Patent US2892334A successfully refreshed from Google Patents.
US4263341A
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US
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Processes of making two-sided printed circuit boards, with through-hole connections
Assignee: AT&T Inc
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Filing: 1978-12-19
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Granted: 1981-04-21
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Expires: 1998-12-19
Abstract
Abstract Printed circuits, and techniques and materials for making printed circuits by prior-known metal-spraying techniques, particularly for making two-sided boards with metal through-hole connects. Preferably, a primer coating (40) of a metal such as zinc is sprayed onto one surface of the substrate, through a chrome-plated metal stencil (30), after which a conductive coating (13 or 16), such as copper or nickel, is sprayed onto the zinc coating to form the conductive patterns. Through hole connections (20) are fabricated by forming tapered holes (50), and placing a removable stop member (51) against the narrow end of the hole before spraying the patterns. The first pattern (16) is then sprayed on from the wide end of the hole (50) so that a portion (52) of the material coats the walls of the hole and forms a bridging strip (53) across the narrow end of the hole. After this, the stop (51) is removed, and the other side (14) is sprayed to form a conductive portion (16B) contacting the bridging strip (53) to make the through connect.
Inventors
- 👤 Gerald J. Martyniak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4076; C; C23; C23C; C23C4/00; C23C4/01; H05K1/00; H05K1/02; H05K1/09; H05K3/10; H05K3/14; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/09; H05K2201/09818; H05K2201/09827; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/1344; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
185 words
An improved process of making a printed circuit board, of the type wherein a conductive material is sprayed through a stencil to form a printed circuit pattern on a surface of an insulating substrate, wherein the improvement comprises: forming at least one frustoconical hole through the substrate; blocking the narrow end of the hole with a removable stop member; then spraying a first circuit pattern on a first surface of the substrate, the first surface being that containing the wide end of the hole, so that a portion of the pattern coats the walls of the hole and forms a strip of the material across the narrow end of the hole against the stop member; next, removing the stop member; and then spraying a second circuit pattern on the opposite side of the substrate so that a portion of the second pattern overlaps and makes electrical contact with the strip of material formed across the narrow end of the hole in the prior spraying step, whereby a conductive through-hole connection is made between the first circuit pattern and the second pattern via the tapered hole.
Claim 2
Dependent Claim
185 words
An improved process of making a printed circuit board, of the type wherein a conductive material is sprayed through a stencil to form a printed circuit pattern on a surface of an insulating substrate, wherein the improvement comprises: forming at least one frustoconical hole through the substrate; blocking the narrow end of the hole with a removable stop member; then spraying a first circuit pattern on a first surface of the substrate, the first surface being that containing the wide end of the hole, so that a portion of the pattern coats the walls of the hole and forms a strip of the material across the narrow end of the hole against the stop member; next, removing the stop member; and then spraying a second circuit pattern on the opposite side of the substrate so that a portion of the second pattern overlaps and makes electrical contact with the strip of material formed across the narrow end of the hole in the prior spraying step, whereby a conductive through-hole connection is made between the first circuit pattern and the second pattern via the tapered hole.
Claim 3
Dependent Claim
35 words
A process as recited in claim 1, wherein the conductive patterns comprise first a primer coating of zinc, followed by a conductive layer of a higher-melting conductive metal or metals deposited on the zinc coating.
Claim 4
Dependent Claim
22 words
A process as recited in claim 2, wherein the substrate is a thermoplastic material and the higher-melting metal is copper or nickel.
Claim 5
Dependent Claim
35 words
A process as recited in claim 1, wherein the coatings are flame sprayed onto the substrate through a stencil having a chromium surface and mechanically fastened to the surface of the substrate to be sprayed.
Claim 6
Dependent Claim
15 words
A process as recited in claim 4, wherein the stencil comprises a chromium-plated metal stencil.
Claim 7
Dependent Claim
18 words
A process as recited in claim 5, wherein the stencil has a thickness of five to twenty mils.
Claim 8
Dependent Claim
19 words
A process as recited in claim 6, wherein the stencil is made of chrome-plated brass, phosphor bronze, or steel.
Claim 9
Dependent Claim
212 words
An improved process of making a printed circuit board, of the type wherein conductive metal is sprayed through a stencil to form a printed-circuit pattern on a surface of a planar insulating substrate, wherein the improvement comprises: (a) forming a plurality of frustoconical holes through a molded thermoplastic substrate at locations where through connects are desired between circuits to be formed on opposite surfaces of the substrate; (b) blocking the narrow end of each hole with a removable stop member, (c) flame spraying a first metal circuit pattern on a first surface of the substrate, the first surface being that containing the wide end of each hole, so that a portion of the metal pattern coats the walls of each hole and forms a strip of the metal across the narrow end of each hole against the stop member; (d) removing the stop member after step (c); and (e) flame spraying a second metal circuit pattern on the opposite surface of the substrate so that a portion of the second pattern overlaps and makes electrical contact with the strip of metal formed across the narrow end of each hole in step (c), whereby a conductive through-hole connection is made between the first circuit pattern and the second pattern via each through hole.
Claim 10
Dependent Claim
212 words
An improved process of making a printed circuit board, of the type wherein conductive metal is sprayed through a stencil to form a printed-circuit pattern on a surface of a planar insulating substrate, wherein the improvement comprises: (a) forming a plurality of frustoconical holes through a molded thermoplastic substrate at locations where through connects are desired between circuits to be formed on opposite surfaces of the substrate; (b) blocking the narrow end of each hole with a removable stop member, (c) flame spraying a first metal circuit pattern on a first surface of the substrate, the first surface being that containing the wide end of each hole, so that a portion of the metal pattern coats the walls of each hole and forms a strip of the metal across the narrow end of each hole against the stop member; (d) removing the stop member after step (c); and (e) flame spraying a second metal circuit pattern on the opposite surface of the substrate so that a portion of the second pattern overlaps and makes electrical contact with the strip of metal formed across the narrow end of each hole in step (c), whereby a conductive through-hole connection is made between the first circuit pattern and the second pattern via each through hole.
Claim 11
Dependent Claim
34 words
A process as recited in claim 8, wherein the conductive coating comprises first a primer coating of zinc, followed by an outer conductive layer of copper or nickel flame sprayed onto the zinc coating.
Claim 12
Dependent Claim
25 words
A process as recited in claim 8 or claim 9, wherein the stop member has a polytetrafluoroethylene surface at the region blocking each through hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-04-20 | 1984-10-20 | 1985-04-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-04-20 | 1988-10-20 | 1989-04-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-04-20 | 1992-10-20 | 1993-04-21 | $7700.00 | Window Closed / Lapsed |