US4393111A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabrication of conductor-clad composites using molding compounds and techniques
Assignee: AT&T Inc
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Filing: 1981-07-31
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Granted: 1983-07-12
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Expires: 2001-07-31
Abstract
Abstract Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.
Inventors
- 👤 Theodore H. Klein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 03:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K1/032; H05K1/0326; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0242; H05K2201/0251; H05K2201/09; H05K2201/09009; H05K2201/09118; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/21; Y10T428/24; Y10T428/24802; Y10T428/29; Y10T428/2904; Y10T428/2907; Y10T428/31504; Y10T428/31551; Y10T428/31616; Y10T428/3162; Y10T428/31678; Y10T428/31681; Y10T428/31786; Y10T428/31794
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
72 words
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, 60-80 parts by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, 0.5-60 parts by weight; low profile additive, 15-40 parts by weight; catalyst, 0.5-3 parts by weight; filler, 100-200 parts by weight; viscosity control agent, 0-5 parts by weight; and reinforcement, 20-250 parts by weight.
Claim 2
Dependent Claim
72 words
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, 60-80 parts by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, 0.5-60 parts by weight; low profile additive, 15-40 parts by weight; catalyst, 0.5-3 parts by weight; filler, 100-200 parts by weight; viscosity control agent, 0-5 parts by weight; and reinforcement, 20-250 parts by weight.
Claim 3
Dependent Claim
64 words
The structure of claim 1 formed from a composition comprising: resin, 65.0 parts by weight ±5 percent; monomer, 43.0 parts by weight ±5 percent; low profile additive, 35.0 parts by weight ±5 percent; catalyst, 1.5 parts by weight ±5 percent; filler, 150.0 parts by weight ±5 percent; viscosity control agent, 2.5 parts by weight ±5 percent; and reinforcement, 85.0 parts by weight ±5 percent.
Claim 4
Dependent Claim
80 words
The structure of claim 1 formed from a composition comprising: isophthalic anhydride based unsaturated polyester resin, 65 parts by weight ±1 percent; polyvinyl acetate low profile additive, 35 parts by weight ±1 percent; styrene, 3 parts by weight ±1 percent; 1,1 ditertiary butylperox 3,3,5 dimethyl cyclohexane catalyst, 1 part by weight ±1 percent; alumina trihydrate, 150 parts by weight ±1 percent; magnesium oxide, 0.8 parts by weight ±1 percent; and chopped glass fiber reinforcement, 30 parts by weight ±1 percent.
Claim 5
Dependent Claim
79 words
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, about 9.709-34.03 percent by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, about 0.08644-23.48 percent by weight; low profile additive, about 2.4470-18.90 percent by weight; catalyst, about 0.07868-1.511 percent by weight; filler, about 18.59-67.56 percent by weight; viscosity control agent, about 0-2.487 percent by weight; and reinforcement, about 4.902-58.68 percent by weight.
Claim 6
Dependent Claim
79 words
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising: resin, about 9.709-34.03 percent by weight; cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, about 0.08644-23.48 percent by weight; low profile additive, about 2.4470-18.90 percent by weight; catalyst, about 0.07868-1.511 percent by weight; filler, about 18.59-67.56 percent by weight; viscosity control agent, about 0-2.487 percent by weight; and reinforcement, about 4.902-58.68 percent by weight.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-07-11 | 1987-01-10 | 1987-07-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-07-11 | 1991-01-10 | 1991-07-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-07-11 | 1995-01-10 | 1995-07-12 | $7700.00 | Window Closed / Lapsed |