US4400407A
Expired / Lapsed
US
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Method for deposition of thin film alloys utilizing electron beam vaporization
Assignee: Conexant Systems LLC
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Filing: 1981-07-15
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Granted: 1983-08-23
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Expires: 2001-07-15
Abstract
Abstract The invention is an apparatus and method for achieving thin film deposition, of uniform composition, from evaporated alloys. A source of wire alloy, selected for the particular thin film deposition on a substrate, is continuously fed through a region of high speed electron bombardment confined to an end of the wire, for evaporation of the wire in the vicinity of the substrate. An ion flux detector controls the rate of feeding of the wire source in accordance with the detected flux to lay down a uniform thin film of predetermined thickness. A high potential is established between the wire and the source of the electrons and the liberated electrons are guided by the electric field toward the end of the wire being evaporated, which serves as an anode.
Inventors
- 👤 Addison B. Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:41
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/24; C23C14/28; C23C14/30; C23C14/246
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
49 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition in the vicinity of the substrate by high speed voltage attracted electrons; and, feeding the wire to replace the end being vaporized.
Claim 2
Independent Claim
49 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition in the vicinity of the substrate by high speed voltage attracted electrons; and, feeding the wire to replace the end being vaporized.
Claim 3
Independent Claim
64 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the feeding of the wire in accordance with deposition rate detected in said vicinity.
Claim 4
Independent Claim
64 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the feeding of the wire in accordance with deposition rate detected in said vicinity.
Claim 5
Dependent Claim
17 words
The method of claim 2, wherein: said deposition rate is detected by means of ion flux measurement.
Claim 6
Independent Claim
63 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the energy of the high speed electrons in accordance with deposition rate desired.
Claim 7
Independent Claim
63 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selected for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the energy of the high speed electrons in accordance with deposition rate desired.
Claim 8
Independent Claim
73 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selecting for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the bombarding energy of the high speed electrons being in accordance with a characteristic of said end to determine the rate of deposition.
Claim 9
Independent Claim
73 words
The method of evaporation of alloys for thin film deposition on substrates comprising the steps of: bombarding an end of a wire of alloy, selecting for deposition, in the vicinity of the substrate by high speed voltage attracted electrons; feeding the wire to replace the end being vaporized; and controlling the bombarding energy of the high speed electrons being in accordance with a characteristic of said end to determine the rate of deposition.
References Cited (Backward Citations)
US2584660A
Cited
US4237148A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-08-22 | 1987-02-21 | 1987-08-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-08-22 | 1991-02-21 | 1991-08-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-08-22 | 1995-02-21 | 1995-08-23 | $7700.00 | Window Closed / Lapsed |