Prevention of adhesion of epoxy resins

Claim 1

A method for coating an electrical product having an electrically conductive lead wire comprising: coating onto said electrically conductive lead wire an aqueous suspension or an organic solution consisting essentially of a polymer of (a) at least one C 4 to C 21 perfluoroalkyl group-containing polymerizable compound selected from the group consisting of: ##STR20## wherein R f is a C 4 to C 21 perfluoroalkyl group, R is a hydrogen atom or a C 1 to C 10 alkyl group, R' is a C 1 to C 10 alkylene group, R" is a hydrogen atom or a methyl group, R"' is a C 1 to C 17 alkyl group and n is an integer of 1 to 10, with or without (b) at least one compound copolymerizable therewith, the content of the component (a) being not less than 40% by weight based on the weight of the polymer and (c) a solvent selected from the group consisting of an organic solvent and water to thereby form a polymer coating on said lead wires; drying said polymer coating; and applying an epoxy resin to said article whereby the adhesion of epoxy resin to said polymer coated lead wires is prevented and whereby no material influence is exerted upon the soldering properties of said electrically conductive lead wire.

Claim 2

A method for coating an electrical product having an electrically conductive lead wire comprising: coating onto said electrically conductive lead wire an aqueous suspension or an organic solution consisting essentially of a polymer of (a) at least one C 4 to C 21 perfluoroalkyl group-containing polymerizable compound selected from the group consisting of: ##STR20## wherein R f is a C 4 to C 21 perfluoroalkyl group, R is a hydrogen atom or a C 1 to C 10 alkyl group, R' is a C 1 to C 10 alkylene group, R" is a hydrogen atom or a methyl group, R"' is a C 1 to C 17 alkyl group and n is an integer of 1 to 10, with or without (b) at least one compound copolymerizable therewith, the content of the component (a) being not less than 40% by weight based on the weight of the polymer and (c) a solvent selected from the group consisting of an organic solvent and water to thereby form a polymer coating on said lead wires; drying said polymer coating; and applying an epoxy resin to said article whereby the adhesion of epoxy resin to said polymer coated lead wires is prevented and whereby no material influence is exerted upon the soldering properties of said electrically conductive lead wire.

Claim 11

A method for encapsulating an electrical product having an electrically conductive lead wire comprising the steps of: coating onto said electrically conductive lead wire an aqueous suspension or an organic solution consisting essentially of a polymer of (a) at least one C 4 to C 21 perfluoroalkyl group-containing polymerizable compound selected from the group consisting of: ##STR21## wherein R f is a C 4 to C 21 perfluoroalkyl group, R is a hydrogen atom or a C 1 to C 10 alkyl group, R' is a C 1 to C 10 alkylene group, R" is a hydrogen atom or a methyl group, R"' is a C 1 to C 17 alkyl group and n is an integer of 1 to 10, and (b) at least one compound copolymerizable therewith selected from the group consisting of acrylic and methacrylic acid and esters thereof, vinyl esters of fatty acids, styrene compounds, halogenated vinyl or vinylidene compounds, allyl esters of fatty acids, vinyl alkyl ketones, acrylamides and dienes, the content of the component (a) being not less than 40% by weight based on the weight of the polymer and (c) a solvent selected from the group consisting of an organic solvent and water to thereby form a polymer coating on said lead wires; drying said polymer coating; and encapsulating said electrical product in an epoxy resin whereby adhesion of epoxy resin to said polymer coated lead wires is prevented and whereby no material influence is exerted upon the soldering properties of said electrically conductive lead wire.

Claim 12

A method for encapsulating an electrical product having an electrically conductive lead wire comprising the steps of: coating onto said electrically conductive lead wire an aqueous suspension or an organic solution consisting essentially of a polymer of (a) at least one C 4 to C 21 perfluoroalkyl group-containing polymerizable compound selected from the group consisting of: ##STR21## wherein R f is a C 4 to C 21 perfluoroalkyl group, R is a hydrogen atom or a C 1 to C 10 alkyl group, R' is a C 1 to C 10 alkylene group, R" is a hydrogen atom or a methyl group, R"' is a C 1 to C 17 alkyl group and n is an integer of 1 to 10, and (b) at least one compound copolymerizable therewith selected from the group consisting of acrylic and methacrylic acid and esters thereof, vinyl esters of fatty acids, styrene compounds, halogenated vinyl or vinylidene compounds, allyl esters of fatty acids, vinyl alkyl ketones, acrylamides and dienes, the content of the component (a) being not less than 40% by weight based on the weight of the polymer and (c) a solvent selected from the group consisting of an organic solvent and water to thereby form a polymer coating on said lead wires; drying said polymer coating; and encapsulating said electrical product in an epoxy resin whereby adhesion of epoxy resin to said polymer coated lead wires is prevented and whereby no material influence is exerted upon the soldering properties of said electrically conductive lead wire.