US4330360A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Molecular beam deposition technique using gaseous sources of group V elements
Assignee: AT&T Inc
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Filing: 1980-07-21
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Granted: 1982-05-18
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Expires: 2000-07-21
Abstract
Abstract The invention is a method and apparatus for growing group III-V semiconductor layers by molecular beam deposition in which a gaseous source is used to form a molecular beam comprising M 2 or M 4 molecules, where M is a group V element. Arsine and phosphine may be decomposed in a high temperature leak-source to provide As 2 and P 2 molecular beams for molecular beam epitaxy of group III-V semiconductors such as GaAs and InP.
Inventors
- 👤 Glenn D. Kubiak
- 👤 Morton B. Panish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:40
CPC Classifications
C; C30; C30B; C30B23/00; C30B23/02; C30B23/06; C30B23/066; C30B25/00; C30B25/02; C30B29/00; C30B29/10; C30B29/40; H; H10; H10P; H10P14/00; H10P14/20; H10P14/22; H10P14/24; H10P14/29; H10P14/2901; H10P14/2907; H10P14/2909; H10P14/2911; H10P14/34; H10P14/3402; H10P14/3414; H10P14/3418; H10P14/3421; H10P14/36; Y; Y10; Y10S; Y10S148/00; Y10S148/065; Y10S148/169
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
218 words
A method for forming a group III-V semiconductor layer by molecular beam deposition including the steps of: directing a molecular beam, comprising at least one group III element, at a semiconductor body within an evacuable chamber; and simultaneously direction a group V molecular beam at said semiconductor body, thereby forming said group III-V semiconductor layer; said group V molecular beam being formed by a process including the steps of: introducing MH 3 gas, where M is at least one group V element, into a relatively high pressure chamber; decomposing said MH 3 gas in said high pressure chamber, thereby forming intermediate molecules having a plurality of M atoms; transporting said intermediate molecules resulting from said decomposition of MH 3 from said high pressure chamber into a relatively low pressure effusion chamber containing at least one baffle therein, said low pressure chamber being coupled to said high pressure chamber and to said evacuable chamber; and heating said intermediate molecules in said low pressure chamber and simultaneously causing molecules in said low pressure chamber to interact with said baffle so as to further transform said intermediate molecules into M 2 molecules and to form a group V molecular beam comprising M 2 molecules which emanates from said low pressure effusion chamber into said evacuable chamber and impinges on said body.
Claim 2
Independent Claim
218 words
A method for forming a group III-V semiconductor layer by molecular beam deposition including the steps of: directing a molecular beam, comprising at least one group III element, at a semiconductor body within an evacuable chamber; and simultaneously direction a group V molecular beam at said semiconductor body, thereby forming said group III-V semiconductor layer; said group V molecular beam being formed by a process including the steps of: introducing MH 3 gas, where M is at least one group V element, into a relatively high pressure chamber; decomposing said MH 3 gas in said high pressure chamber, thereby forming intermediate molecules having a plurality of M atoms; transporting said intermediate molecules resulting from said decomposition of MH 3 from said high pressure chamber into a relatively low pressure effusion chamber containing at least one baffle therein, said low pressure chamber being coupled to said high pressure chamber and to said evacuable chamber; and heating said intermediate molecules in said low pressure chamber and simultaneously causing molecules in said low pressure chamber to interact with said baffle so as to further transform said intermediate molecules into M 2 molecules and to form a group V molecular beam comprising M 2 molecules which emanates from said low pressure effusion chamber into said evacuable chamber and impinges on said body.
Claim 3
Dependent Claim
58 words
The method of claim 1 wherein said decomposing step is performed by: maintaining a region of said high pressure chamber at a sufficiently high temperature and pressure for the reaction 4MH.sub.3 →M.sub.4 +6H.sub.2 to occur, thereby forming intermediate molecules comprising M 4 ; said M 4 molecules being transformed to M 2 molecules in said low pressure chamber.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein said semiconductor body comprises InP, said group III element comprises indium, and MH 3 comprises phosphine gas.
