Ceramic-metal assembly

Claim 1

An assembly comprising a metallic component and a nonoxidic ceramic component supported by said metallic component; said metallic component having an opening therein and a recess communicating with said opening, said recess being defined by at least two opposite inwardly facing surfaces; said ceramic component having a base portion disposed in said recess and a second portion projecting out of said recess through said opening, wherein said base portion and said surfaces define a gap therebetween for spacing said base portion from said metallic component; said assembly further comprising a high temperature solder filling said gaps, said solder being applied in liquid form at elevated temperature, wherein said solder and said metallic component, due to the elevated application temperature and differences in thermal coefficients of expansion between said solder and metallic component and said ceramic component, are shrunk fit around said base portion for applying compressive stresses to said base portion, and wherein said metallic component has a reduced cross-sectional thickness normal to said surfaces in the region of said opening, said reduced thickness being effective to cause plastic deformation in said region of said metallic component, and to reduce the compressive stress, in said region, of said metallic component against said base portion, thereby reducing the tensile stresses on said ceramic component and producing a connection between said components capable of withstanding high thermal and mechanical stresses.