US4345955A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacturing multilayer ceramic chip carrier modules
Assignee: FCI Americas Technology LLC
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Filing: 1981-10-02
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Granted: 1982-08-24
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Expires: 2001-10-02
Abstract
Abstract Preparing multilayer ceramic (MLC) modules by injection molding a mixture of a fine particulate such as alumina and a binder into a mold containing predesigned ridges and pins. The product is a green body layer of ceramic containing grooves and vias that is thereafter metallized with a conductive paste and laminated to other like layers of ceramic. Solvent extraction of the binder and sintering of the MLC forms the module.
Inventors
- 👤 Frank C. Bakermans
- 👤 Lee R. Conrad
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 09:36
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/638; C04B41/45; C04B41/50; C04B41/51; C04B41/53; C04B41/80; C04B41/81; C04B41/85; C04B41/88; C04B41/91; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/0011; H05K3/0014; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
139 words
A process for producing a multilayer ceramic module for use with integrated circuits comprising: (a) mixing together a nonconductive particulate material suitable for preparing a ceramic body with a binder at a temperature above the melting point of the binder and injecting said mixture into a mold containing predesigned ridges, heating and pressuring said mixture in the mold and then causing said binder to be hardened by cooling to form a ceramic "green body" layer, (b) applying a conductive paste to the formed ceramic layer, (c) pressing together two or more of said layers to form a module, (d) exposing said green body in a vapor of a solvent for said binder and thereafter a bath of a liquid solvent for said binder maintained at a temperature above the melting point of said binder, and (e) sintering said module.
Claim 2
Dependent Claim
139 words
A process for producing a multilayer ceramic module for use with integrated circuits comprising: (a) mixing together a nonconductive particulate material suitable for preparing a ceramic body with a binder at a temperature above the melting point of the binder and injecting said mixture into a mold containing predesigned ridges, heating and pressuring said mixture in the mold and then causing said binder to be hardened by cooling to form a ceramic "green body" layer, (b) applying a conductive paste to the formed ceramic layer, (c) pressing together two or more of said layers to form a module, (d) exposing said green body in a vapor of a solvent for said binder and thereafter a bath of a liquid solvent for said binder maintained at a temperature above the melting point of said binder, and (e) sintering said module.
Claim 3
Dependent Claim
32 words
The process according to claim 1 in which the nonconductive particulate material is 60 to 90 percent by weight alumina and the binder is present at 10 to 40 percent by weight.
Claim 4
Dependent Claim
27 words
The process according to claims 1 or 2 in which the conductive paste contains tungsten and is screen printed into grooves and vias in the ceramic layer.
Claim 5
Dependent Claim
26 words
The process according to claims 1 or 2 wherein the conductive paste contains molybdenum and is screen printed into grooves and vias in the ceramic layer.
Claim 6
Dependent Claim
31 words
The process according to claim 1 in which the ceramic is barium titanate and the conductive paste contains gold and is screen printed into grooves and vias in the ceramic layer.
Claim 7
Dependent Claim
15 words
The process according to claims 1 or 2 in which the solvent employed is cumene.
Claim 8
Dependent Claim
18 words
The process according to claims 1 or 2 in which the conductive paste is applied by doctor blading.
Claim 9
Dependent Claim
40 words
The process according to claims 1 or 2 in which the binder is a mixture of polyethylene with a melt index of 14 and an organic oil derived from living plant materials and the conductive paste contains tungsten or molybdenum.
Claim 10
Dependent Claim
35 words
The process according to claims 1 or 2 in which the binder is a mixture of Carnauba wax and an organic oil derived from living plant materials and the conductive paste contains tungsten or molybdenum.
Claim 11
Dependent Claim
122 words
A process for producing a multilayer ceramic module for use with integrated circuits comprising: (a) mixing together a nonconductive particulate material suitable for preparing a ceramic body with a binder at a temperature above the melting point of the binder and injecting said mixture into a mold containing predesigned ridges, heating and pressuring said mixture in the mold and then causing said binder to be hardened by cooling to form a ceramic "green body" layer, (b) applying a conductive paste to the formed ceramic layer, (c) pressing together two or more of said layers to form a module, (d) exposing said green body at a temperature and for a time period sufficient to burn out said binder, and (e) sintering said module.
Claim 12
Dependent Claim
122 words
A process for producing a multilayer ceramic module for use with integrated circuits comprising: (a) mixing together a nonconductive particulate material suitable for preparing a ceramic body with a binder at a temperature above the melting point of the binder and injecting said mixture into a mold containing predesigned ridges, heating and pressuring said mixture in the mold and then causing said binder to be hardened by cooling to form a ceramic "green body" layer, (b) applying a conductive paste to the formed ceramic layer, (c) pressing together two or more of said layers to form a module, (d) exposing said green body at a temperature and for a time period sufficient to burn out said binder, and (e) sintering said module.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-08-23 | 1986-02-22 | 1986-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-08-23 | 1990-02-22 | 1990-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-08-23 | 1994-02-22 | 1994-08-24 | $7700.00 | Window Closed / Lapsed |