US4291364A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Air-cooled hybrid electronic package
Assignee: International Business Machines Corp
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Filing: 1979-12-26
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Granted: 1981-09-22
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Expires: 1999-12-26
Abstract
Abstract Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.
Inventors
- 👤 Frank E. Andros
- 👤 Ghazaros K. Kerjilian
- 👤 Bert E. Stevens
- 👤 Reinhold E. Tomek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 18:59
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20009; H05K7/20136; H05K7/20154
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
130 words
A hybrid electronic package assembly which comprises: a chamber housing a plurality of first circuit modules mounted on a planar printed circuit board; a plurality of printed circuit cards arranged vertically on opposite sides of said chamber and having a plurality of second circuit modules mounted thereon; a top air plenum located over said chamber and having bottom openings located directly over each of said first circuit modules; means supplying a flow of air into said top plenum, said air flowing through said openings and impinging against the top of each of said first circuit modules; and a back air plenum connected to the back of said chamber directing the air flow out of said chamber, through said back plenum, and across said circuit cards and said second circuit modules.
Claim 2
Dependent Claim
130 words
A hybrid electronic package assembly which comprises: a chamber housing a plurality of first circuit modules mounted on a planar printed circuit board; a plurality of printed circuit cards arranged vertically on opposite sides of said chamber and having a plurality of second circuit modules mounted thereon; a top air plenum located over said chamber and having bottom openings located directly over each of said first circuit modules; means supplying a flow of air into said top plenum, said air flowing through said openings and impinging against the top of each of said first circuit modules; and a back air plenum connected to the back of said chamber directing the air flow out of said chamber, through said back plenum, and across said circuit cards and said second circuit modules.
Claim 3
Dependent Claim
28 words
A hybrid electronic package assembly as defined in claim 1 wherein said first circuit modules are multi-layer ceramic modules and said second circuit modules are metallized ceramic modules.
Claim 4
Dependent Claim
145 words
A hybrid electronic package assembly which comprises: a chamber housing a plurality of multi-layer ceramic modules mounted on a planar printed circuit board; a plurality of printed circuit cards arranged vertically on opposite sides of said chamber and having a plurality of metallized ceramic modules mounted thereon; a top air plenum connected to said chamber and having bottom openings communicating with said chamber and located directly over each of said multi-layer ceramic modules; an air moving unit connected to said top air plenum supplying a flow of air into said top plenum, said air flowing through said bottom openings and impinging against the top of each of said multi-layer ceramic modules; and a back air plenum connected to the back of said chamber directing the air flow out of said chamber, through said back plenum, and serially across said circuit cards an metallized ceramic modules.
Claim 5
Dependent Claim
145 words
A hybrid electronic package assembly which comprises: a chamber housing a plurality of multi-layer ceramic modules mounted on a planar printed circuit board; a plurality of printed circuit cards arranged vertically on opposite sides of said chamber and having a plurality of metallized ceramic modules mounted thereon; a top air plenum connected to said chamber and having bottom openings communicating with said chamber and located directly over each of said multi-layer ceramic modules; an air moving unit connected to said top air plenum supplying a flow of air into said top plenum, said air flowing through said bottom openings and impinging against the top of each of said multi-layer ceramic modules; and a back air plenum connected to the back of said chamber directing the air flow out of said chamber, through said back plenum, and serially across said circuit cards an metallized ceramic modules.
Claim 6
Dependent Claim
36 words
A hybrid electronic package assembly as defined in claim 3 wherein a front panel on said chamber causes the impinged air on the multi-layer ceramic modules to turn around and flow into said back air plenum.
References Cited (Backward Citations)
DE2138376A1
Cited
US3923466A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-09-21 | 1985-03-23 | 1985-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-09-21 | 1989-03-23 | 1989-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-09-21 | 1993-03-23 | 1993-09-22 | $7700.00 | Window Closed / Lapsed |