US4332343A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for in-situ modification of solder comopsition
Assignee: International Business Machines Corp
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Filing: 1980-04-10
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Granted: 1982-06-01
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Expires: 2000-04-10
Abstract
Abstract Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints.
Inventors
- 👤 Nicholas G. Koopman
- 👤 Vincent C. Marcotte
- 👤 Stephen Teed
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 10:50
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268; B23K35/36; B23K35/3612; B23K35/3618; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/346; H05K3/3489; H10W72/071; H10W72/072; H10W72/07251; H10W72/251; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
86 words
A method for in-situ altering the composition of solder alloys containing wetting agents selected from the group of tin and indium comprising fluxing a said solder alloy in its molten form for sufficient time with at least one acid selected from the monocarboxylic acids of alkylated hydrophenanthrene nuclei having the empirical formula C 19 H 29 COOH, to remove said wetting agents from said molten solder and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
Claim 2
Independent Claim
86 words
A method for in-situ altering the composition of solder alloys containing wetting agents selected from the group of tin and indium comprising fluxing a said solder alloy in its molten form for sufficient time with at least one acid selected from the monocarboxylic acids of alkylated hydrophenanthrene nuclei having the empirical formula C 19 H 29 COOH, to remove said wetting agents from said molten solder and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
Claim 3
Dependent Claim
16 words
A method of claim 1 wherein said acids are in the form of water white rosin.
Claim 4
Independent Claim
82 words
A method for in-situ altering the composition of solder alloys containing wetting agents selected from the group of tin and indium comprising: applying said solder alloys between solderable parts, to be joined together, at a temperature above the melting point of said solder alloy, and fluxing said solder alloy in molten form for a time sufficient to remove said wetting agents therefrom and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
Claim 5
Independent Claim
82 words
A method for in-situ altering the composition of solder alloys containing wetting agents selected from the group of tin and indium comprising: applying said solder alloys between solderable parts, to be joined together, at a temperature above the melting point of said solder alloy, and fluxing said solder alloy in molten form for a time sufficient to remove said wetting agents therefrom and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
Claim 6
Dependent Claim
50 words
The method of claim 3 wherein said solder is fluxed for a time at said temperature to remove sufficient amount of said wetting agents to shift the composition of said molten solder at said temperature to a point on the solidus curve of the phase diagram of said solder alloy.
Claim 7
Independent Claim
38 words
The method of claims 1, 2, 3 or 4 wherein solder alloys join a semiconductor device to a supporting dielectric substrate wherein the circuit configuration of said device is electrically interconnected to a circuit pattern of said substrate.
Claim 8
Independent Claim
74 words
A method for in-situ altering the composition of solder alloys containing wetting agents comprising: applying said solder alloy between solderable parts, to be joined together, at a temperature above the melting point of said solder alloy, and fluxing said solder alloy in molten form for a time sufficient to remove said wetting agents therefrom and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
Claim 9
Independent Claim
74 words
A method for in-situ altering the composition of solder alloys containing wetting agents comprising: applying said solder alloy between solderable parts, to be joined together, at a temperature above the melting point of said solder alloy, and fluxing said solder alloy in molten form for a time sufficient to remove said wetting agents therefrom and to materially reduce to less than 90% of the original content of said wetting agents in said molten solder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-31 | 1985-11-30 | 1986-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-31 | 1989-11-30 | 1990-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-31 | 1993-11-30 | 1994-06-01 | $7700.00 | Window Closed / Lapsed |