Abstract Fast surface states in MOS devices, such as SCCDs, are reduced by depositing a relatively thin amorphous layer containing silicon and hydrogen onto the SiO 2 surface of such devices and annealing the resultant device in a non-oxidizing atmosphere for brief periods of time at a temperature in excess of the deposition temperature for the amorphous layer but below about 500° C. so that free valences at the Si-SiO 2 interface region are saturated with hydrogen. Surface state densities of about 4×10 8 cm -2 eV -1 and SCCDs having ε=1.10 -5 can be achieved via this process. The process is useful in producing SCCDs with low surface state densities and other MOS devices having low surface generated dark currents.
A process for reducing the density of fast surface states in MOS devices, such as surface-charge-coupled devices (SCCDs), comprising: providing a MOS device having a Si-SiO 2 interface region with the SiO 2 defining a free surface of such device and having electrodes therein; depositing a relatively thin amorphous layer comprised of silicon, hydrogen and nitrogen from a reaction gas comprised of silanium and a nitrogen-containing gas at a given deposition temperature onto said SiO 2 free surface of the device; and annealing the resultant structure in a non-oxidizing atmosphere for a relatively brief period of time at a temperature in excess of said given deposition temperature and below about 500° C. whereby free valences at the Si-SiO 2 interface region are saturated with hydrogen and the density of fast surface states is reduced.
Claim 2
Dependent Claim
134 words
A process for reducing the density of fast surface states in MOS devices, such as surface-charge-coupled devices (SCCDs), comprising: providing a MOS device having a Si-SiO 2 interface region with the SiO 2 defining a free surface of such device and having electrodes therein; depositing a relatively thin amorphous layer comprised of silicon, hydrogen and nitrogen from a reaction gas comprised of silanium and a nitrogen-containing gas at a given deposition temperature onto said SiO 2 free surface of the device; and annealing the resultant structure in a non-oxidizing atmosphere for a relatively brief period of time at a temperature in excess of said given deposition temperature and below about 500° C. whereby free valences at the Si-SiO 2 interface region are saturated with hydrogen and the density of fast surface states is reduced.
Claim 3
Dependent Claim
26 words
A process as defined in claim 1 wherein said nitrogen-containing gas is selected from the group consisting of N 2 , NH 3 and mixtures thereof.
Claim 4
Dependent Claim
23 words
A process as defined in claim 1 wherein the maximum atomic ratio of nitrogen to silicon in said amorphous layer is about 1.3.