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US4303455A Expired / Lapsed US ⏱️ 0.0 years remaining

Low temperature microwave annealing of semiconductor devices

Assignee: Boeing North American Inc
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Filing: 1980-03-14
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Granted: 1981-12-01
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Expires: 2000-03-14
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Abstract

Abstract Briefly, and in general terms, the present invention provides a process for fabricating a semiconductor device, the device includes a semiconductor substrate having a major surface including an ion implanting region, wherein one fabrication step in the process subsequent to the formation of the ion implantation region is to direct a beam of microwave radiation at the device for annealing the ion implanted regions.

Inventors

  • 👤 Michael R. Splinter
  • 👤 Richard F. Palys
  • 👤 Moiz M. Beguwala

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 20:17
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/90

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 58 words
A process for fabricating a semiconductor device, the device comprising a semiconductor substrate having a major surface including an ion implanted region, characterized in that one fabrication step in the process subsequent to the formation of the ion implanted regions is to direct a beam of microwave radiation at said entire device for annealing the ion implanted regions.
Claim 2
Dependent Claim 58 words
A process for fabricating a semiconductor device, the device comprising a semiconductor substrate having a major surface including an ion implanted region, characterized in that one fabrication step in the process subsequent to the formation of the ion implanted regions is to direct a beam of microwave radiation at said entire device for annealing the ion implanted regions.
Claim 3
Dependent Claim 29 words
A process as defined in claim 1, wherein said one fabrication step anneals charged surface states so as to cause substitution of the impurity atoms in the silicon lattice.
Claim 4
Dependent Claim 30 words
A process as defined in claim 1, wherein said one fabrication step takes place at room temperature, and said beam of microwave radiation produces only localized heating of said device.
Claim 5
Dependent Claim 60 words
A process as defined in claim 1, wherein said microwave radiation is of a frequency in the range of 1 to 10 gigaHertz so that the electromagnetic field of the microwave radiation couples with the semiconductor lattice of the ion-implanted region causing lattice heating due to the release of phonons, the remaining non-ion-implanted silicon being essentially transparent to the radiation.
Claim 6
Dependent Claim 25 words
A process as defined in claim 1, wherein the step of directing a beam of microwave radiation comprises placing said device in a microwave oven.

References Cited (Backward Citations)

US3777099A Cited
US4147911A Cited
US4221948A Cited
US4240843A Cited
US4181538A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-11-30 1985-06-01 1985-12-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-11-30 1989-06-01 1989-12-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-11-30 1993-06-01 1993-12-01 $7700.00 Window Closed / Lapsed

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