Method for potting and encapsulating electronic circuits

Claim 1

A method of potting an electronic circuit utilized in high acceleration and high thermal cycling environments comprising the steps of: (a) selecting an uncured compound consisting essentially of thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh, curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure and which produces, in a vacuum of less than 10 -5 Torr, outgassing of a maximum of 0.1 percent volatile condensible materials and a maximum of 1.0 percent weight loss; (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight; (d) partially enclosing the electronic circuit with a form to limit the flow of potting material; (e) pouring the homogeneous mixture in the form to surround the electronic circuit with mixture; and (f) heating the mixture to the required temperature for curing in a temperature range of approximately 125° to 212° F. at approximately ambient pressure.

Claim 2

A method of potting an electronic circuit utilized in high acceleration and high thermal cycling environments comprising the steps of: (a) selecting an uncured compound consisting essentially of thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh, curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure and which produces, in a vacuum of less than 10 -5 Torr, outgassing of a maximum of 0.1 percent volatile condensible materials and a maximum of 1.0 percent weight loss; (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight; (d) partially enclosing the electronic circuit with a form to limit the flow of potting material; (e) pouring the homogeneous mixture in the form to surround the electronic circuit with mixture; and (f) heating the mixture to the required temperature for curing in a temperature range of approximately 125° to 212° F. at approximately ambient pressure.

Claim 3

A method of potting an electronic circuit utilized in high acceleration and high thermal cycling environments comprising the steps of: (a) providing an uncured compound consisting essentially of diglycidyl either of bis phenol A and 2-phenyl imidazole in a flowable powder form with a particle size in the range of approximately 60 mesh and 200 mesh and curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure; (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight; (d) partially enclosing the electronic circuit with a form to limit the flow of potting material; (e) pouring the homogeneous mixture in the form to surround the electronic circuit with mixture; and (f) heating the mixture to the required temperature for curing in a temperature range of approximately 125° to 212° F. at approximately ambient pressure.

Claim 4

A method of potting an electronic circuit utilized in high acceleration and high thermal cycling environments comprising the steps of: (a) providing an uncured compound consisting essentially of diglycidyl either of bis phenol A and 2-phenyl imidazole in a flowable powder form with a particle size in the range of approximately 60 mesh and 200 mesh and curable in a temperature range of approximately 125° F. to 212° F. at approximately ambient pressure; (b) selecting a quantity of hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns; (c) mixing said compound and said microspheres into a substantially homogeneous mixture consisting essentially of said compound and said microspheres in a predetermined ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight; (d) partially enclosing the electronic circuit with a form to limit the flow of potting material; (e) pouring the homogeneous mixture in the form to surround the electronic circuit with mixture; and (f) heating the mixture to the required temperature for curing in a temperature range of approximately 125° to 212° F. at approximately ambient pressure.