Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
163 words
Semiconductor component having a plurality of semiconductor elements disposed in a case, including a bottom of the case, and case terminals, comprising conductor bars electrically connecting the semiconductor elements to each other and to the case terminals, the semiconductor elements being in thermal and pressure contact with the bottom through at least one of said conductor bars and being electrically insulated from the bottom, pressure contacts disposed between the semiconductor elements and said conductor bars, said conductor bars being formed of first sections of relatively large width associated with the pressure contacts, and second sections of relatively small width connected to said first sections, said first sections of said conductor bars being circular and having diameters being at least substantially equal to the diameter of the semiconductor elements, and said first sections of said conductor bars having a surface resting against the semiconductor elements, said first sections being lapped flat and uniformly roughened at least on said surface resting against the semiconductor elements.
Claim 2
Dependent Claim
163 words
Semiconductor component having a plurality of semiconductor elements disposed in a case, including a bottom of the case, and case terminals, comprising conductor bars electrically connecting the semiconductor elements to each other and to the case terminals, the semiconductor elements being in thermal and pressure contact with the bottom through at least one of said conductor bars and being electrically insulated from the bottom, pressure contacts disposed between the semiconductor elements and said conductor bars, said conductor bars being formed of first sections of relatively large width associated with the pressure contacts, and second sections of relatively small width connected to said first sections, said first sections of said conductor bars being circular and having diameters being at least substantially equal to the diameter of the semiconductor elements, and said first sections of said conductor bars having a surface resting against the semiconductor elements, said first sections being lapped flat and uniformly roughened at least on said surface resting against the semiconductor elements.
Claim 3
Dependent Claim
27 words
Semiconductor component according to claim 1, including extensions integral with said first sections of said conductor bars, said second sections being joined to said extensions by soldering.
Claim 4
Dependent Claim
23 words
Semiconductor component according to claim 2, wherein said second sections of said conductor bars are butted to said extensions at said solder joint.
Claim 5
Dependent Claim
41 words
Semiconductor component according to claim 1, wherein said second sections of said conductor bars are connected between the semiconductor elements and the case terminals and are at least substantially parallel to said first sections in the vicinity of said case terminals.