Capacitive network

Claim 2

A capacitive network comprising: a plurality of dielectric layers stacked facewise atop one another, each of said dielectric layers being comprised of a thin plate of dielectric material, said plate having edges; a series of grooves formed along at least one said edge of each of said dielectric layers, each of said grooves including a base portion opposite said one edge; said dielectric layers being shaped and relatively positioned so that a respective said groove of each said dielectric layer is aligned with the same respective said groove of all other said dielectric layers such that a plurality of groove columns are formed; a row of metal layers being supported on each said dielectric layer; said metal layers being arrayed and spaced apart along the same direction as said grooves; each said metal layers including a lead portion thereof extending to a respective said groove that is adjacent that said metal layer on said dielectric layer; said metal layers being shaped, spaced and positioned so that a respective said lead portion extends to only one of one set of alternate ones of said grooves; said metal layers being supported on their respective said dielectric layers such that between a said dielectric layer and its adjacent said dielectric layers, said dielectric material is interposed between the said metal layers on adjacent said dielectric layers; the respective said metal layers of adjacent said dielectric layers being placed so that said metal layers of adjacent said dielectric layers have overlapping surface areas and said metal layers being so placed that said lead portions of said metal layers of one said dielectric layer extend to a first set of alternate grooves and said lead portions of said metal layers of the adjacent said dielectric layer extend to a second alternate set of said grooves, wherein each said groove of said second set is between a respective pair of grooves of said first set of said alternate grooves; a plurality of conductor means each associated with a respective one of said groove columns, each said conductor means located in its associated groove column and extending across said base portion of said grooves and electrically joining all said lead portions extending to the grooves of said associated groove column; and a plurality of diodes connected in series between adjacent said grooves, said diodes having electric leads that are soldered at and to said conductor means located at the base of said grooves.

Claim 3

The capacitive network of claim 1, wherein all said metal layers generally have the same length along their respective said dielectric layers; said metal layers on adjacent said dielectric layers are staggered in position along said dielectric layers so that said first alternate grooves are contacted by said lead portions of said metal layers of said first dielectric layer and said second alternate grooves are contacted by said lead portions of said metal layers of said second dielectric layer.

Claim 4

The capacitive network of claim 2, wherein all said metal layers are shaped the same.

Claim 5

The capacitive network of claim 1 or 2, wherein said metal layers of each said dielectric layer are applied on one surface of the respective said dielectric layer.

Claim 6

The capacitive network of either of claims 1 or 2, wherein each said conductor means comprises a metallization layer extending across all said dielectric layers.

Claim 7

The capacitive network of either of claims 1 or 2, wherein along said edge of said dielectric layers, said grooves are uniformly spaced apart.

Claim 8

The capacitive network of any of claims 1, 2 or 3, wherein each said metal layer extends a distance along its said dielectric layer of about two said grooves.

Claim 9

The capacitive network of claim 7, wherein each said conductor means comprises a metallization layer extending across all said dielectric layers along said base of said grooves and said diode leads are soldered to respective said metallization layers.

Claim 10

A capacitive network comprising: a plurality of metal layer carrying dielectric layers, stacked facewise atop one another, each said dielectric layer being comprised of a thin plate of dielectric material, said plate having first and second opposite edges; a series of grooves formed along said first and second edges, each of said grooves including a base portion located between said first and second edges; said dielectric layers being shaped and relatively positioned so that a respective said groove of each said dielectric layers is aligned with the same respective said groove of all other said dielectric layers such that a plurality of groove columns are formed; two rows of metal layers being supported on each said dielectric layer; said metal layers of each said row thereof being arrayed and spaced apart along the same direction as said grooves; each said metal layer including a lead portion thereof extending to a respective said groove that is adjacent that said metal layer and that is at the said edge of said dielectric layer closer to the respective said row of said metal layers; said metal layers in each said row being shaped, spaced, and positioned so that a respective said lead portion extends to only one of one set of alternate ones of said grooves along the adjacent said edge of said dielectric layer; said metal layers being supported on their respective said dielectric layers such that between a said dielectric layer and the adjacent said dielectric layers, said dielectric material is interposed between the said metal layers on adjacent said dielectric layers; the respective said metal layers of adjacent said dielectric layers being placed so that said metal layers of the same respective said row thereof of adjacent said dielectric layers have overlapping surface areas and said metal layers in said row thereof being so placed that said lead portions of the said metal layers in one said row on one said dielectric layer contact a first set of alternate said grooves at the adjacent said edge and said lead portions of said metal layers in the same respective said row of the adjacent said dielectric layer contact a second alternate set of said grooves at the same adjacent said edge, wherein each said contact area of said second set is located between a respective pair of said first set of alternate grooves; a plurality of conductor means each associated with a respective one of said groove columns, each said conductor means located in its associated groove column and extending across said base portion of said grooves and electrically joining all said lead portions extending to the grooves of said associated groove column; and a respective diode connected between alternate groove columns located on opposite said edges of said stacked dielectric layer, said diodes having leads, said leads being soldered at and to said conductor means located at said base portion of said grooves.

