US4282759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for non-destructive testing of beam-lead integrated circuit connections
Assignee: United States Department of the Army
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Filing: 1979-12-26
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Granted: 1981-08-11
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Expires: 1999-12-26
Abstract
Abstract A method and apparatus for non-destructive testing of beam-lead integratedircuit connections in which each of the leads from a chip beam-lead device has a pull tab made interval therewith with a weakened area and means for connecting a pull tool thereto to test the bond strength between the individual lead and the conductor to which the lead is bonded to determine if a predetermined bond exist between the lead and the conductor.
Inventors
- 👤 Jimmy D. Merrell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 14:50
CPC Classifications
G; G01; G01N; G01N19/00; G01N19/04; G01L; G01L5/00; G01L5/0028; G01L5/0033; G01M; G01M99/00; H; H10; H10P; H10P74/00; H10P74/20; H10P74/203
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
105 words
A method for testing individual beam-leads of a chip beam-leaded device that has a multiplicity of beam-leads bonded to respective conductors that are mounted on a substrate and with each of said beam-leads having a pull tab with a weakened area, said method comprising connecting a pull hook of a pull tester to said pull tab by inserting said hook through an opening in said pull tab and then exerting a predetermined pull force from said pull tester to said pull tab until said pull tab is broken at said weakened area to determine that the individual beam-lead is sufficiently bonded to its respective conductor.
Claim 2
Independent Claim
105 words
A method for testing individual beam-leads of a chip beam-leaded device that has a multiplicity of beam-leads bonded to respective conductors that are mounted on a substrate and with each of said beam-leads having a pull tab with a weakened area, said method comprising connecting a pull hook of a pull tester to said pull tab by inserting said hook through an opening in said pull tab and then exerting a predetermined pull force from said pull tester to said pull tab until said pull tab is broken at said weakened area to determine that the individual beam-lead is sufficiently bonded to its respective conductor.
Claim 3
Dependent Claim
135 words
An integrated circuit device comprising a substrate material having a plurality of gold conductors on a surface thereof and a chip beam-lead device having a plurality of beam-leads with each of said beam-leads being connected to a respective one of said gold conductors by diffusion bonding, each said beam-lead having a tab end thereon that is spaced from said chip beam-lead device and from said diffusion bonding to allow said pull tab to be bent upward, each said beam-lead pull tab having a weakened area between a pulling end of said pull tab and said diffusion bonding between said beam-lead and said gold conductor, and said pull tab having an opening therethrough for insertion of a pulling device to test the bond strength between the respective beam-lead and the conductor to which it is bonded.
Claim 4
Dependent Claim
135 words
An integrated circuit device comprising a substrate material having a plurality of gold conductors on a surface thereof and a chip beam-lead device having a plurality of beam-leads with each of said beam-leads being connected to a respective one of said gold conductors by diffusion bonding, each said beam-lead having a tab end thereon that is spaced from said chip beam-lead device and from said diffusion bonding to allow said pull tab to be bent upward, each said beam-lead pull tab having a weakened area between a pulling end of said pull tab and said diffusion bonding between said beam-lead and said gold conductor, and said pull tab having an opening therethrough for insertion of a pulling device to test the bond strength between the respective beam-lead and the conductor to which it is bonded.
References Cited (Backward Citations)
US3634930A
Cited
US3945248A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-08-10 | 1985-02-09 | 1985-08-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-08-10 | 1989-02-09 | 1989-08-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-08-10 | 1993-02-09 | 1993-08-11 | $7700.00 | Window Closed / Lapsed |