Explosion proof vibration resistant flat package semiconductor device

Claim 1

A flat package semiconductor device comprising, in combination, a hollow electrically insulating cylinder, a pair of opposed electrodes disposed on opposite end surfaces of said hollow electrically insulating cylinder, a semiconductor element sandwiched between said pair of cylindrical electrodes, a thin metallic annulus hermetically connected to each of said end surfaces of said hollow electrically insulating cylinder and supporting each of said electrodes to form a hermetic enclosure with said hollow electrically insulating cylinder and said electrodes, said electrically insulating cylinder having an internal inwardly extending circumferential protrusion between said electrodes, a circumferential protrusion within said hermetic enclosure radially extending from each of said electrodes opposite said internal protrusion of said hollow electrically insulating cylinder and spaced axially therefrom, and means for isolating physically said circumferential protrusions and said semiconductor element from said electrically insulating cylinder and each of said thin metallic annuli, said means being maintained in a mechanically compressed state due to a pressure applied across said electrodes and said means maintaining said internal protrusion of said electrically insulating cylinder between said circumferential protrusions of said electrodes and permitting said electrodes to be displaced with respect to said electrically insulating cylinder axially thereof.