Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor

Claim 2

An assembly comprising: a printed circuit board comprising a molded thermoplastic substrate having printed circuit lead-contact areas deposited on a mounting surface of the substrate; a plurality of preformed molded thermoplastic pins integral with said substrate and molded concurrently therewith to form extensions thereof, said pins each projecting outward of the adjacent outermost surface areas of said mounting surface, and each being disposed adjacent to positions where an electrical component is to be received so as to be supportively backed by part of said substrate; and an electrical component having leads projecting therefrom as portions thereof and mounted on the substrate so that portions of the component are located outward of the adjacent outermost surface areas of said mounting surface and adjacent to outer portions of the pins, and so that portions of the component leads are aligned with the contact areas of the printed circuit, the pins having at their outer ends plastic locking portions formed about said adjacent portions of the component by deformation of said ends after mounting of said component on said substrate so as to render said component simultaneously engaged on opposite sides thereof by, respectively, said locking portions and a firm seat provided for said component on the substrate side thereof, and so as by such simultaneous engagement to provide a fastening without play of said component to said substrate; and the component leads being attached to the contact areas.

Claim 3

An assembly as recited in claim 1, wherein the mounting surface of the substrate is formed with a pocket for receiving and locating a body portion of the component with respect to the printed-circuit lead-contact areas deposited on the mounting surface of the substrate.

Claim 4

An assembly as recited in claim 2 wherein the component leads project from the body portion; wherein the pocket is so formed and located that the leads extend from the body portion along the mounting surface of the substrate to positions overlapping the associated lead-contact areas of the printed circuit patterns; and wherein portions of the leads are attached to the contact areas.

Claim 5

An assembly as recited in claim 3, wherein the mounting surface of the substrate is also formed with grooves for receiving and aligning the leads with respect to the patterns.

Claim 6

An assembly as recited in claim 4 wherein portions of the grooves are coated with the printed-circuit conductor material to define the lead-contact areas in the grooves.

Claim 7

An assembly as recited in claim 4, wherein the component leads are cylindrical, and the grooves are arcuate grooves shaped to fit and make substantial surface contact with the leads.

Claim 8

An assembly as recited in any of claims 3, 4 or 5, wherein the leads are attached to the contact areas by reflow soldering.

Claim 9

An assembly as recited in claim 1, wherein at least two pins are positioned across from each other, and wherein end portions of the material from the two pins are molded together to form a joint locking section covering and bridging the adjacent portion of the component.

Claim 10

An assembly comprising: a printed circuit substrate composed of a molded thermoplastic material and having a component-mounting surface; an electrical component mounted on the substrate and having a body portion and axially extending leads, the substrate further having a pocket formed in the mounting surface for receiving and locating the body portion of the component with respect to the substrate so that the component leads extend along the mounting surface and so that at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface; a plurality of preformed molded thermoplastic studs integral with said substrate and molded concurrently therewith as extensions thereof, said studs projecting outwardly of adjacent outermost surface areas of said mounting surface at spaced positions adjacent to selected portions of the component received in the pocket so as to be supportively backed by part of said substrate providing the bottom of said pocket, the studs at their outer ends having locking portions formed about said selected adjacent portions of the component by deformation of said ends after mounting of said component on said substrate so as to render said component simultaneously engaged on its opposite sides by, respectively, said stud locking portions and a firm seat provided for said component on the substrate side thereof at the bottom of said pocket, and so as by such simultaneous engagement to provide a fastening without play of such component to said substrate; a printed circuit conductor pattern deposited on the mounting surface and including lead-contact areas that are overlapped by portions of the leads of the component; and means for attaching the leads to the contact areas of the conductor pattern.

Claim 11

An assembly comprising: a printed circuit substrate composed of a molded thermoplastic material and having a component-mounting surface; an electrical component mounted on the substrate and having a body portion and axially extending leads, the substrate further having a pocket formed in the mounting surface for receiving and locating the body portion of the component with respect to the substrate so that the component leads extend along the mounting surface and so that at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface; a plurality of preformed molded thermoplastic studs integral with said substrate and molded concurrently therewith as extensions thereof, said studs projecting outwardly of adjacent outermost surface areas of said mounting surface at spaced positions adjacent to selected portions of the component received in the pocket so as to be supportively backed by part of said substrate providing the bottom of said pocket, the studs at their outer ends having locking portions formed about said selected adjacent portions of the component by deformation of said ends after mounting of said component on said substrate so as to render said component simultaneously engaged on its opposite sides by, respectively, said stud locking portions and a firm seat provided for said component on the substrate side thereof at the bottom of said pocket, and so as by such simultaneous engagement to provide a fastening without play of such component to said substrate; a printed circuit conductor pattern deposited on the mounting surface and including lead-contact areas that are overlapped by portions of the leads of the component; and means for attaching the leads to the contact areas of the conductor pattern.

Claim 12

A printed circuit board structure having component parts capable of being assembled with an electrical component having leads projecting therefrom, which comprises: a molded thermoplastic substrate having printed circuit lead-contact areas deposited on a mounting surface of the substrate, on which mounting surface the component is adapted to be placed in a desired position at which at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface, and in which portions of the component leads are aligned with the lead-contact areas; and a plurality of preformed molded thermoplastic pins integral with said substrate and molded concurrently therewith as extensions thereof, said pins projecting outwardly of the adjacent outermost surface areas of the mounting surface of the substrate to have the outer ends of the pins at positions adjacent to portions of the component which are adapted to be supportively backed by part of said substrate when the component is placed on the substrate, the pins having end portions adapted to be heated and formed about the adjacent portions of the component so as to form plastic locking portions, adapted to render said component engaged simultaneously on its opposite sides by, respectively, said locking portions and a firm seat provided for said component on the substrate side thereof, and so as, by such simultaneous engagement to provide a fastening without play of said component to said substrate.

Claim 13

A printed circuit board structure having component parts capable of being assembled with an electrical component having leads projecting therefrom, which comprises: a molded thermoplastic substrate having printed circuit lead-contact areas deposited on a mounting surface of the substrate, on which mounting surface the component is adapted to be placed in a desired position at which at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface, and in which portions of the component leads are aligned with the lead-contact areas; and a plurality of preformed molded thermoplastic pins integral with said substrate and molded concurrently therewith as extensions thereof, said pins projecting outwardly of the adjacent outermost surface areas of the mounting surface of the substrate to have the outer ends of the pins at positions adjacent to portions of the component which are adapted to be supportively backed by part of said substrate when the component is placed on the substrate, the pins having end portions adapted to be heated and formed about the adjacent portions of the component so as to form plastic locking portions, adapted to render said component engaged simultaneously on its opposite sides by, respectively, said locking portions and a firm seat provided for said component on the substrate side thereof, and so as, by such simultaneous engagement to provide a fastening without play of said component to said substrate.

Claim 14

A structure as recited in claim 10, wherein the mounting surface of the substrate is also formed with a pocket adapted to receive and locate a body portion of the component with respect to the lead-contact areas on the mounting surface of the substrate, so that the component leads extend along the mounting surface to positions overlapping the associated lead contact areas.