Hybrid integrated circuit unit

Claim 1

A hybrid integrated circuit unit comprising a hybrid integrated circuit assembly having a first base plate made of high heat conductive material, at least one semiconductor device mounted on the first base plate, a plurality of electrical conducting paths formed on the surface of the first base plate with a desired pattern extending to one of the peripheral edges of the base plate for providing connecting terminals, at least one resistor formed on the first base plate with the terminals of the resistor connected between two predetermined conducting paths and means for connecting the lead wires of the semiconductor device with the desired conducting paths, a printed circuit board having a second base plate of electrical insulating material disposed adjacent to the first base plate with the first peripheral edge of the second base plate opposite to said one of the peripheral edges of the first base plate, a plurality of electrical conducting paths one end of each of which is situated opposite to the corresponding connecting terminals of the first base plate on the first peripheral edge of the second base plate, the other end of at least one of the conducting paths is terminated at the second peripheral edge of the second base plate to form a connecting terminal for external connecting means and at least one discrete element located on the second base plate having connecting wires connected with the desired electric conducting paths, connecting means for connecting between the connecting terminals of the first base plate and the connecting terminals of the second base plate, and a casing means secured to both of the surfaces of the first base plate and the second base plate for connecting the first base plate and the second base plate to unify thereof.