Imaging light-sensitive material with etchable opaque polyamide underlayer and light-sensitive resist overlayer

Claim 1

An imaging, light-sensitive material, comprising: a transparent substrate; an etchable, polyamide layer overlying said substrate, said polyamide layer having a thickness of from 2 to 11 microns and containing a dye or pigment so that said layer is opaque to actinic light, the film-forming component of said polyamide layer comprising alcohol-soluble polyamide as the major film-forming ingredient, said alcohol-soluble polyamide ingredient being one or a mixture of materials selected from the group consisting of nylon 6/66, nylon 6/66/610, nylon 6/66/610/612, nylon 6/66/12 and N-alkoxyalkyl polyamides wherein the alkoxy and alkyl groups each have from 1 to 8 carbon atoms and the degree of alkoxyalkylation is from 10 to 40%; a light-sensitive photoresist layer overlying said polyamide layer, said light-sensitive photoresist layer having a thickness of from 0.5 to 5 microns and containing a light-sensitive agent selected from the group consisting of azide compounds, o-quinone diazide compounds and organic solvent-soluble diazo compounds, said light-sensitive photoresist layer being capable of being transformed by imagewise exposure to actinic radiation into exposed and non-exposed areas which have different solubilities in an alkaline developer so that the areas which are more soluble in the alkaline developer can be removed to form a developed relief image whereupon the uncovered areas of said polyamide layer can be removed by an etching solution.