US4340618A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming refractory metal layers on ceramic substrate
Assignee: International Business Machines Corp
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Filing: 1981-03-20
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Granted: 1982-07-20
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Expires: 2001-03-20
Abstract
Abstract A process for forming a substantially glass free surface on screened refractory metallurgy areas on a ceramic substrate wherein a thin layer of Pd is deposited over the metallurgy areas and the metallurgy areas subsequently sintered causing the surface refractory metal particles to be fused into a substantially solid metallurgy layer under the catalyzing influence of the Pd.
Inventors
- 👤 Michael A. Fury
- 👤 Ananda H. Kumar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 12:40
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/52; C04B41/80; C04B41/81; C04B41/89; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/10; H05K3/14; H05K3/146; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
99 words
A process of forming a glass free surface on refractory metallurgy pads on ceramic substrate, comprising depositing by screening techniques a refractory metallurgy layer on a ceramic substrate, the metal of said layer selected from the group consisting of Mo, W and Ta, depositing a thin layer of Pd on at least the surface of said metallurgy layer of a thickness that is approximately 40-50 angstroms per each mil thickness of said metallurgy layer, exposing said substrate to a sintering temperature for a time sufficient to sinter the metallurgy layer and also to fuse the layer to said substrate.
Claim 2
Dependent Claim
99 words
A process of forming a glass free surface on refractory metallurgy pads on ceramic substrate, comprising depositing by screening techniques a refractory metallurgy layer on a ceramic substrate, the metal of said layer selected from the group consisting of Mo, W and Ta, depositing a thin layer of Pd on at least the surface of said metallurgy layer of a thickness that is approximately 40-50 angstroms per each mil thickness of said metallurgy layer, exposing said substrate to a sintering temperature for a time sufficient to sinter the metallurgy layer and also to fuse the layer to said substrate.
Claim 3
Dependent Claim
30 words
The process of claim 1 wherein said metallurgy layer is deposited on an unsintered ceramic substrate, and the ceramic material of said substrate is sintered simultaneously with said metallurgy layer.
Claim 4
Dependent Claim
16 words
The process of claim 1 wherein said metallurgy layer is deposited on a sintered ceramic substrate.
Claim 5
Dependent Claim
20 words
The process of claim 1 wherein said metallurgy layer has a thickness in the range of 0.5 to 5 mil.
Claim 6
Dependent Claim
20 words
The process of claim 4 wherein said Pd layer has a thickness in the range of 30 to 600 Angstroms.
Claim 7
Dependent Claim
14 words
The process of claim 5 wherein said Pd layer is deposited by evaporation techniques.
Claim 8
Dependent Claim
20 words
The process of claim 5 wherein said Pd layer is a blanket layer over the top surface of said substrate.
Claim 9
Dependent Claim
20 words
The process of claim 1 wherein said Pd layer is a blanket layer over the top surface of said substrate.
Claim 10
Dependent Claim
12 words
The process of claim 1 wherein said refractory metallurgy layer is Mo.
Claim 11
Dependent Claim
19 words
The process of claim 9 wherein said metallurgy layer includes from 0 to 5% of glass frit by weight.
Claim 12
Dependent Claim
20 words
The process of claim 1 wherein a Ni layer is deposited over the sintered metallurgy layer by electroless deposition techniques.
Claim 13
Dependent Claim
33 words
The process of claim 1 wherein a layer of braze metal is melted over said metallurgy layer, said braze metal selected from the group consisting of Cu, Au, Pb, Sn and alloys thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-07-19 | 1986-01-18 | 1986-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-07-19 | 1990-01-18 | 1990-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-07-19 | 1994-01-18 | 1994-07-20 | $7700.00 | Window Closed / Lapsed |