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US4374707A Expired / Lapsed US ⏱️ 0.0 years remaining

Orifice plate for ink jet printing machines

Assignee: Xerox Corp
•
Filing: 1981-03-19
•
Granted: 1983-02-22
•
Expires: 2001-03-19
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Abstract

Abstract An orifice plate for use in ink jet printing machines is produced by an electroplating technique. The plate is bilaminar with nickel being plated onto copper to form a substantially rigid structure.

Inventors

  • 👤 Joel M. Pollack

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 23:52
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/16; B41J2/1621; B41J2/164; B41J2/1643; B41J2/162; B41J2/1626; B41J2/1631; C; C25; C25D; C25D1/00; C25D1/08; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12361; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 97 words
A method of producing an orifice plate for use in an ink jet printing system, including the steps of: providing a thin substrate attached to a thick support; forming a pattern of electrically insulated areas on the surface of the substrate opposed to the support; electroplating the uninsulated areas of the surface of the substrate opposed to the support; separating the substrate from the support; forming a pattern of chemically resistant areas on the nonelectroplated surface of the substrate to protect selected areas thereof; and dissolving the non-protected areas of the substrate to produce an orifice plate.
Claim 2
Independent Claim 97 words
A method of producing an orifice plate for use in an ink jet printing system, including the steps of: providing a thin substrate attached to a thick support; forming a pattern of electrically insulated areas on the surface of the substrate opposed to the support; electroplating the uninsulated areas of the surface of the substrate opposed to the support; separating the substrate from the support; forming a pattern of chemically resistant areas on the nonelectroplated surface of the substrate to protect selected areas thereof; and dissolving the non-protected areas of the substrate to produce an orifice plate.
Claim 3
Dependent Claim 25 words
A method according to claim 1, wherein said step of electroplating includes the step of electroplating inwardly across the top edges of the insulated areas.
Claim 4
Dependent Claim 24 words
A method according to claim 2, wherein said step of forming electrically insulated areas includes the step of forming cylindrical areas of electrical insulation.
Claim 5
Dependent Claim 36 words
A method according to claim 3, wherein said step of forming chemically resistant areas includes the step of forming non-chemically resistant cylindrical areas having a diameter greater than the diameter of the areas of electrical insulation.
Claim 6
Dependent Claim 30 words
A method according to claim 4, wherein said step of electroplating includes the step of electroplating with a material other than the substrate material to form a non-homogeneous orifice plate.
Claim 7
Dependent Claim 24 words
A method according to claim 5, wherein said step of providing includes the step of securing a copper substrate to a metal support plate.
Claim 8
Dependent Claim 24 words
A method according to claim 5, wherein said step of providing includes the step of securing a brass substrate to a metal support plate.
Claim 9
Independent Claim 26 words
A method according to claims 6 or 7, wherein said step of electroplating includes the step of electroplating with nickel to form a bilaminar orifice plate.
Claim 10
Dependent Claim 57 words
A method according to claim 8, wherein said step of forming chemically resistant areas includes the steps of: laminating a sheet film of resist to the non-electroplated surface of the substrate; exposing the resist to form a pattern of non-exposed circular areas thereon; developing the exposed areas of the resist; and dissolving the non-exposed areas of resist.
Claim 11
Dependent Claim 43 words
A method according to claim 9, wherein said step of dissolving the non-protected areas of the substrate includes etching the non-protected areas of the substrate to form circular apertures in the substrate substantially co-axial with the cylindrical areas in the nickel electroplated thereon.
Claim 12
Dependent Claim 31 words
A method according to claim 10, wherein said step of electroplating with nickel includes the step of electroplating a 1 mil thick layer of nickel on a 90 mil thick substrate.
Claim 13
Dependent Claim 33 words
A method according to claim 1, further including the step of passivating at least the electroplated material with a material chemically resistant to the ink composition used in the ink jet printing system.
Claim 14
Dependent Claim 20 words
A method according to claim 12, wherein said step of passivating includes the step of passivating with a gold alloy.
Claim 15
Dependent Claim 26 words
A method according to claim 1, further including the step of forming at least one groove in the substrate suitable for receiving a sealing member therein.
Claim 16
Dependent Claim 11 words
A bilaminar orifice plate produced by the method of claim 1.

References Cited (Backward Citations)

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US4033831A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-02-21 1986-08-23 1987-02-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-02-21 1990-08-23 1991-02-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-02-21 1994-08-23 1995-02-22 $7700.00 Window Closed / Lapsed

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