Abrasion-resistant screen-printed potentiometer

Claim 2

An abrasion-resistant potentiometer, comprising: a substrate; a first continuous resistive layer formed on said substrate and having a surface opposite to said substrate; a second continuous and self-lubricating resistive layer formed substantially on the entire surface of said first resistive layer, the resistivity of said second resistive layer being substantially greater than the resistivity of said first resistive layer; and a slide arm in pressure contact with said second resistive layer and slidably movable thereacross.

Claim 3

An abrasion-resistant potentiometer in accordance with claim 1, wherein said second resistive layer contains graphite.

Claim 4

An abrasion-resistant potentiometer in accordance with claim 1, wherein the resistivity of said second layer is at least ten times as great as the resistivity of said first resistive layer.

Claim 5

An abrasion-resistant potentiometer in accordance with claim 1, wherein at least one of said first and second resistive layers is formed of a conductive ink.

Claim 6

An abrasion-resistant potentiometer in accordance with claim 4, wherein both of said resistive layers are formed of conductive ink.

Claim 7

An abrasion-resistant potentiometer in accordance with claim 5, wherein said second resistive layer has a thickness of 1/2 to 2 mils.

Claim 8

An abrasion-resistant potentiometer in accordance with claim 6, wherein said first resistive layer has a thicknesss of 1/2 to 2 mils.

Claim 9

An abrasion-resistant potentiometer in accordance with claim 1, wherein said second resistive layer is formed of an ink comprising: 60/40 Polyester/Diethyleneglycolmonobutylether, graphite powder and silica powder.

Claim 10

An abrasion-resistant potentiometer in accordance with claim 8, wherein said first resistive layer is formed of an ink comprising: 60/40 Polyester/Diethyleneglycolmonobutylether, brown tungsten oxide and blue tungsten oxide.

Claim 11

A process for forming an abrasion-resistant potentiometer, comprising the steps of: providing a substrate having a surface; forming a continuous bottom resistive layer on the substrate surface; forming a self-lubricating, continuous top resistive layer substantially on the entire surface of the opposite side of said bottom resistive layer from said substrate, the resistivity of said top resistive layer being substantially greater than the resistivity of said bottom resistive layer; and placing a slide arm in pressure contact with a surface of said top resistive layer furthest from said substrate and in such a manner that said slide arm is slidably movable across said top resistive layer surface.

Claim 12

A process for forming an abrasion-resistant potentiometer, comprising the steps of: providing a substrate having a surface; forming a continuous bottom resistive layer on the substrate surface; forming a self-lubricating, continuous top resistive layer substantially on the entire surface of the opposite side of said bottom resistive layer from said substrate, the resistivity of said top resistive layer being substantially greater than the resistivity of said bottom resistive layer; and placing a slide arm in pressure contact with a surface of said top resistive layer furthest from said substrate and in such a manner that said slide arm is slidably movable across said top resistive layer surface.

Claim 13

The process of claim 10, wherein said top resistive layer contains graphite.

Claim 14

A process according to claim 10, wherein the resistivity of said top layer is at least ten times as great as the resistivity of said bottom layer.

Claim 15

A process according to claim 10, wherein said step of forming said bottom resistive layer includes the step of depositing a conductive ink on said substrate surface, and wherein said step of forming said top resistive layer includes the step of depositing a conductive ink on said bottom resistive layer surface.

Claim 16

A process according to claim 13, wherein said top resistive layer has a thickness of 1/2 to 2 mils.

Claim 17

A process according to claim 14, wherein said bottom resistive layer has a thickness of 1/2 to 2 mils.

Claim 18

A process according to claim 10, wherein said step of forming said top resistive layer on said bottom resistive layer surface comprises the step of depositing a conductive ink including 60/40 Polyester/Diethyleneglycolmonobutylether, graphite powder and silica powder on said bottom resistive layer.

Claim 19

A process according to claim 16, wherein said step of forming said bottom resistive layer on said substrate surface comprises the step of depositing a conductive ink comprising 60/40 Polyester/Diethyleneglycolmonobutylether, brown tungsten oxide and blue tungsten oxide on said substrate surface.