Solderable mounting stakes for heat sinks

Claim 2

A solderable stake for a heat sink comprising a unitary body formed from an essentially flat rectangular metal body, said body having a pair of cuts extending from opposite edges thereof aligned substantially along a common axis and the portion of the body on one side of said axis folded to form a shank; a base portion transverse to the axis of said shank supported by said shank; a further portion of said body having further cuts extending from the edge opposite said shank along lines substantially parallel with said shank to form a plurality of parallel fingers extending from said base substantially parallel with the axis of said shank but disposed on the opposite side of said base from said shank with said shank and said fingers extending in opposite directions from said base, at least one of said fingers being displaced from the remaining fingers to form therewith and said base a channel adapted to receive a heat sink; and a solderable coating on at least the shank portion of said unitary body.

Claim 3

A solderable stake as defined in claim 1 wherein said plurality of fingers is formed by cutting said body along at least two lines parallel with the axis of said shank to form at least three fingers, bending at least one of said fingers approximately 90° from the axis of said shank to form said base, and bending the remaining portion of said at least one finger approximately 90° to extend parallel with but spaced from the plane of the remaining said at least three fingers, thereby forming a plurality of parallel fingers extending from said base spaced apart by the width of said base.

Claim 4

A solderable stake as defined in claim 1 wherein the ends of said fingers opposite said base are flared outwardly from said channel.

Claim 5

A solderable stake as defined in claim 1 wherein at least one of said fingers includes a barb extending therefrom into said channel adapted to retain a heat sink body within said channel.

Claim 6

A solderable stake as defined in claim 1 wherein said shank is formed by cutting said flat metal body to define two oppositely disposed tabs and folding said tabs toward the central portion of said flat metal body, thereby forming a substantially cylindrical shank.

Claim 7

A solderable stake as defined in claim 1 wherein said unitary body is tin-plated.

Claim 8

The combination comprising: (a) a heat sink of thermally conductive material and having a generally flat base portion lying in a first plane; (b) means for securing a semiconductor encapsulation package adjacent and in intimate contact with said flat base portion of said heat sink and maintaining the leads extending from said package in a position substantially parallel with said first plane and extending beyond the edge of said heat sink; and (c) a solderable stake comprising a unitary body formed from an essentially flat rectangular metal body, said body having a pair of cuts extending from opposite edges thereof aligned substantially along a common axis and the portion of the body on one side of said axis folded to form a shank; a base portion transverse to the axis of said shank supported by said shank; a further portion of said body having further cuts extending from the edge opposite said shank along lines substantially parallel with said shank to form a plurality of parallel fingers extending from said base substantially parallel with the axis of said shank but disposed on the opposite side of said base from said shank with said shank and said fingers extending in opposite directions from said base, at least one of said fingers being displaced from the remaining fingers to form therewith and said base a channel in which an edge of said heat sink is secured with said shank extending from the edge of said heat sink in the same direction as said leads; and a solderable coating on at least the shank portion of said unitary body.

Claim 9

The combination comprising: (a) a heat sink of thermally conductive material and having a generally flat base portion lying in a first plane; (b) means for securing a semiconductor encapsulation package adjacent and in intimate contact with said flat base portion of said heat sink and maintaining the leads extending from said package in a position substantially parallel with said first plane and extending beyond the edge of said heat sink; and (c) a solderable stake comprising a unitary body formed from an essentially flat rectangular metal body, said body having a pair of cuts extending from opposite edges thereof aligned substantially along a common axis and the portion of the body on one side of said axis folded to form a shank; a base portion transverse to the axis of said shank supported by said shank; a further portion of said body having further cuts extending from the edge opposite said shank along lines substantially parallel with said shank to form a plurality of parallel fingers extending from said base substantially parallel with the axis of said shank but disposed on the opposite side of said base from said shank with said shank and said fingers extending in opposite directions from said base, at least one of said fingers being displaced from the remaining fingers to form therewith and said base a channel in which an edge of said heat sink is secured with said shank extending from the edge of said heat sink in the same direction as said leads; and a solderable coating on at least the shank portion of said unitary body.