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US4304698A Expired / Lapsed US ⏱️ 0.0 years remaining

Epoxy-modified polyolefin wax, process for preparation thereof and thermosetting resinous composition comprising said wax

Assignee: Mitsui Chemicals Inc
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Filing: 1980-06-17
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Granted: 1981-12-08
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Expires: 2000-06-17
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Abstract

Abstract An epoxy-modified polyolefin wax, which consists of a low-molecular-weight polyolefin grafted, copolymerized and modified with an epoxy group-containing, ethylenically unsaturated compound and has a number average molecular weight of from 600 to 10,000 and an epoxy equivalent of from 200 to 100,000, is disclosed. This epoxy-modified polyolefin wax is very valuable as a modifier for improving brittleness or adhesion (adhesiveness) in various resins, especially thermosetting resins.

Inventors

  • 👤 Akihiro Tachi
  • 👤 Toru Tomoshige
  • 👤 Harumi Furuta
  • 👤 Norio Matsuzawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 06:55
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08F; C08F255/00

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 66 words
A thermosetting resinous composition comprising a thermosetting resin and 0.5 to 70 parts by weight, per 100 parts by weight of said thermosetting resin, of an epoxy-modified polyolefin wax consisting of a low-molecular-weight polyolefin grafted, copolymerized and modified with an epoxy group-containing ethylenically unsaturated compound and having a number average molecular weight of from 600 to 10,000 and an epoxy equivalent of from 200 to 100,000.
Claim 2
Dependent Claim 66 words
A thermosetting resinous composition comprising a thermosetting resin and 0.5 to 70 parts by weight, per 100 parts by weight of said thermosetting resin, of an epoxy-modified polyolefin wax consisting of a low-molecular-weight polyolefin grafted, copolymerized and modified with an epoxy group-containing ethylenically unsaturated compound and having a number average molecular weight of from 600 to 10,000 and an epoxy equivalent of from 200 to 100,000.
Claim 3
Dependent Claim 39 words
A thermosetting resinous composition as set forth in claim 1 wherein the thermosetting resin is at least one member selected from the group consisting of phenolformaldehyde resins, melamine-formaldehyde resins, unreaformaldehyde resins, urethane resins, unsaturated polyester resins and epoxy resins.
Claim 4
Dependent Claim 29 words
A thermosetting resinous composition as set forth in claim 1 wherein the thermosetting resin is an epoxy resin composed of a condensate of a polyhydric phenol with an epihalohydrin.
Claim 5
Dependent Claim 20 words
A thermosetting resinous composition as set forth in claim 3 wherein the polyhydric phenol is bisphenol A or bisphenol F.
Claim 6
Dependent Claim 20 words
A thermosetting resinous composition as set forth in claim 3 wherein the polyhydric phenol is a novolak type phenol-formaldehyde resin.
Claim 7
Dependent Claim 35 words
The thermosetting resinous composition of claim 1 wherein the epoxy group-containing, ethylenically unsaturated compound is a compound of the formula ##STR3## wherein R stands for a monovalent hydrocarbon group containing a polymerizeable ethylenically unsaturated bond.
Claim 8
Dependent Claim 21 words
The thermosetting resinous composition of claim 6 wherein the compound of the formula is allyl glycidyl ether or 2-methylallyl glycidyl ether.
Claim 9
Dependent Claim 21 words
The thermosetting resinous composition of claim 3 wherein the compound of the formula is isopropenylphenyl glycidyl ether or allylphenol glycidyl ether.
Claim 10
Dependent Claim 50 words
The thermosetting resinous composition of claim 3 wherein the epoxy group-containing, ethylenically unsaturated compound is a compound of the formula ##STR4## wherein R is a monovalent hydrocarbon group having a polymerizeable ethylenically unsaturated bond, and R' is a hydrogen atom or an alkyl group having up to 4 carbon atoms.
Claim 11
Dependent Claim 17 words
The thermosetting resinous composition of claim 3 wherein the compound of the formula is 2-(allylphenyl) ethylene oxide.

References Cited (Backward Citations)

US3100758A Cited
US3453246A Cited
US3876609A Cited
US4245061A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-12-07 1985-06-08 1985-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-12-07 1989-06-08 1989-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-12-07 1993-06-08 1993-12-08 $7700.00 Window Closed / Lapsed

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