US4400351A
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High thermal resistance, high electric conductivity copper base alloy
Assignee: Mitsubishi Metal Corp
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Filing: 1981-06-02
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Granted: 1983-08-23
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Expires: 2001-06-02
Abstract
Abstract An improved copper base alloy having excellent thermal resistance and electric conductivity. The alloy consists essentially of from 0.0005 to 0.01 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities. The copper base alloy may further contain from 0.002 to 0.05 percent magnesium whereby the magnesium imparts further enhanced thermal resistance to the alloy.
Inventors
- 👤 Shinichi Komori
- 👤 Yasushi Shimanuki
- 👤 Isamu Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 01:25
CPC Classifications
C; C22; C22C; C22C9/00; H; H01; H01B; H01B1/00; H01B1/02; H01B1/026
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
61 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent magnesium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 2
Dependent Claim
61 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent magnesium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 3
Dependent Claim
22 words
The copper base alloy as recited in claim 1, wherein the boron is present in an amount from 0.0008 to 0.005 percent.
Claim 4
Dependent Claim
22 words
The copper base alloy as recited in claim 1, wherein the magnesium is present in an amount from 0.01 to 0.03 percent.
Claim 5
Dependent Claim
22 words
The copper base alloy as recited in claim 1, wherein the phosphorus is present in an amount from 0.005 to 0.008 percent.
Claim 6
Dependent Claim
22 words
The copper base alloy as recited in claim 1, wherein the indium is present in an amount from 0.01 to 0.03 percent.
Claim 7
Dependent Claim
22 words
The copper base alloy as recited in claim 1, wherein the tellurium is present in an amount from 0.002 to 0.05 percent.
Claim 8
Dependent Claim
56 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.03 percent indium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent and tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 9
Dependent Claim
56 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.03 percent indium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent and tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 10
Dependent Claim
62 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent magnesium, from 0.002 to 0.03 percent indium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent and tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 11
Dependent Claim
62 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent magnesium, from 0.002 to 0.03 percent indium, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent and tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 12
Dependent Claim
32 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.01 to 0.03 percent indium, and the balance copper and inevitable impurities.
Claim 13
Dependent Claim
32 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.01 to 0.03 percent indium, and the balance copper and inevitable impurities.
Claim 14
Dependent Claim
33 words
The copper base alloy of claim 9 which also contains a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof.
Claim 15
Dependent Claim
32 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent tellurium, and the balance copper and inevitable impurities.
Claim 16
Dependent Claim
32 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.002 to 0.05 percent tellurium, and the balance copper and inevitable impurities.
Claim 17
Dependent Claim
33 words
The copper base alloy of claim 11 which also contains a material selected from the group consisting of indium from 0.01 to 0.03 percent, phosphorus from 0.001 to 0.01 percent and mixtures thereof.
Claim 18
Dependent Claim
55 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.001 to 0.06 percent tellurium, a material selected from the group consisting of indium from 0.01 to 0.03 percent, phosphorus from 0.001 to 0.01 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 19
Dependent Claim
55 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.01 percent boron, from 0.001 to 0.06 percent tellurium, a material selected from the group consisting of indium from 0.01 to 0.03 percent, phosphorus from 0.001 to 0.01 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 20
Dependent Claim
55 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.0031 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
Claim 21
Dependent Claim
55 words
A high thermal resistance, high electric conductivity copper base alloy consisting essentially of from 0.0005 to 0.0031 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities.
References Cited (Backward Citations)
CA454939A
Cited
US2264287A
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US2479311A
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US3677745A
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US3773503A
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JPS4927243A
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JPS56266A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-08-22 | 1987-02-21 | 1987-08-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-08-22 | 1991-02-21 | 1991-08-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-08-22 | 1995-02-21 | 1995-08-23 | $7700.00 | Window Closed / Lapsed |