Abstract An infrared detector array and its associated read-out conductors on a surate are covered with an electrically insulating photoresist layer. This layer is metalized, and a thin photoresist layer is applied atop the metal. The thin photoresist layer is exposed through a mask having perforations corresponding to the detectors of the array and to desired bonding lead regions on the conductors; when the layer is developed, regions of the metal are thus uncovered. These uncovered regions are then etched away and the insulating photoresist layer is exposed and developed, with the remaining metal acting as a mask. The thin photoresist layer may be stripped any time after the metal is etched. An array is produced in which regions above and closely around the detectors are uncovered, and regions on the read-out conductors are uncovered. Bonding leads may be applied to the read-out conductors in their exposed regions.
A method of applying a cold shield to an array of photodetectors and their associated read-out conductors on one side of a substrate, including the steps of: (a) coating said photodetector, said read-out conductors, and said one side substrate with an electrically insulating photoresist; (b) metalizing said photoresist; (c) applying atop the metal a thin layer of photoresist; (d) exposing said thin layer of photoresist through a mask having perforations corresponding to regions including and closely surrounding said photodetectors and to regions on said read-out conductors; (e) developing said thin layer to produce perforations therethrough in accordance with said mask whereby regions of said metal are uncovered; (f) etching through the perforations of said thin layer to remove the uncovered metal and to thus uncover regions of said electrically insulating photoresist; (g) exposing the uncovered regions of said electrically insulating photoresist; (h) developing said electrically insulating photoresist to uncover said regions including and closely surrounding said photodetectors and said regions on said read-out conductors, and (i) removing the thin layer from atop the metal.
Claim 2
Independent Claim
174 words
A method of applying a cold shield to an array of photodetectors and their associated read-out conductors on one side of a substrate, including the steps of: (a) coating said photodetector, said read-out conductors, and said one side substrate with an electrically insulating photoresist; (b) metalizing said photoresist; (c) applying atop the metal a thin layer of photoresist; (d) exposing said thin layer of photoresist through a mask having perforations corresponding to regions including and closely surrounding said photodetectors and to regions on said read-out conductors; (e) developing said thin layer to produce perforations therethrough in accordance with said mask whereby regions of said metal are uncovered; (f) etching through the perforations of said thin layer to remove the uncovered metal and to thus uncover regions of said electrically insulating photoresist; (g) exposing the uncovered regions of said electrically insulating photoresist; (h) developing said electrically insulating photoresist to uncover said regions including and closely surrounding said photodetectors and said regions on said read-out conductors, and (i) removing the thin layer from atop the metal.
Claim 3
Dependent Claim
13 words
The method as recite in claim 1 wherein step (i) preceeds step (g).