Signal detection method for IR detector having charge readout structure

Claim 3

A method as defined in claim 1 additionally characterized by the steps of: (a) injecting charge carriers of the first conductivity type into the detector; (b) then advancing said carriers through a region adjacent the upper surface of the substrate including the area above the detection region of said substrate whereby a number of said charge carriers are caused to flow to the lower surface of said substrate when said detection region has been raised to conduction by incident radiation; and (c) measuring the number of said charge carriers in the region adjacent the upper surface of the substrate after said carriers have been advanced through said region including the area above the detection region of said substrate.

Claim 4

In a detector of the type that includes a semiconductive substrate of a first conductivity type having an upper surface and a lower surface, a heavily doped region of said first conductivity type adjacent a portion of said upper surface defining a charge collection electrode and a heavily doped region of said first conductivity type adjacent said lower surface defining a backside electrode whereby there is formed a detection region within said substrate, and said detector additionally including a heavily doped region of a second conductivity type adjacent said upper surface of said substrate, the improvement comprising: (a) means for advancing charge carriers of the first conductivity type into said region defining a charge collection electrode; and (b) means for diverting the flow of said charge carriers from said region defining a charge collection electrode through said detection region to the lower surface of said substrate in proportion to the amount of radiation incident upon said detector.

Claim 5

In a detector of the type that includes a semiconductive substrate of a first conductivity type having an upper surface and a lower surface, a heavily doped region of said first conductivity type adjacent a portion of said upper surface defining a charge collection electrode and a heavily doped region of said first conductivity type adjacent said lower surface defining a backside electrode whereby there is formed a detection region within said substrate, and said detector additionally including a heavily doped region of a second conductivity type adjacent said upper surface of said substrate, the improvement comprising: (a) means for advancing charge carriers of the first conductivity type into said region defining a charge collection electrode; and (b) means for diverting the flow of said charge carriers from said region defining a charge collection electrode through said detection region to the lower surface of said substrate in proportion to the amount of radiation incident upon said detector.

Claim 6

A detector as defined in claim 3 wherein said means for advancing charge carriers comprises: (a) a source of charge carriers of said first conductivity type, said source being located in said region of a second conductivity type adjacent said upper surface of said substrate; and (b) means for directing the advance of charge carriers through said region defining a charge collection electrode.

Claim 7

A detector as defined in claim 4 further characterized in that said source of charge carriers additionally includes: (a) a highly doped region of said first conductivity type in said region of a second conductivity type adjacent said upper surface of said substrate; and (b) means for applying a bias voltage to said highly doped region so that said charge carriers are advanced from said highly doped region into said region of a second conductivity type adjacent said upper surface of said substrate.

Claim 8

A detector as defined in claim 4 further characterized in that said means for directing the advance of charge carriers additionally comprises: (a) first means for transferring charge from said source of charge carriers to the region above the detection region of said substrate; and (b) a second means for transferring said charge from the region above the detection region of said substrate to a utilization circuit.

Claim 9

A detector as defined in claim 6 further characterized in that each of said first means and said second means comprises a charge coupled device.

Claim 10

A radiation detector of the semiconductor materials variety comprising: (a) a P-type substrate having an upper surface and a lower surface; (b) a first P+ region adjacent a portion of said upper surface defining a charge collection electrode; (c) a second P+ region adjacent said lower surface defining a backside electrode whereby there is defined a detection region of said substrate which interlies said electrodes; (d) an N-type epitaxial region having an upper surface and a lower surface, the lower surface of said N-type region adjacent the upper surface of said substrate; (e) an N+ region adjacent portions of the lower surface of said epitaxial region and the upper surface of said substrate; (f) a charge coupled device structure overlying said epitaxial region for transferring charge carriers through said epitaxial region; and (g) a P+ region in said epitaxial region to provide a source of minority charge carriers.

Claim 11

A radiation detector of the semiconductor materials variety comprising: (a) a P-type substrate having an upper surface and a lower surface; (b) a first P+ region adjacent a portion of said upper surface defining a charge collection electrode; (c) a second P+ region adjacent said lower surface defining a backside electrode whereby there is defined a detection region of said substrate which interlies said electrodes; (d) an N-type epitaxial region having an upper surface and a lower surface, the lower surface of said N-type region adjacent the upper surface of said substrate; (e) an N+ region adjacent portions of the lower surface of said epitaxial region and the upper surface of said substrate; (f) a charge coupled device structure overlying said epitaxial region for transferring charge carriers through said epitaxial region; and (g) a P+ region in said epitaxial region to provide a source of minority charge carriers.

Claim 12

A radiation detector of the semiconductor materials variety comprising: (a) a p-type semiconductor substrate having an upper surface and a lower surface; (b) a first p+ region adjacent a portion of said upper surface, said first p+ region forming a charge collection electrode overlying a radiation detector region within the bulk of said substrate; (c) a second p+ region adjacent said lower surface, said second p+ region forming a backside detector electrode, said detector region lying between said electrodes; (d) an n-type epitaxial semiconductor region having an upper surface and a lower surface, said epitaxial region forming a layer that overlies the remaining portion of the upper surface of said subatrate and thereby surrounds said charge collection electrode; (e) an n+ region forming a charge coupled device shield layer lying between said epitaxial layer and said substrate and having a window therein, said charge collection electrode being located within said window and spaced apart from said shield layer; (f) a third p+ region located within and at the upper surface of said epitaxial layer to provide a source of minority charge carriers; (g) a charge coupled device structure including a charge injection group and a charge readout group formed in a dielectric layer overlying said epitaxial region for advancing charge carriers from said third p+ region through said epitaxial region and into said charge collection electrode by said charge injection group and from said charge collection electrode through said epitaxial layer to a utilization circuit by said charge readout group; and (h) a radiation shield layer overlying said dielectric layer and said charge coupled device structure contained formed therein, said shield layer having a detection aperture exposing a portion of said dielectric layer symmetrically overlying a portion of said charge collection electrode, thereby allowing incident radiation to reach the detector region after penetrating through the exposed portion of the said dielectric layer and the underlying portion of the said charge collection electrode.

Claim 13

A radiation detector of the semiconductor materials variety comprising: (a) a p-type semiconductor substrate having an upper surface and a lower surface; (b) a first p+ region adjacent a portion of said upper surface, said first p+ region forming a charge collection electrode overlying a radiation detector region within the bulk of said substrate; (c) a second p+ region adjacent said lower surface, said second p+ region forming a backside detector electrode, said detector region lying between said electrodes; (d) an n-type epitaxial semiconductor region having an upper surface and a lower surface, said epitaxial region forming a layer that overlies the remaining portion of the upper surface of said subatrate and thereby surrounds said charge collection electrode; (e) an n+ region forming a charge coupled device shield layer lying between said epitaxial layer and said substrate and having a window therein, said charge collection electrode being located within said window and spaced apart from said shield layer; (f) a third p+ region located within and at the upper surface of said epitaxial layer to provide a source of minority charge carriers; (g) a charge coupled device structure including a charge injection group and a charge readout group formed in a dielectric layer overlying said epitaxial region for advancing charge carriers from said third p+ region through said epitaxial region and into said charge collection electrode by said charge injection group and from said charge collection electrode through said epitaxial layer to a utilization circuit by said charge readout group; and (h) a radiation shield layer overlying said dielectric layer and said charge coupled device structure contained formed therein, said shield layer having a detection aperture exposing a portion of said dielectric layer symmetrically overlying a portion of said charge collection electrode, thereby allowing incident radiation to reach the detector region after penetrating through the exposed portion of the said dielectric layer and the underlying portion of the said charge collection electrode.