Claim 5
Dependent Claim
22 words
The method of claim 3 wherein said semiconductor body is heated to a temperature at least as high as 600 degrees C.
Claim 6
Dependent Claim
23 words
The method of claim 1 wherein said semiconductor body comprises GaAs, said group III element comprises gallium, and MH 3 comprises arsine gas.
Claim 7
Dependent Claim
27 words
The method of claim 1 wherein MH 3 comprises a mixture of arsine and phosphine suitable for producing group III-V semiconductor layers having both arsenic and phosphorous.
Claim 8
Independent Claim
227 words
An apparatus for forming group III-V semiconductor layers comprising: an evacuable chamber; first means within said evacuable chamber for forming a group III molecular beam; and second means coupled to said evacuable chamber for forming a group V molecular beam; said second means comprising: a relatively high pressure chamber, a relatively low pressure effusion chamber coupled to said evacuable chamber and containing at least on baffle means therein third means coupling said low pressure chamber to said high pressure chamber, fourth means for introducing MH 3 gas into said high pressure chamber, said fifth means for heating said high and low pressure chambers; the temperature and pressure of said high pressure chamber being effective to decompose said MH 3 gas, thereby forming intermediate molecules having a plurality of M atoms; said third means, coupling said low pressure chamber to said high pressure chamber, being effective to transport said intermediate molecules resulting from the decomposition of MH 3 from said high pressure chamber to said low pressure chamber; the temperature and pressure of said low pressure chamber being effective to further transform said intermediate molecules into M 2 molecules and said baffle means being effective to broaden the distribution of molecules in said low pressure chamber thereby forming a group V molecular beam comprising M 2 molecules which emanates from said low pressure chamber into said evacuable chamber.
Claim 9
Independent Claim
227 words
An apparatus for forming group III-V semiconductor layers comprising: an evacuable chamber; first means within said evacuable chamber for forming a group III molecular beam; and second means coupled to said evacuable chamber for forming a group V molecular beam; said second means comprising: a relatively high pressure chamber, a relatively low pressure effusion chamber coupled to said evacuable chamber and containing at least on baffle means therein third means coupling said low pressure chamber to said high pressure chamber, fourth means for introducing MH 3 gas into said high pressure chamber, said fifth means for heating said high and low pressure chambers; the temperature and pressure of said high pressure chamber being effective to decompose said MH 3 gas, thereby forming intermediate molecules having a plurality of M atoms; said third means, coupling said low pressure chamber to said high pressure chamber, being effective to transport said intermediate molecules resulting from the decomposition of MH 3 from said high pressure chamber to said low pressure chamber; the temperature and pressure of said low pressure chamber being effective to further transform said intermediate molecules into M 2 molecules and said baffle means being effective to broaden the distribution of molecules in said low pressure chamber thereby forming a group V molecular beam comprising M 2 molecules which emanates from said low pressure chamber into said evacuable chamber.
Claim 10
Dependent Claim
54 words
The apparatus of claim 2 wherein said high pressure chamber comprises an alumina tube, said low pressure chamber comprises a portion of the bore of a cylindrical alumina resistance furance which overhangs one end of said alumina tube, and said fourth means for heating said high and low pressure chambers comprises said resistance furnace.
Claim 11
Dependent Claim
67 words
The apparatus of claim 8, wherein said third means, coupling said high and low pressure chambers, comprises a leaky end seal at said one end of said alumina tube formed by heating said one end of said tube until a seal is formed and then removing a sufficient amount of said seal to permit the transport of said intermediate molecules through pores or cracks in the seal.
References Cited (Backward Citations)
US4220488A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-05-17 | 1985-11-16 | 1986-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-05-17 | 1989-11-16 | 1990-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-05-17 | 1993-11-16 | 1994-05-18 | $7700.00 | Window Closed / Lapsed |