Claim 11

A capacitive network comprising: a plurality of metal layer carrying dielectric layers, stacked facewise atop one another, each said dielectric layer being comprised of a thin plate of dielectric material, said plate having first and second opposite edges; a series of grooves formed along said first and second edges, each of said grooves including a base portion located between said first and second edges; said dielectric layers being shaped and relatively positioned so that a respective said groove of each said dielectric layers is aligned with the same respective said groove of all other said dielectric layers such that a plurality of groove columns are formed; two rows of metal layers being supported on each said dielectric layer; said metal layers of each said row thereof being arrayed and spaced apart along the same direction as said grooves; each said metal layer including a lead portion thereof extending to a respective said groove that is adjacent that said metal layer and that is at the said edge of said dielectric layer closer to the respective said row of said metal layers; said metal layers in each said row being shaped, spaced, and positioned so that a respective said lead portion extends to only one of one set of alternate ones of said grooves along the adjacent said edge of said dielectric layer; said metal layers being supported on their respective said dielectric layers such that between a said dielectric layer and the adjacent said dielectric layers, said dielectric material is interposed between the said metal layers on adjacent said dielectric layers; the respective said metal layers of adjacent said dielectric layers being placed so that said metal layers of the same respective said row thereof of adjacent said dielectric layers have overlapping surface areas and said metal layers in said row thereof being so placed that said lead portions of the said metal layers in one said row on one said dielectric layer contact a first set of alternate said grooves at the adjacent said edge and said lead portions of said metal layers in the same respective said row of the adjacent said dielectric layer contact a second alternate set of said grooves at the same adjacent said edge, wherein each said contact area of said second set is located between a respective pair of said first set of alternate grooves; a plurality of conductor means each associated with a respective one of said groove columns, each said conductor means located in its associated groove column and extending across said base portion of said grooves and electrically joining all said lead portions extending to the grooves of said associated groove column; and a respective diode connected between alternate groove columns located on opposite said edges of said stacked dielectric layer, said diodes having leads, said leads being soldered at and to said conductor means located at said base portion of said grooves.

Claim 12

The capacitive network of claim 9, wherein all said metal layers generally have the same length along their respective said dielectric layers; said metal layers on the same respective said row thereof on adjacent said dielectric layers are staggered in position along said dielectric layers so that said first alternate grooves along one said edge of said dielectric layer are contacted by said lead portions of said metal layers of said row thereof adjacent said one edge on said first dielectric layer and said second alternate grooves on said one edge are contacted by said lead portions of the same said row of said metal layers but on said second dielectric layer.

Claim 13

The capacitive network of claim 9, wherein said metal layers of each said dielectric layer are applied on one surface of the respective said dielectric layer.

Claim 14

The capacitive network of claim 9, wherein all said metal layers are shaped the same.

Claim 15

The capacitive network of claim 8, wherein each said conductor means comprises a metallization layer extending across all said dielectric layers.

Claim 16

The capacitive network of either of claims 9 or 10, wherein along the respective said edge of said dielectric layers, said grooves are uniformly spaced apart and along both said edges of said dielectric layer, said grooves are uniformly spaced apart.

Claim 17

The capacitive network of claim 9, wherein said diodes are in a continuous chain with respective electric leads from each said diode extending between adjacent said diodes, and said electric leads being connected to said conductor means located at said base portion of said grooves.

Claim 18

The capacitive network of either of claims 9 or 10, wherein each said metal layer extends a distance along its said dielectric layer of about two said grooves.