wood wafers on the surface of the waferboard are transmitted through the layer of porous paper.
Claim 32
Dependent Claim
19 words
The process according to claim 20 or claim 28 wherein the porous paper contains at least 70% mechanical pulp.
Claim 33
Dependent Claim
15 words
The process according to claim 20 or claim 28 wherein the porous paper is newsprint.
Claim 34
Dependent Claim
86 words
A process for manufacturing waferboard having at least one surface rendered water resistant and stabilized against wafer loss, comprising the steps of: preparing a layup of wood wafers with an adhesive resin and at least about 1% of the oven dry weight of wafers of slack wax, applying a layer of newsprint to at least one surface of the layup of wood wafers, and bonding the layer of newsprint and the layup of wood wafers in a hot press, said newsprint remaining porous after said bonding.
Claim 35
Dependent Claim
86 words
A process for manufacturing waferboard having at least one surface rendered water resistant and stabilized against wafer loss, comprising the steps of: preparing a layup of wood wafers with an adhesive resin and at least about 1% of the oven dry weight of wafers of slack wax, applying a layer of newsprint to at least one surface of the layup of wood wafers, and bonding the layer of newsprint and the layup of wood wafers in a hot press, said newsprint remaining porous after said bonding.
Claim 36
Dependent Claim
13 words
The process according to claim 31 wherein the adhesive resin is phenol formaldehyde.
Claim 37
Dependent Claim
25 words
The process according to claim 31 wherein contours of the wood wafers on the surface of the waferboard are transmitted through the layer of newsprint.
Claim 38
Dependent Claim
33 words
The process according to any of claims 31, 32 or 33 wherein the slack wax content added to the wood wafers comprises at least about 2% of the oven dry weight of wafers.
Claim 39
Dependent Claim
27 words
The process according to any of claims 31, 32 or 33 wherein a layer of newsprint is applied to both surfaces of the layup of wood wafers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-09-12 | 1987-03-14 | 1987-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-09-12 | 1991-03-14 | 1991-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-09-12 | 1995-03-14 | 1995-09-13 | $7700.00 | Window Closed / Lapsed |