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US4400438A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor

Assignee: HITACI CHEMICA COMPANY Ltd A CORPOF
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Filing: 1981-03-30
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Granted: 1983-08-23
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Expires: 2001-03-30
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Abstract

Abstract A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.

Inventors

  • 👤 Akio Takahashi
  • 👤 Yutaka Itoh
  • 👤 Takeshi Shimazaki
  • 👤 Motoyo Wajima
  • 👤 Hirosada Morishita
  • 👤 Yutaka Mizuno
  • 👤 Shunya Yokozawa
  • 👤 Kenji Tsukanishi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 20:07
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/04; B32B15/00; B32B15/20; B32B15/14; C; C09; C09D; C09D179/00; C09D179/04; C09D179/08; C09D179/085; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; B32B2260/00; B32B2260/02; B32B2260/021; B32B2260/04; B32B2260/046; B32B2307/00; B32B2307/30; B32B2307/306; B32B2307/3065; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/012; H05K2203/00; H05K2203/12; H05K2203/122; Y; Y10; Y10S; Y10S428/00; Y10S428/92; Y10S428/921; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 48 words
A process for producing a fire retardant and heat resistant copper-clad laminated board, which comprises the steps of: (1) impregnating a base material with a varnish comprising a solvent, at least one maleimide compound and/or resin containing at least one maleimide group represented by the formula (I): ##STR8##
Claim 2
Dependent Claim 48 words
A process for producing a fire retardant and heat resistant copper-clad laminated board, which comprises the steps of: (1) impregnating a base material with a varnish comprising a solvent, at least one maleimide compound and/or resin containing at least one maleimide group represented by the formula (I): ##STR8##
Claim 3
Dependent Claim 114 words
1 to 10% by weight, based on the resin content of the varnish, of at least one halogenated diphenyl ether compound containing at least eight halogen atoms and represented by the formula (II): ##STR9## wherein X 1 to X 10 each independently is a chlorine atom, a bromine atom, a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group or an amino group; (2) drying the impregnated base material to prepare a prepreg; and (3) contact-bonding under heat and pressure a required number of sheets of the prepreg placed in contact relationship and one sheet of copper foil placed thereon or two sheets of copper foil sandwiching the same.
Claim 4
Dependent Claim 114 words
1 to 10% by weight, based on the resin content of the varnish, of at least one halogenated diphenyl ether compound containing at least eight halogen atoms and represented by the formula (II): ##STR9## wherein X 1 to X 10 each independently is a chlorine atom, a bromine atom, a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group or an amino group; (2) drying the impregnated base material to prepare a prepreg; and (3) contact-bonding under heat and pressure a required number of sheets of the prepreg placed in contact relationship and one sheet of copper foil placed thereon or two sheets of copper foil sandwiching the same.
Claim 5
Dependent Claim 12 words
A copper-clad laminated board produced by a process according to claim 1.
Claim 6
Dependent Claim 34 words
A varnish for use in the production of copper-clad laminated boards which comprises a solvent, at leas one maleimide compound and/or resin containing at least one maleimide group represented by the formula (I): ##STR10##
Claim 7
Dependent Claim 34 words
A varnish for use in the production of copper-clad laminated boards which comprises a solvent, at leas one maleimide compound and/or resin containing at least one maleimide group represented by the formula (I): ##STR10##
Claim 8
Dependent Claim 68 words
1 to 10% by weight, based on the resin content of the varnish, of at least one halogenated diphenyl ether compound containing at least eight halogen atoms and represented by the formula (II): ##STR11## wherein X 1 to X 10 each independently is a chlorine atom, a bromine atom, a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group or an amino group.
Claim 9
Dependent Claim 68 words
1 to 10% by weight, based on the resin content of the varnish, of at least one halogenated diphenyl ether compound containing at least eight halogen atoms and represented by the formula (II): ##STR11## wherein X 1 to X 10 each independently is a chlorine atom, a bromine atom, a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group or an amino group.

References Cited (Backward Citations)

US3075944A Cited
US3902951A Cited
US4193829A Cited
US4266037A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-08-22 1987-02-21 1987-08-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-08-22 1991-02-21 1991-08-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-08-22 1995-02-21 1995-08-23 $7700.00 Window Closed / Lapsed

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