Heat sink laser diode array

Claim 2

An array of heat sink mounted laser diodes including: at least two heat sink mounted laser diode assemblies, each assembly being comprised of first and second mounting plates of a predetermined shape, each mounting plate having a solder pad of a predetermined shape thereon, a laser diode soldered between said first and second mounting plates to said solder pads, at least one spacer positioned between said mounting plates having a shape similar to said predetermined shape of said mounting plates and in addition having a cutout adjacent said solder pads, adhesive to retain said spacer to said mounting plates, orienting means and means for conducting coolant; a heat sink mounted laser diode assembly spacer positioned between said first and second mounting plates of adjacent assemblies, said heat sink mounted laser diode assembly spacer including means for conducting coolant between said adjacent assemblies; first and second contact plates, said first contact plate being positioned in electrical communication with said first mounting plate of one of said assemblies and said second contact plate being positioned in electrical communication with said second mounting plate of another one of said assemblies to form a series circuit to feed electrical power to said laser diodes; and means to retain said array in a unitary structure.

Claim 3

The array as defined in claim 1 wherein said means to retain said array in a unitary structure include: first and second end plates defining a fastener hole therethrough positioned about said first and second contact plates opposite from said assemblies; and a fastener, said assemblies, assembly spacers, and contact plates defining a fastener hole therethrough in alignment with said defined fastener holes in said first and second end plates through which said fastener extends to hold said first and second end plates about said array.

Claim 4

The array as defined in claim 2 wherein said fastener is electrically insolated from said first end plate.

Claim 5

The array as defined in claim 3 wherein said second end plate includes threads in the fastener hole defined therein, said fastener including threads for engagement with said fastener hole threads.

Claim 6

The array as defined in claim 1 wherein said orienting means of said assemblies include first and second cutouts, said first and second cutouts being different and said diodes being mounted with similar relative positioning from said first and second cutouts.

Claim 7

The array as defined in claim 5 wherein said assemblies are stacked in said array so that said diodes are positioned along a diode line when said first and second cutouts are aligned.

Claim 8

The array as defined in claim 6 wherein said assemblies are generally circular and disc shaped, said assemblies when stacked into said array defining a central axis thereof and said first and second cutouts are semicircular in shape and have different radii so that the proper polarity of said diodes in said array can be determined.

Claim 9

The array as defined in claim 7 wherein said diode line is offset from a line parallel to said axis of said array.

Claim 10

An array of heat sink mounted laser diodes including: at least two heat sink mounted laser diode assemblies, each assembly being comprised of first and second mounting plates of a predetermined shape, each mounting plate having a solder pad of a predetermined shape thereon, a laser diode soldered between said first and second mounting plates to said solder pads, at least one spacer positioned between said mounting plates having a shape similar to said predetermined shape of said mounting plates and in addition having a cutout adjacent said solder pads, adhesive to retain said spacer to said mounting plates, and orienting means; a heat sink mounted laser diode assembly spacer positioned between said first and second mounting plates of adjacent assemblies, said heat sink mounted laser diode assembly spacer including means for conducting coolant between said adjacent assemblies; first and second contact plates, said first contact plate being positioned in electrical communication with said first mounting plate of one of said assemblies and said second contact plate being positioned in electrical communication with said second mounting plate of another one of said assemblies to form a series circuit to feed electrical power to said laser diodes; and means to retain said array in a unitary structure including first and second end plates defining a fastener hole therethrough positioned about said first and second contact plates opposite from said assemblies, at least said first end plate including at least two coolant manifolds through which coolant can be fed, said first and second mounting plates and said spacer defining at least one coolant passageway therethrough adjacent said laser diode, said at least one coolant passageway being connected to said at least two coolant manifolds, and a fastener, said assemblies, assembly spacers, and contact plates defining a fastener hole therethrough in alignment with said defined fastener holes in said first and second end plates through which said fastener extends to hold said first and second end plates about said array.

