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US4339564A Expired / Lapsed US ⏱️ 0.0 years remaining

Heat curable organopolysiloxane compositions

Assignee: Shin-Etsu Chemical Co Ltd
•
Filing: 1980-09-23
•
Granted: 1982-07-13
•
Expires: 2000-09-23
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Abstract

Abstract The invention provides a novel heat curable organopolysiloxane composition capable of giving a cured product having a remarkably high hardness and excellent anti-crack resistance. The cured product is also free from surface tackiness even by heat-curing in air. The main component of the composition is an organopolysiloxane having vinyl groups, phenyl groups and silicon-bonded hydrogen atoms simultaneously in a molecule or a mixture thereof with a second organopolysiloxane having vinyl groups and phenyl groups but no silicon-bonded hydrogen atoms in the molecule. It is essential that the molar ratios of the vinyl groups, phenyl groups, silicon-bonded hydrogen atoms and, if any, alkyl groups in the organopolysiloxane or organopolysiloxanes to the silicon atoms must be within specifically defined ranges and the organopolysiloxane component is admixed with a platinum catalyst for the addition reaction between the vinyl groups and the silicon-bonded hydrogen atoms as well as an organic peroxide such as dicumyl peroxide.

Inventors

  • 👤 Yoshio Okamura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 05:59
CPC Classifications
C; C08; C08G; C08G77/00; C08G77/04; C08G77/20; C08G77/12; C08L; C08L83/00; C08L83/04; C08G77/70

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 167 words
A heat curable organopolysiloxane composition which comprises (a) an organopolysiloxane having, in a molecule, each at least one vinyl group, phenyl group and hydrogen atom directly bonded to silicon atoms or a mixture thereof with a second organopolysiloxane having, in a molecule, each at least one vinyl group and phenyl group but having no hydrogen atoms directly bonded to the silicon atoms where each of the organopolysiloxanes may have at least one alkyl group in a molecule and the molar ratios of the vinyl groups, phenyl groups, hydrogen atoms directly bonded to the silicon atoms and, if any, alkyl groups to the silicon atoms satisfy the following relations: vinyl groups/silicon atoms=0.15 to 0.4; phenyl groups/silicon atoms=0.4 to 1.1; silicon-bonded hydrogen atoms/silicon atoms=0.1 to 0.4; alkyl groups/silicon atoms=0 to 1.65; and (vinyl groups/silicon atoms)+(phenyl groups/silicon atoms)+(silicon-bonded hydrogen atoms/silicon atoms)+(alkyl groups/silicon atoms)=1.5 to 2.3, (b) a catalyst for the addition reaction between the vinyl groups and the silicon-bonded hydrogen atoms in the component (a), and (c) an organic peroxide.
Claim 2
Dependent Claim 167 words
A heat curable organopolysiloxane composition which comprises (a) an organopolysiloxane having, in a molecule, each at least one vinyl group, phenyl group and hydrogen atom directly bonded to silicon atoms or a mixture thereof with a second organopolysiloxane having, in a molecule, each at least one vinyl group and phenyl group but having no hydrogen atoms directly bonded to the silicon atoms where each of the organopolysiloxanes may have at least one alkyl group in a molecule and the molar ratios of the vinyl groups, phenyl groups, hydrogen atoms directly bonded to the silicon atoms and, if any, alkyl groups to the silicon atoms satisfy the following relations: vinyl groups/silicon atoms=0.15 to 0.4; phenyl groups/silicon atoms=0.4 to 1.1; silicon-bonded hydrogen atoms/silicon atoms=0.1 to 0.4; alkyl groups/silicon atoms=0 to 1.65; and (vinyl groups/silicon atoms)+(phenyl groups/silicon atoms)+(silicon-bonded hydrogen atoms/silicon atoms)+(alkyl groups/silicon atoms)=1.5 to 2.3, (b) a catalyst for the addition reaction between the vinyl groups and the silicon-bonded hydrogen atoms in the component (a), and (c) an organic peroxide.
Claim 3
Dependent Claim 20 words
The heat curable organopolysiloxane composition as claimed in claim 1 wherein the catalyst as the component (b) is chloroplatinic acid.
Claim 4
Dependent Claim 17 words
The heat curable organopolysiloxane composition as claimed in claim 1 wherein the organic peroxide is dicumyl peroxide.
Claim 5
Dependent Claim 41 words
The heat curable organopolysiloxane composition as claimed in claim 1 wherein the amount of the organic peroxide as the component (c) is in the range from 0.1 to 3 parts by weight per 100 parts by weight of the component (a).

References Cited (Backward Citations)

US3159601A Cited
US3159662A Cited
US3220972A Cited
US4234713A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-07-12 1986-01-11 1986-07-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-07-12 1990-01-11 1990-07-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-07-12 1994-01-11 1994-07-13 $7700.00 Window Closed / Lapsed

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