Patent US2527798A successfully refreshed from Google Patents.
US4367123A
Expired / Lapsed
US
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Precision spot plating process and apparatus
Assignee: Olin Corp
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Filing: 1981-10-22
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Granted: 1983-01-04
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Expires: 2001-10-22
Abstract
Abstract A process and apparatus for electroplating a spot of metal on a substrate and optionally a plurality of such spots in a desired arrangement. A column of electrolyte having a transverse cross-sectional shape corresponding about to the shape of the desired spot of metal to be plated is formed between an anode and the substrate which is connected as a cathode. The electrolyte is supplied by force of gravity with a desired hydrostatic head pressure. The substrate can be sequentially advanced to electrodeposit spots of metal at different points on the substrate.
Inventors
- 👤 Alexander F. Beck
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:41
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/02; C25D5/026; C25D5/08
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
184 words
An apparatus for selectively electroplating at least one spot of metal on a substrate, said apparatus comprising: means for electroplating said spot of metal on said substrate, said electroplating means comprising: an anode; means for forming an unmasked flowing column of electrolyte having no substantial fanning out and a transverse cross-section substantially corresponding to the shape of said spot extending between said anode and said substrate, said column of electrolyte having a width from about 0.25 millimeters to about 5 millimeters and a flow rate of about 0.5 milliliters per second to about 1.0 milliliters per second; said unmasked column forming means comprising a tubular nozzle having a nozzle outlet opening spaced from said substrate; means for supplying by gravity said electrolyte to said column forming means at a hydrostatic head pressure in the range of about 1 to 3 psi; means for connecting said substrate as a cathode; and means for applying a current to said anode and said cathode for depositing said spot of metal on said substrate whereby said spot has a dimension substantially approximating the size of said nozzle opening.
Claim 2
Independent Claim
184 words
An apparatus for selectively electroplating at least one spot of metal on a substrate, said apparatus comprising: means for electroplating said spot of metal on said substrate, said electroplating means comprising: an anode; means for forming an unmasked flowing column of electrolyte having no substantial fanning out and a transverse cross-section substantially corresponding to the shape of said spot extending between said anode and said substrate, said column of electrolyte having a width from about 0.25 millimeters to about 5 millimeters and a flow rate of about 0.5 milliliters per second to about 1.0 milliliters per second; said unmasked column forming means comprising a tubular nozzle having a nozzle outlet opening spaced from said substrate; means for supplying by gravity said electrolyte to said column forming means at a hydrostatic head pressure in the range of about 1 to 3 psi; means for connecting said substrate as a cathode; and means for applying a current to said anode and said cathode for depositing said spot of metal on said substrate whereby said spot has a dimension substantially approximating the size of said nozzle opening.
Claim 3
Dependent Claim
14 words
An apparatus as in claim 1 wherein said tubular nozzle also comprises said anode.
Claim 4
Dependent Claim
15 words
An apparatus as in claim 2 wherein said tubular nozzle comprises a metallic tubular member.
Claim 5
Dependent Claim
17 words
An apparatus as in claim 1 wherein said anode is located generally centrally of said tubular nozzle.
Claim 6
Dependent Claim
16 words
An apparatus as in claim 1 wherein said supply means includes an adjustable hydrostatic head pressure.
Claim 7
Dependent Claim
41 words
An apparatus as in claim 1 wherein said substrate comprises a strip of metal and further including means for sequentially advancing said strip of metal under said column forming means to form sequentially a plurality of said deposited spots of metal.
Claim 8
Dependent Claim
37 words
An apparatus as in claim 1 further including a plurality of unmasked column forming means communicating with said supply means, said plurality of column forming means being spaced apart one from the other in a desired arrangement.
Claim 9
Dependent Claim
17 words
An apparatus as in claim 1 further including means for recirculating spent electrolyte to said supply means.
Claim 10
Dependent Claim
41 words
An apparatus as in claim 7 wherein said substrate comprises a strip of metal and further including means for sequentially advancing said strip of metal under said column forming means to form sequentially a plurality of said deposited spots of metal.
Claim 11
Dependent Claim
181 words
A process for selectively electroplating at least one spot of metal on a substrate, said process comprising: electroplating said spot of metal on said substrate, said electroplating step comprising: providing an anode; forming an unmasked flowing column of electrolyte having no substantial fanning out and a transverse cross-section substantially corresponding to the shape of said spot extending between said anode and said substrate and having a width from about 0.25 millimeters to about 5 millimeters and a flow rate of about 0.5 milliliters per second to about 1.0 milliliters per second; said step of forming said unmasked flowing column of electrolyte comprising providing a tubular nozzle having a nozzle outlet opening and spacing said opening from said substrate; supplying by gravity said electrolyte for forming said column at a hydrostatic head pressure in the range of about 1 to 3 psi; connecting said substrate as a cathode; and applying a current to said anode and said cathode for depositing said spot of metal on said substrate so that said spot has a dimension substantially approximating the size of said nozzle opening.
Claim 12
Dependent Claim
181 words
A process for selectively electroplating at least one spot of metal on a substrate, said process comprising: electroplating said spot of metal on said substrate, said electroplating step comprising: providing an anode; forming an unmasked flowing column of electrolyte having no substantial fanning out and a transverse cross-section substantially corresponding to the shape of said spot extending between said anode and said substrate and having a width from about 0.25 millimeters to about 5 millimeters and a flow rate of about 0.5 milliliters per second to about 1.0 milliliters per second; said step of forming said unmasked flowing column of electrolyte comprising providing a tubular nozzle having a nozzle outlet opening and spacing said opening from said substrate; supplying by gravity said electrolyte for forming said column at a hydrostatic head pressure in the range of about 1 to 3 psi; connecting said substrate as a cathode; and applying a current to said anode and said cathode for depositing said spot of metal on said substrate so that said spot has a dimension substantially approximating the size of said nozzle opening.
Claim 13
Dependent Claim
13 words
A process as in claim 10 further including adjusting said hydrostatic head pressure.
Claim 14
Dependent Claim
42 words
A process as in claim 10 wherein said substrate comprises a strip of metal and further including the steps of sequentially advancing said strip of metal under said column of electrolyte to form sequentially a plurality of said deposited spots of metal.
Claim 15
Dependent Claim
32 words
A process as in claim 10 wherein said electroplating step comprises electroplating a plurality of spots of metal on said substrate simultaneously by forming a plurality of said flowing columns of electrolyte.
Claim 16
Dependent Claim
15 words
A process as in claim 10 further including recirculating spent electrolyte to a supply means.
Claim 17
Dependent Claim
26 words
The apparatus of claim 1 wherein: said electroplating means further comprises means for minimizing the amount of unnecessary plating; and said anode comprises an unmasked anode.
Claim 18
Dependent Claim
29 words
The process of claim 10 wherein: said electroplating step further comprises minimizing the amount of unnecessary plating; and said step of providing an anode comprises providing an unmasked anode.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-01-03 | 1986-07-05 | 1987-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-01-03 | 1990-07-05 | 1991-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-01-03 | 1994-07-05 | 1995-01-04 | $7700.00 | Window Closed / Lapsed |