Claim 11

An array of heat sink mounted laser diodes including: at least two heat sink mounted laser diode assemblies, each assembly being comprised of first and second mounting plates of a predetermined shape, each mounting plate having a solder pad of a predetermined shape thereon, a laser diode soldered between said first and second mounting plates to said solder pads, at least one spacer positioned between said mounting plates having a shape similar to said predetermined shape of said mounting plates and in addition having a cutout adjacent said solder pads, adhesive to retain said spacer to said mounting plates, and orienting means; a heat sink mounted laser diode assembly spacer positioned between said first and second mounting plates of adjacent assemblies, said heat sink mounted laser diode assembly spacer including means for conducting coolant between said adjacent assemblies; first and second contact plates, said first contact plate being positioned in electrical communication with said first mounting plate of one of said assemblies and said second contact plate being positioned in electrical communication with said second mounting plate of another one of said assemblies to form a series circuit to feed electrical power to said laser diodes; and means to retain said array in a unitary structure including first and second end plates defining a fastener hole therethrough positioned about said first and second contact plates opposite from said assemblies, at least said first end plate including at least two coolant manifolds through which coolant can be fed, said first and second mounting plates and said spacer defining at least one coolant passageway therethrough adjacent said laser diode, said at least one coolant passageway being connected to said at least two coolant manifolds, and a fastener, said assemblies, assembly spacers, and contact plates defining a fastener hole therethrough in alignment with said defined fastener holes in said first and second end plates through which said fastener extends to hold said first and second end plates about said array.

Claim 12

An array of heat sink mounted laser diodes including: at least two heat sink mounted laser diode assemblies, each assembly being comprised of first and second mounting plates of a predetermined shape, each mounting plate having a solder pad of a predetermined shape thereon, a laser diode soldered between said first and second mounting plates to said solder pads, at least one spacer positioned between said mounting plates having a shape similar to said predetermined shape of said mounting plates and in addition having a cutout adjacent said solder pads, adhesive to retain said spacer to said mounting plates, and orienting means; a heat sink mounted laser diode assembly spacer positioned between said first and second mounting plates of adjacent assemblies, said heat sink mounted laser diode assembly spacer including means for conducting coolant between said adjacent assemblies; first and second contact plates, said first contact plate being positioned in electrical communication with said first mounting plate of one of said assemblies and said second contact plate being positioned in electrical communication with said second mounting plate of another one of said assemblies to form a series circuit to feed electrical power to said laser diodes; and means to retain said array in a unitary structure including first and second end plates defining a fastener hole therethrough positioned about said first and second contact plates opposite from said assemblies, said first and second end plates each include at least one coolant manifold, said first and second mounting plates and said spacer defining at least one coolant passageway therethrough adjacent said laser diode, said at least one coolant passageway being connected to said at least one coolant manifold of both first and second end plates, and a fastener, said assemblies, assembly spacers, and contact plates defining a fastener hole therethrough in alignment with said defined fastener holes in said first and second end plates through which said fastener extends to hold said first and second end plates about said array.

Claim 13

An array of heat sink mounted laser diodes including: at least two heat sink mounted laser diode assemblies, each assembly being comprised of first and second mounting plates of a predetermined shape, each mounting plate having a solder pad of a predetermined shape thereon, a laser diode soldered between said first and second mounting plates to said solder pads, at least one spacer positioned between said mounting plates having a shape similar to said predetermined shape of said mounting plates and in addition having a cutout adjacent said solder pads, adhesive to retain said spacer to said mounting plates, and orienting means; a heat sink mounted laser diode assembly spacer positioned between said first and second mounting plates of adjacent assemblies, said heat sink mounted laser diode assembly spacer including means for conducting coolant between said adjacent assemblies; first and second contact plates, said first contact plate being positioned in electrical communication with said first mounting plate of one of said assemblies and said second contact plate being positioned in electrical communication with said second mounting plate of another one of said assemblies to form a series circuit to feed electrical power to said laser diodes; and means to retain said array in a unitary structure including first and second end plates defining a fastener hole therethrough positioned about said first and second contact plates opposite from said assemblies, said first and second end plates each include at least one coolant manifold, said first and second mounting plates and said spacer defining at least one coolant passageway therethrough adjacent said laser diode, said at least one coolant passageway being connected to said at least one coolant manifold of both first and second end plates, and a fastener, said assemblies, assembly spacers, and contact plates defining a fastener hole therethrough in alignment with said defined fastener holes in said first and second end plates through which said fastener extends to hold said first and second end plates about said array.