US4281038A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-conductive substrate for a printed circuit and method of manufacture
Assignee: Preh GmbH
•
Filing: 1979-12-10
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Granted: 1981-07-28
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Expires: 1999-12-10
Abstract
Abstract The disclosure is of a substrate or supporting board for supporting printedircuits and the method of its manufacture. The boards of the invention are preferably made of a high-temperature resistant thermoplastic, sensitized to receive a printed circuit element by the dispersion of coated iron or copper particles in the thermoplastic matrix. The coating is a bonding assistant.
Inventors
- 👤 Peter Ambros
- 👤 Hermann Geyer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 01:42
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0236; H05K2203/00; H05K2203/11; H05K2203/1157; H05K2203/12; H05K2203/125; H05K3/105; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24479; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/254; Y10T428/256; Y10T428/259; Y10T428/29; Y10T428/2982; Y10T428/2991; Y10T428/2993; Y10T428/2995; Y10T428/2998
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
79 words
An electrically non-conductive base for a printed circuit, which comprises: a high temperature resistant thermoplastic selected from the group consisting of polyphenyloxide, polyphenylsulfide, polyimide and polyethersulfone having dispersed therein a plurality of discrete particles of a material selected from the group consisting of iron, copper, compounds of iron, compounds of copper and mixtures thereof; said particles bearing a coating of a bonding assistant selected from the group consisting of a silicone resin, an organic silane and a silane ester.
Claim 2
Dependent Claim
79 words
An electrically non-conductive base for a printed circuit, which comprises: a high temperature resistant thermoplastic selected from the group consisting of polyphenyloxide, polyphenylsulfide, polyimide and polyethersulfone having dispersed therein a plurality of discrete particles of a material selected from the group consisting of iron, copper, compounds of iron, compounds of copper and mixtures thereof; said particles bearing a coating of a bonding assistant selected from the group consisting of a silicone resin, an organic silane and a silane ester.
Claim 3
Dependent Claim
23 words
The base of claim 1 wherein said particles are present in a proportion of 20 to 80 percent by weight of the thermoplastic.
Claim 4
Dependent Claim
23 words
The base of claim 1 wherein said particles are present in a proportion of 40 to 70 percent by weight of the thermoplastic.
Claim 5
Dependent Claim
35 words
The base of claim 1 wherein the bonding assistant is a silicone resin which is admixed in the mixture of the support material/catalyst in a proportion of 0.5 to 10% by weight of the mixture.
Claim 6
Dependent Claim
26 words
The base of claim 1 having unitary protrusions in the form of pedestals, side walls, snap hooks and assembly aids for construction elements on its surface.
Claim 7
Dependent Claim
14 words
The base of claim 1 having a printed circuit on at least one surface.
Claim 8
Independent Claim
81 words
A method of making a non-conductive base for a printed circuit, which comprises; at least partially encapsulating particles of a material selected from the group consisting of copper, iron, copper compounds and iron compounds in a bonding assistant selected from the group consisting of a silicone resin, an organic silane and a silane ester; admixing the encapsulated particles in a thermoplastic resin selected from the group consisting of polyphenyloxide, polyphenylsulfide, polyimide and polyethersulfone; and forming the base in a desired shape.
Claim 9
Independent Claim
81 words
A method of making a non-conductive base for a printed circuit, which comprises; at least partially encapsulating particles of a material selected from the group consisting of copper, iron, copper compounds and iron compounds in a bonding assistant selected from the group consisting of a silicone resin, an organic silane and a silane ester; admixing the encapsulated particles in a thermoplastic resin selected from the group consisting of polyphenyloxide, polyphenylsulfide, polyimide and polyethersulfone; and forming the base in a desired shape.
Claim 10
Dependent Claim
29 words
The method of claim 7 wherein encapsulating is carried out by dispersing the particles in a volatile carrier; mixing the dispersion with the bonding assistant; and evaporating the carrier.
Claim 11
Dependent Claim
10 words
The method of claim 8 wherein the carrier is toluene.
Claim 12
Dependent Claim
14 words
The method of claim 8 wherein circuit holes are made in the forming step.
Claim 13
Dependent Claim
15 words
The method of claim 8 wherein mixing is in a dry blend which is granulated.
Claim 14
Dependent Claim
14 words
The method of claim 11 wherein granulation is by extrusion of the dry blend.
Claim 15
Dependent Claim
20 words
The method of claim 8 wherein forming is by one of injection molding process, press molding method or extrusion molding.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-07-27 | 1985-01-26 | 1985-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-07-27 | 1989-01-26 | 1989-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-07-27 | 1993-01-26 | 1993-07-28 | $7700.00 | Window Closed / Lapsed |