Process for forming an image

Claim 2

A process for forming an image, which comprises imagewise exposing a photosensitive image-forming material consisting of a non-transparent support or support colored with dyes or pigments, said support having formed thereon a layer of a photosensitive composition, said photosensitive composition layer being in intimate contact with an original image transparency during said imagewise exposing and said composition containing a diazonium compound or an aromatic azide compound and a binder which imparts heat-softenability to the photosensitive composition layer wherein said layer is a solid layer not tacky at temperature ranges between about 5° C. to 40° C. and then adhering the photosensitive composition layer closely to a development carrier sheet having thereon a layer of adhesive composition comprising a polymeric material and a tackifier; and peeling said image-forming material and said carrier sheet from each other at a temperature which is lower than the softening temperature of the photosensitive composition layer and lower than the softening temperature of the layer of adhesive on said carrier sheet to imagewise separate said photosensitive composition layer and to transfer and adhere the entire exposed area of the photosensitive layer to the carrier sheet and thereby form a relief image on the carrier sheet, and the non-transferred unexposed area of the photosensitive composition remains on the support also forming a relief image simultaneously with the relief image on the carrier sheet.

Claim 3

A process for forming an image, which comprises imagewise exposing a photosensitive image-forming material composed of a non-transparent support or support colored with dyes or pigments, said support having formed thereon as the uppermost layer a layer of a photosensitive composition, said photosensitive composition layer being in intimate contact with an original image transparency during said imagewise exposing and said composition containing a diazonium compound or an aromatic azide compound and a binder which imparts heat-softenability to the photosensitive composition layer wherein said layer is a solid layer not tacky at temperature ranges between about 5° C. to 40° C. and then adhering the photosensitive composition layer closely to a development carrier sheet having thereon a layer of an adhesive composition comprising a polymeric material and a tackifier and peeling said image-forming material and said carrier sheet from each other at a temperature which is lower than the softening temperature of the photosensitive composition layer and lower than the softening temperature of the layer of adhesive on said carrier sheet to imagewise separate said photosensitive composition layer and to transfer and adhere the entire exposed area of the photosensitive layer to the carrier sheet and thereby form a relief image on the carrier sheet, and the non-transferred unexposed area of the photosensitive composition remains on the support also forming a relief image simultaneously with the relief image on the carrier sheet.

Claim 4

A process for forming an image, which comprises imagewise exposing a photosensitive image-forming material composed of a non-transparent support or support colored with dyes or pigments, said support having formed thereon as the uppermost layer a layer of a photosensitive composition, said photosensitive composition layer being in intimate contact with an original image transparency during said imagewise exposing and said composition containing a diazonium compound or an aromatic azide compound and a binder which imparts heat-softenability to the photosensitive composition layer wherein said layer is a solid layer not tacky at temperature ranges between about 5° C. to 40° C. and then adhering the photosensitive composition layer closely to a development carrier sheet having thereon a layer of an adhesive composition comprising a polymeric material and a tackifier and peeling said image-forming material and said carrier sheet from each other at a temperature which is lower than the softening temperature of the photosensitive composition layer and lower than the softening temperature of the layer of adhesive on said carrier sheet to imagewise separate said photosensitive composition layer and to transfer and adhere the entire exposed area of the photosensitive layer to the carrier sheet and thereby form a relief image on the carrier sheet, and the non-transferred unexposed area of the photosensitive composition remains on the support also forming a relief image simultaneously with the relief image on the carrier sheet.

Claim 5

The process of claim 1 or claim 2 wherein said photosensitive composition layer is adhered to said development carrier sheet at a temperature from ordinary temperature up to 150° C.

Claim 6

The process of claim 1 or claim 2, wherein said photosensitive image-forming material is exposed prior to application of said carrier sheet with the photosensitive composition layer of said image-forming material being in intimate contact with the original image transparency.

Claim 7

The process of claim 1 or claim 2, wherein said diazonium compound is rendered less hydrophilic.

Claim 8

The process of claim 1 or claim 2, wherein said diazonium compound is represented by the formula ArN═N.sup.+ X.sup.- wherein Ar represents an aromatic ring substituted at the 4-position with an alkylamino group, a phenylamino group, an N-heterocyclic group, or a mercapto group and X is an anion.

Claim 9

The process of claim 1 or claim 2, wherein said azide compound is represented by the formula N.sub.3 --R.sub.5 --CH═CH--R.sub.6 wherein R 5 is phenylene and R 6 is an acyl group or an azide aryl group.

Claim 10

The process of claim 1 or claim 2, wherein said adhesive composition contains a rubber, a cellulosic polymeric material or a vinyl polymer.

Claim 11

The process of claim 1 or claim 2, wherein said peeling development is carried out at room temperature to 100° C.

Claim 12

The process of claim 1 or claim 2, wherein said layer of said photosensitive composition is from 0.5 μm to 500 μm thick.

Claim 13

The process the claim 1 or claim 2, wherein said peeling temperature is from room temperature to about 60° C.

Claim 14

The process of claim 1 or claim 2, wherein said diazonium compound is selected from the group consisting of 4-morpholino-benzene diazonium/boron tetrafluoride double salt, the condensation product of 4-N-phenylamino-benzenediazonium and formaldehyde, 4-N,N-dimethylaminobenzenediazonium/tetraphenylboron double salt, 2,6-di(4'-azidobenzal)-4-methylcyclohexane, 1-diazo-2,5-di-methoxy-1-p-tolylmercaptobenzene phosphorous hexafluoride double salt, 2-diazo-1-naphthol-5-sulfonic acid ethyl ether, and 4-morpholino-2,5-dibutoxybenzene diazonium/boron tetrafluoride double salt; and wherein said binder is selected from the group consisting of vinylidene chloride/acrylonitrile copolymer, m-cresol-type novolak resin, and polyvinyl butyral; and wherein said support is selected from the group consisting of grained and anodized aluminum, polyethylene terephthalate having aluminum vacuum-deposited thereon in a thickness of about 1,000 A, polyethylene terephthalate having a subbing layer of gelatin, aluminum having a 1μ thick layer of polyvinyl alcohol, aluminum which has been grained, anodized and treated with sodium silicate.

Claim 15

The process of claim 1 or claim 2, wherein said diazonium compound has an oleophilic moiety.

Claim 16

The process of claim 13, wherein said oleophilic moiety is alkoxy substituted on an aromatic ring of said diazonium compound.

Claim 17

The process of claim 13, wherein said oleophilic moiety is an anion of said diazonium compound selected from the group consisting of tetraphenylborate, tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, p-toluenesulfonic acid and hexafluoroantimonate.